APTC90DAM60CT1G

APTC90DAM60CT1G
APTC90DAM60CT1G – Rev 2 October, 2012
www.microsemi.com
4
7
Typical CoolMOS Performance Curve
0.9
0.7
0.5
0.3
0.1
0.05
Single Pulse
0
0.05
0.1
0.15
0.2
0.25
0.3
0.00001 0.0001 0.001 0.01 0.1 1 10
rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
5V
6V
0
80
160
240
0 5 10 15 20
V
DS
, Drain to Source Voltage (V)
I
D
, Drain Current (A)
Low Voltage Output Characteristics
V
GS
=20, 8V
0
10
20
30
40
50
60
25 50 75 100 125 150
T
C
, Case Temperature (°C)
I
D
, DC Drain Current (A)
DC Drain Current vs Case Temperature
900
925
950
975
1000
25 50 75 100 125
T
J
, Junction Temperature (°C)
Breakdown Voltage vs Temperature
BV
DSS
, Drain to Source Breakdown
Voltage
Maximum Safe Operating Area
10 ms
100 µs
1
10
100
1000
1 10 100 1000
V
DS
, Drain to Source Voltage (V)
I
D
, Drain Current (A)
limited b
y
R
DS
on
Single pulse
T
J
=150°C
T
C
=25°C
Ciss
Crss
Coss
1
10
100
1000
10000
100000
0 25 50 75 100 125 150 175 200
V
DS
, Drain to Source Voltage (V)
C, Capacitance (pF)
Capacitance vs Drain to Source Voltage
0
2
4
6
8
10
0 100 200 300 400 500 600
Gate Charge (nC)
V
GS
, Gate to Source Voltage (V)
Gate Charge vs Gate to Source Voltage
V
DS
=400V
I
D
=52A
T
J
=25°C
APTC90DAM60CT1G
APTC90DAM60CT1G – Rev 2 October, 2012
www.microsemi.com
5
7
Hard
switching
ZCS
ZVS
0
100
200
300
400
20 25 30 35 40 45 50
I
D
, Drain Current (A)
Frequency (kHz)
Operating Frequency vs Drain Current
V
DS
=600V
D=50%
R
G
=3.8
T
J
=125°C
T
C
=75°C
Switching Energy vs Current
Eon
Eoff
0
1
2
3
4
10 20 30 40 50 60 70 80
I
D
, Drain Current (A)
Eon and Eoff (mJ)
V
DS
=600V
R
G
=3.8
T
J
=125°C
L=100µH
ON resistance vs Temperature
0.5
1.0
1.5
2.0
2.5
3.0
25 50 75 100 125 150
T
J
, Junction Temperature (°C)
R
DS(on)
, Drain to Source ON resistance
(Normalized)
Switching Energy vs Gate Resistance
Eon
Eoff
0
1
2
3
4
5
6
0 5 10 15 20
Gate Resistance (Ohms)
Switching Energy (mJ)
V
DS
=600V
I
D
=52A
T
J
=125°C
L=100µH
APTC90DAM60CT1G
APTC90DAM60CT1G – Rev 2 October, 2012
www.microsemi.com
6
7
Typical CR1 SiC Diode Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
0.9
0.7
0.5
0.3
0.1
0.05
Single Pulse
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.00001 0.0001 0.001 0.01 0.1 1 10
Rectangular Pulse Duration (Seconds)
Thermal Impedance (°C/W)
Forward Characteristics
T
J
=25°C
T
J
=75°C
T
J
=125°C
T
J
=175°C
0
10
20
30
40
50
60
0 0.5 1 1.5 2 2.5 3 3.5
V
F
Forward Voltage (V)
I
F
Forward Current (A)
Reverse Characteristics
T
J
=25°C
T
J
=75°C
T
J
=125°C
T
J
=175°C
0
75
150
225
300
400 600 800 1000 1200 1400 1600
V
R
Reverse Voltage (V)
I
R
Reverse Current (µA)
Capacitance vs.Reverse Voltage
0
300
600
900
1200
1500
1800
2100
1 10 100 1000
V
R
Reverse Voltage
C, Capacitance (pF)
“COOLMOS™ comprise a new family of transistors developed by Infineon Technologies AG. “COOLMOS” is a trademark of Infineon
Technologies AG”.

APTC90DAM60CT1G

Mfr. #:
Manufacturer:
Microchip / Microsemi
Description:
Discrete Semiconductor Modules Power Module - SiC
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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