DS563F2 13
CS5381
DC ELECTRICAL CHARACTERISTICS
(GND = 0 V, all voltages with respect to ground. MCLK=12.288 MHz; Master Mode)
8. Power-Down Mode is defined as RST
= Low with all clocks and data lines held static.
9. Valid with the recommended capacitor values on FILT+ and VQ as shown in the Typical Connection
Diagram.
DIGITAL CHARACTERISTICS
THERMAL CHARACTERISTICS
Parameter Symbol Min Typ Max Unit
Power Supply Current VA = 5 V
(Normal Operation) VL,VD = 5 V
VL,VD = 3.3 V
I
A
I
D
I
D
-
-
-
36
36
24
43
46
28
mA
mA
mA
Power Supply Current VA = 5 V
(Power-Down Mode) (Note 8) VL,VD = 5 V
I
A
I
D
-
-
100
100
-
-
uA
uA
Power Consumption
(Normal Operation) VA, VL, VD = 5 V
VA = 5 V; VL, VD = 3.3 V
(Power-Down Mode)
-
-
-
-
-
-
360
260
1
445
307
-
mW
mW
mW
Power Supply Rejection Ratio (1 kHz) (Note 9)
PSRR - 65 - dB
V
Q
Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
-
-
2.5
25
0.01
-
-
-
V
kΩ
mA
Filt+ Nominal Voltage
Output Impedance
Maximum allowable DC current source/sink
-
-
-
5
4.5
0.01
-
-
-
V
kΩ
mA
Parameter Symbol Min Typ Max Units
High-Level Input Voltage (% of VL)
V
IH
70% - - V
Low-Level Input Voltage (% of VL)
V
IL
--30%V
High-Level Output Voltage at I
o
= 100 µA (% of VL)
V
OH
70% - - V
Low-Level Output Voltage at I
o
= 100 µA (% of VL)
V
OL
--15%V
OVFL Current Sink
I
ovfl
--4.0mA
Input Leakage Current
I
in
-10 - 10 µA
Parameter Symbol Min Typ Max Unit
Allowable Junction Temperature
--135°C
Junction to Ambient Thermal Impedance
(Multi-layer PCB) TSSOP
(Multi-layer PCB) SOIC
(Single-layer PCB) TSSOP
(Single-layer PCB) SOIC
θ
JA-TM
θ
JA-SM
θ
JA-TS
θ
JA-SS
-
-
-
-
70
60
105
80
-
-
-
-
°C/W
°C/W
°C/W
°C/W
