I
NTEGRATED
C
IRCUITS
D
IVISION
4 www.ixysic.com R03
IX2113
1.5 Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage
parameters are absolute voltages referenced to COM. The thermal resistance and power dissipation ratings are
measured under board-mounted and still-air conditions.
1.6 Recommended Operating Conditions
For proper operation, the device should be used within the recommended conditions. The V
S
and V
SS
offset ratings
are tested with all supplies biased at a 15V differential.
Parameter Symbol Min Max Units
High-Side Floating Supply Voltage
V
B
-0.3 700 V
High-Side Floating Supply Offset Voltage
V
S
V
B
-20 V
B
+0.3
V
High-Side Floating Output Voltage
V
HO
V
S
-0.3 V
B
+0.3
V
Low-Side Fixed Supply Voltage
V
CC
-0.3 20 V
Low-Side Output Voltage
V
LO
-0.3
V
CC
+0.3
V
Logic Supply Voltage
V
DD
-0.3
V
SS
+20
V
Logic Supply Offset Voltage
V
SS
V
CC
-20 V
CC
+0.3
V
Logic Input Voltage (HIN, LIN, SD)
V
IN
V
SS
-0.3 V
DD
+0.3
V
Allowable Offset Supply Voltage Transient
dV
S
/dt
-50V/ns
Package Power Dissipation @ T
A
25°C
16-Pin SOIC
PD
-1.25
W
14-Pin DIP
1.6
Thermal Resistance, Junction to Ambient 16-Pin SOIC
R
JA
-100
°C/W
14-Pin DIP
75
Junction Temperature
T
J
-150°C
Storage Temperature
T
S
-55 150
°C
Lead Temperature (Soldering, 10 Seconds)
T
L
-300°C
Parameter Symbol Min Max Units
High-Side Floating Supply Absolute Voltage
V
B
V
S
+10 V
S
+20
V
High-Side Floating Supply Offset Voltage
V
S
-600
High-Side Floating Output Voltage
V
HO
V
S
V
B
Low-Side Fixed Supply Voltage
V
CC
10 20
Low-Side Output Voltage
V
LO
0
V
CC
Logic Supply Voltage
V
DD
V
SS
+3 V
SS
+20
Logic Supply Offset Voltage
V
SS
-5 5
Logic Input Voltage (HIN, LIN, SD)
V
IN
V
SS
V
DD
Ambient Temperature
T
A
-40 +125 °C
