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LTC4301IMS8#PBF

P1-P3P4-P6P7-P9P10-P12
10
LTC4301
4301fb
APPLICATIO S I FOR ATIO
WUUU
R1
10k
R3
5.1k
R5
10k
R2
5.1k
V
CC2
V
CC1
V
CC4
V
CC3
R4
10k
R7
10k
R8
10k
CS
SDAIN
SCLIN
LTC4301
GND
V
CC
0.01µF
SDAOUT
SCLOUT
READY
SCL1
TO OTHER
SYSTEM 1
DEVICES
SDA1
0.01µF
R6
10k
LTC4301
SDAIN
SCLIN
4301 F07
SCLOUT
SDAOUT
READY
LONG
DISTANCE
BUS
V
CC5
SCL2
SDA2
TO OTHER
SYSTEM 2
DEVICES
GND
V
CC
CS
R1
10k
V
CC
(BUS)
R2
10k
R
DROP
V
CC
SDA
SCL
4301 F06
R4
10k
R5
10k
R3
10k
SDAIN
CS
SCLIN
LTC4301
V
CC
GND
SCL2
SDA2
SDAOUT
SCLOUT
READY
0.01µF
Figure 6. Repeater/Bus Extender Application
Figure 7. System with V
CC
Voltage Droop
11
LTC4301
4301fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
PACKAGE DESCRIPTIO
MS8 Package
8-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1660)
DD Package
8-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1698)
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
14
85
PIN 1
TOP MARK
(NOTE 6)
0.200 REF
0.00 – 0.05
(DD8) DFN 1203
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.5 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
MSOP (MS8) 0204
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.18
(.007)
0.254
(.010)
1.10
(.043)
MAX
0.22 – 0.38
(.009 – .015)
TYP
0.127 ± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.65
(.0256)
BSC
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
12
3
4
4.90
± 0.152
(.193 ± .006)
8
7
6
5
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
0.52
(.0205)
REF
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.42 ± 0.038
(.0165 ± .0015)
TYP
0.65
(.0256)
BSC
12
LTC4301
4301fb
© LINEAR TECHNOLOGY CORPORATION 2004
LT 0806 REV B • PRINTED IN THE USA
RELATED PARTS
Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900
●
FAX: (408) 434-0507
●
www.linear.com
PART NUMBER DESCRIPTION COMMENTS
LTC1380/LTC1393 Single-Ended 8-Channel/Differential 4-Channel Analog Low R
ON
: 35Ω Single-Ended/70Ω Differential,
Mux with SMBus Interface Expandable to 32 Single or 16 Differential Channels
LTC1427-50 Micropower, 10-Bit Current Output DAC Precision 50µA ± 2.5% Tolerance Over Temperature,
with SMBus Interface 4 Selectable SMBus Addresses, DAC Powers up at Zero or Midscale
LTC1623 Dual High Side Switch Controller with SMBus Interface 8 Selectable Addresses/16-Channel Capability
LTC1663 SMBus Interface 10-Bit Rail-to-Rail Micropower DAC DNL < 0.75LSB Max, 5-Lead SOT-23 Package
LTC1694/LTC1694-1 SMBus Accelerator Improved SMBus/I
2
C Rise-Time,
Ensures Data Integrity with Multiple SMBus/I
2
C Devices
LT1786F SMBus Controlled CCFL Switching Regulator 1.25A, 200kHz, Floating or Grounded Lamp Configurations
LTC1695 SMBus/I
2
C Fan Speed Controller in ThinSOT
TM
0.75Ω PMOS 180mA Regulator, 6-Bit DAC
LTC1840 Dual I
2
C Fan Speed Controller Two 100µA 8-Bit DACs, Two Tach Inputs, Four GPI0
LTC4300A-1/LTC4300A-2 Hot Swappable 2-Wire Bus Buffer Isolates Backplane and Card Capacitances
LTC4301L Hot Swappable 2-Wire Bus Buffer Allows Bus Pull-Up Voltages as Low as 1V on SDAIN and SCLIN
with Low Voltage Level Translation
LTC4302-1/LTC4302-2 Addressable 2-Wire Bus Buffer Address Expansion, GPIO, Software Controlled
ThinSOT is a trademark of Linear Technology Corporation.
U
TYPICAL APPLICATIO
10k10k
5V
BACK_SCL
BACKPLANE
CONNECTOR
CARD
BACK_SDA
3.3V
10k
5V
CS
CARD_SCL
CARD_SDA
SCLOUTSCLIN
SDAOUTSDAIN
GND
V
CC
LTC4301
READY
0.01µF
4301 TA01
10k 10k
STAGGERED CONNECTOR
FROM
MICROPROCESSOR
Figure 8. System with Active Connection Control
P1-P3P4-P6P7-P9P10-P12

LTC4301IMS8#PBF

Mfr. #:
Buy LTC4301IMS8#PBF
Manufacturer:
Analog Devices Inc.
Description:
Interface - Signal Buffers, Repeaters Supply Independent I2C Bus Buffer
Lifecycle:
New from this manufacturer.
Delivery:
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