Philips Semiconductors Product data
74F82710-bit buffer/line driver, non-inverting (3-State)
2004 Jan 21
5
DC ELECTRICAL CHARACTERISTICS
Over recommended operating free-air temperature range unless otherwise noted.
LIMITS
MIN TYP
2
MAX
V
CC
= MIN,
± 10% V
CC
2.4 – – V
p
IL
=
,
V
IH
= MIN
OH
= –
± 5% V
CC
2.4 3.3 – V
OH
-
v
u
u
v
V
CC
= MIN,
± 10% V
CC
2.0 – – V
IL
=
,
V
IH
= MIN
OH
= –
± 5% V
CC
2.0 – – V
p
V
CC
= MIN,
± 10% V
CC
– – 0.55 V
OL
-
v
u
u
v
IL
=
,
V
IH
= MIN
OL
=
± 5% V
CC
– 0.42 0.55 V
V
IK
Input clamp voltage V
CC
= MIN; I
I
= I
IK
– –0.73 –1.2 V
I
I
Input current at maximum input voltage V
CC
= 0 V; V
I
= 7.0 V – – 100 µA
I
IH
HIGH-level input current V
CC
= MAX; V
I
= 2.7 V – – 20 µA
I
IL
LOW-level input current V
CC
= MAX; V
I
= 0.5 V – – –20 µA
I
OZH
Off-state output current,
HIGH voltage applied
V
CC
= MAX; V
O
= 2.7 V
– –
50 µA
I
OZL
Off-state output current,
LOW voltage applied
V
CC
= MAX; V
O
= 0.5 V
– –
–50 µA
I
OS
Short circuit output current
3
V
CC
= MAX –100 – –225 mA
I
CCH
– 50 70 mA
I
CC
Supply current (total)
I
CCL
V
CC
= MAX
– 70 100 mA
I
CCZ
– 60 90 mA
NOTES:
1. For conditions shown as MIN or MAX, use the appropriate value specified under operating conditions for the applicable type.
2. All typical values are at V
CC
= 5 V, T
amb
= 25 °C.
3. Not more than one output should be shorted at one time. For testing I
OS
, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged
shorting of a HIGH output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests.
In any sequence of parameter tests, I
OS
tests should be performed last.
