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PDTC123EEF,115
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
2004 Aug 06
9
NXP Semico
nductors
Product dat
a sheet
NPN resistor-equipped transistors;
R1 = 2.2 k
Ω,
R2 = 2.2 k
Ω
PDTC123E series
UNIT
A
1
max.
A
(1)
bb
1
e
1
eL
L
1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
0.50
0.46
0.20
0.12
0.55
0.47
0.03
0.62
0.55
0.35
0.65
DIMENSIONS (mm are the original dimensions)
Note
1. Including plating thickness
0.30
0.22
0.30
0.22
SOT883
SC-101
03-02-05
03-04-03
DE
1.02
0.95
L
E
2
3
1
b
b
1
A
1
A
D
L
1
0
0.5
1 mm
scale
L
eadless ultra small plastic package; 3 solder lands; body 1.0 x 0.6 x 0.5 mm
SOT88
3
e
e
1
2004 Aug 06
10
NXP Semico
nductors
Product dat
a sheet
NPN resistor-equipped transistors;
R1 = 2.2 k
Ω,
R2 = 2.2 k
Ω
PDTC123E series
UNIT
A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
5.2
5.0
b
0.48
0.40
c
0.45
0.38
D
4.8
4.4
d
1.7
1.4
E
4.2
3.6
L
14.5
12.7
e
2.54
e
1
1.27
L
1
(1)
max.
2.5
b
1
0.66
0.55
DIMENSIONS (mm are the original dimensions)
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
SOT54
TO-92
SC-43A
04-06-28
04-11-16
A
L
0
2.5
5 mm
scale
b
c
D
b
1
L
1
d
E
Plastic single-ended leaded (through hole) package; 3 leads
SOT5
4
e
1
e
1
2
3
2004 Aug 06
11
NXP Semico
nductors
Product dat
a sheet
NPN resistor-equipped transistors;
R1 = 2.2 k
Ω,
R2 = 2.2 k
Ω
PDTC123E series
UNIT
A
1
max.
b
p
cD
E
e
1
H
E
L
p
Qw
v
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
04-11-04
06-03-16
IEC
JEDEC
JEITA
mm
0.1
0.48
0.38
0.15
0.09
3.0
2.8
1.4
1.2
0.95
e
1.9
2.5
2.1
0.55
0.45
0.1
0.2
DIMENSIONS (mm are the original dimensions)
0.45
0.15
SOT23
TO-236AB
b
p
D
e
1
e
A
A
1
L
p
Q
detail X
H
E
E
w
M
v
M
A
B
A
B
0
1
2 mm
scale
A
1.1
0.9
c
X
12
3
Plastic surface-mounted package; 3 leads
SOT2
3
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
PDTC123EEF,115
Mfr. #:
Buy PDTC123EEF,115
Manufacturer:
NXP Semiconductors
Description:
TRANS PREBIAS NPN 250MW SC89
Lifecycle:
New from this manufacturer.
Delivery:
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