2004 Aug 06 4
NXP Semiconductors Product data sheet
NPN resistor-equipped transistors;
R1 = 2.2 kΩ, R2 = 2.2 kΩ
PDTC123E series
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Refer to standard mounting conditions.
2. Reflow soldering is the only recommended soldering method.
3. Refer to SOT883 standard mounting conditions; FR4 with 60 μm copper strip line.
TYPE NUMBER
PACKAGE
NAME DESCRIPTION VERSION
PDTC123EE − plastic surface mounted package; 3 leads SOT416
PDTC123EEF − plastic surface mounted package; 3 leads SOT490
PDTC123EK − plastic surface mounted package; 3 leads SOT346
PDTC123EM − leadless ultra small package; 3 solder lands; body 1.0 × 0.6 ×
0.5 mm
SOT883
PDTC123ES − plastic single-ended leaded (through hole) package; 3 leads SOT54
PDTC123ET − plastic surface mounted package; 3 leads SOT23
PDTC123EU − plastic surface mounted package; 3 leads SOT323
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
V
CBO
collector-base voltage open emitter − 50 V
V
CEO
collector-emitter voltage open base − 50 V
V
EBO
emitter-base voltage open collector − 10 V
V
I
input voltage
positive − +12 V
negative − −10 V
I
O
output current (DC) − 100 mA
I
CM
peak collector current − 100 mA
P
tot
total power dissipation T
amb
≤ 25 °C
SOT54 note 1 − 500 mW
SOT23 note 1 − 250 mW
SOT346 note 1 − 250 mW
SOT323 note 1 − 200 mW
SOT416 note 1 − 150 mW
SOT490 notes 1 and 2 − 250 mW
SOT883 notes 2 and 3 − 250 mW
T
stg
storage temperature −65 +150 °C
T
j
junction temperature − 150 °C
T
amb
operating ambient temperature −65 +150 °C
