19
Figure 6. SFP host board mechanical layout.
2x 1.7
20x 0.5 ± 0.03
0.9
2 ± 0.005 TYP.
0.06 L A S B S
10.53
11.93
20
10
11
PIN 1
20
10
11
PIN 1
0.8
TYP.
10.93
9.6
2x 1.55 ± 0.05
3.2
5
LEGEND
1. PADS AND VIAS ARE CHASSIS GROUND
2. THROUGH HOLES, PLATING OPTIONAL
3. HATCHED AREA DENOTES COMPONENT
AND TRACE KEEPOUT (EXCEPT
CHASSIS GROUND)
4. AREA DENOTES COMPONENT
KEEPOUT (TRACES ALLOWED)
DIMENSIONS ARE IN MILLIMETERS
4
3
2
1
1
26.8
5
11x 2.0
10
3x
41.3
42.3
B
10x 1.05 ± 0.01
16.25
REF.
14.25
11.08
8.58
5.68
2.0
11x
11.93
9.6
4.8
8.48
A
3.68
SEE DETAIL 1
9x 0.95 ± 0.05
2.5
7.17.2
2.5
10
3x
34.5
16.25
MIN. PITCH
Y
X
DETAIL 1
0.85 ± 0.05
PCB
EDGE
0.06 L A S B S
0.1 L A S B S
0.1 L X A S
0.1 L X A S
0.1 S X Y
Figure 7. SFP assembly drawing.
Customer Manufacturing Processes
This module is pluggable and is not designed for aqueous wash, IR re ow, or wave soldering processes.
41.78 ± 0.5
3.5 ± 0.3
1.7 ± 0.9
Tcase REFERENCE POINT
PCB
10 REF
(to PCB)
0.4 ± 0.1
(below PCB)
10.4 ± 0.1
15.25 ± 0.1
16.25 ± 0.1 MIN. PITCH
DIMENSIONS ARE IN MILLIMETERS
11.73 REF
CAGE ASSEMBLY
9.8 MAX.
15 MAX.
For product information and a complete list of distributors, please go to our website: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. Obsoletes AV01-0436EN
AV02-0435EN - September12, 2012

AFCT-57R5ATPZ

Mfr. #:
Manufacturer:
Broadcom / Avago
Description:
TXRX OPT SFP LC 4/2/1GBD LC CONN
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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