MC145010ED Datasheet MCZ145010EG, MCZ145010EGR2, MC145010EGR2 | P10-P12

Sensors

10 Freescale Semiconductor

MC145010

Figure 9. Recommended PCB Layout

Table 5. Configuration of Pins in the Calibration Mode

Description Pin Comment

I/O 7 Disabled as an output. Forcing this pin high places the photo amp output on pin 1 or 2, as determined by

Low-Supply Trip. The amp's output appears as pulses and is referenced to V

Low-Supply Trip 15 If the I/O pin is high, pin 15 controls which gain capacitor is used. Low: normal gain, amp output on pin 1.

High: supervisory gain, amp output on pin 2.

Feedback 10 Driving this input high enables hysteresis (10% gain increase) in the photo amp; pin 15 must be low.

OSC 12 Driving this input high brings the internal clock high. Driving the input low brings the internal clock low. If

desired, the RC network for the oscillator may be left intact; this allows the oscillator to run similar to the

normal mode of operation.

Silver 9 This pin becomes the smoke comparator output. When the OSC pin is toggling, positive pulses indicate that

smoke has been detected. A static low level indicates no smoke.

Brass 8 This pin becomes the smoke integrator output. That is, two consecutive smoke detections are required for

ON (static high level) and two consecutive no-detections for “off” (static low level).

Pin 8

Pin 16

Pin 9

Pin 1

R11

MOUNTED IN

CHAMBER

R10

Do Not Run Any

Additional Traces

In This Region

R14

NOTES:

Illustration is bottom view of layout using a Dip. Top view for SOIC layout is mirror image. Optional potentionmeter R9 is not illustrated.

Drawing is not to scale.

Leads on D2, R11, R8, and R10 and their associated traces must be kept as short as possible. This practice minimizes noise pick-up.

Pin 3 must be decoupled from all other traces.

Sensors

Freescale Semiconductor 11

MC145010

CASE 648-08

ISSUE R

16-LEAD PLASTIC DIP

NOTES:

DIMENSIONS ARE IN MILLIMETERS.

DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

DATUMS A AND B TO BE DETERMINED AT THE

PLANE WHERE THE BOTTOM OF THE LEADS

EXIT THE PLASTIC BODY.

THIS DIMENSION DOES NOT INCLUDE MOLD

FLASH, PROTRUSION OR GATE BURRS. MOLD

FLASH, PROTRUSTION OR GATE BURRS SHALL

NOT EXCEED 0.15mm PER SIDE. THIS

DIMENSION IS DETERMINED AT THE PLANE

WHERE THE BOTTOM OF THE LEADS EXIT

THE PLASTIC BODY.

THIS DIMENSION DOES NOT INCLUDE

INTER-LEAD FLASH OR PROTRUSIONS.

INTER-LEAD FLASH AND PROTRUSIONS

SHALL NOT EXCEED 0.25mm PER SIDE. THIS

DIMENSION IS DETERMINED AT THE PLANE

WHERE THE BOTTOM OF THE LEADS EXIT

THE PLASTIC BODY.

THIS DIMENSION DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL NOT CAUSE

THE LEAD WIDTH TO EXCEED 0.62mm.

SEATING

PLANE

0.49

16X

0.25 AT

0.35

2.65

2.35

0.25

0.10

16X

0.1 T

1.27

14X

10.55

10.05

0.25 B

10.45

10.15

7.6

7.4

PIN 1 INDEX

PIN'S

NUMBER

0.75

X45

0.25

7˚

1.0

0.4

0˚

0.32

0.23

SECTION A-A

CASE 751G-04

ISSUE D

16-LEAD SOIC

NOTES:

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

CONTROLLING DIMENSION: INCH.

DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

DIMENSION B DOES NOT INCLUDE MOLD FLASH.

ROUNDED CORNERS OPTIONAL.

-A-

16 PL

SEATING

PLANE

916

-T-

0.25 (0.010) T

DIM MIN MAX MIN MAX

MILLIMETERSINCHES

A 0.740 0.770 18.80 19.55

B 0.250 0.270 6.35 6.85

C 0.145 0.175 3.69 4.44

D 0.015 0.021 0.39 0.53

F 0.040 0.70 1.02 1.77

G 0.100 BSC 2.54 BSC

H 0.050 BSC 1.27 BSC

J 0.008 0.015 0.21 0.38

K 0.110 0.130 2.80 3.30

L 0.295 0.305 7.50 7.74

M 010010

S 0.020 0.040 0.51 1.01

STYLE 1:

PIN 1. CATHODE

2. CATHODE

3. CATHODE

4. CATHODE

5. CATHODE

6. CATHODE

7. CATHODE

8. CATHODE

9. ANODE

10. ANODE

11. ANODE

12. ANODE

13. ANODE

14. ANODE

15. ANODE

16. ANODE

STYLE 2:

PIN 1. COMMON DRAIN

2. COMMON DRAIN

3. COMMON DRAIN

4. COMMON DRAIN

5. COMMON DRAIN

6. COMMON DRAIN

7. COMMON DRAIN

8. COMMON DRAIN

9. GATE

10. SOURCE

11. GATE

12. SOURCE

13. GATE

14. SOURCE

15. GATE

16. SOURCE

PACKAGE DIMENSIONS

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MC145010

Rev. 7.0

04/2006

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P1-P3 P4-P6 P7-P9 P10-P12

MC145010ED

Mfr. #:

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Manufacturer:

NXP Semiconductors

Description:

IC SMOKE DETECT PHOTOELEC 16-DIP

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MC145010ED

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