Philips Semiconductors
BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 3 of 13
9397 750 07708
© Philips Electronics N.V. 2000. All rights reserved.
V
GS
10 V
Fig 1. Normalized total power dissipation as a
function of solder point temperature.
Fig 2. Normalized continuous drain current as a
function of solder point temperature.
T
sp
=25°C; I
DM
is single pulse
Fig 3. Safe operating area; drain and peak currents as a function of drain source voltage.
03aa17
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
P
der
T
sp
(
o
C)
(%)
03aa25
0
20
40
60
80
100
120
0 25 50 75 100 125 150 175
I
der
T
sp
(
o
C)
(%)
P
der
P
tot
P
tot 25 C
°
()
----------------------
100%×=
I
D
I
D
I
D25C
°
()
-------------------
100%×=
03ac55
10
-3
10
-2
10
-1
1
10
10
-1
1 10
10
2
10
3
V
DS
(V)
I
D
(A)
D.C.
100 ms
10 ms
R
DSon
= V
DS
/ I
D
1 ms
t
p
= 10 µs
100 µs
t
p
t
p
T
P
t
T
δ =
Philips Semiconductors
BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 4 of 13
9397 750 07708
© Philips Electronics N.V. 2000. All rights reserved.
7. Thermal characteristics
7.1 Transient thermal impedance
Table 4: Thermal characteristics
Symbol Parameter Conditions Value Unit
R
th(j-sp)
thermal resistance from junction to solder point mounted on a metal clad substrate; Figure 4 150 K/W
R
th(j-amb)
thermal resistance from junction to ambient mounted on a printed circuit board;
minimum footprint
350 K/W
T
sp
=25°C
Fig 4. Transient thermal impedance from junction to solder point as a function of pulse duration.
03ac54
1
10
10
2
10
3
10
-5
10
-4
10
-3
10
-2
10
-1
1 10
t
p
(s)
Z
th(j-sp)
(K/W)
0.1
0.2
0.05
0.02
δ = 0.5
single pulse
t
p
t
p
T
P
t
T
δ =
Philips Semiconductors
BSH114
N-channel enhancement mode field effect transistor
Product specification Rev. 01 — 09 November 2000 5 of 13
9397 750 07708
© Philips Electronics N.V. 2000. All rights reserved.
8. Characteristics
Table 5: Characteristics
T
j
=25
°
C unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
Static characteristics
V
(BR)DSS
drain-source breakdown voltage I
D
= 250 µA; V
GS
=0V
T
j
=25°C 100 130 V
T
j
= 55 °C95−−V
V
GS(th)
gate-source threshold voltage I
D
= 1 mA; V
DS
=V
GS
; Figure 9
T
j
=25°C 234V
T
j
= 150 °C 1.2 −−V
T
j
= 55 °C −−6V
I
DSS
drain-source leakage current V
DS
= 100 V; V
GS
=0V
T
j
=25°C 125µA
T
j
= 150 °C 4 250 µA
I
GSS
gate-source leakage current V
GS
= ±20 V; V
DS
=0V 10 100 nA
R
DSon
drain-source on-state resistance V
GS
= 10 V; I
D
= 0.5 A; Figure 7 and 8
T
j
=25°C 400 500 m
T
j
= 150 °C −−1.15
Dynamic characteristics
g
fs
forward transconductance V
DS
=20V; I
D
= 0.5 A; Figure 11 0.5 1.2 S
Q
g(tot)
total gate charge I
D
= 0.5 A; V
DD
=80V; V
GS
=10V;Figure 14 4.6 nC
Q
gs
gate-source charge 0.8 nC
Q
gd
gate-drain (Miller) charge 2.1 nC
C
iss
input capacitance V
GS
=0V; V
DD
= 25 V; f = 1 MHz; Figure 12 138 pF
C
oss
output capacitance 21 pF
C
rss
reverse transfer capacitance 12 pF
t
d(on)
turn-on delay time V
DD
=50V; R
D
= 100 ; V
GS
=10V;R
G
=6Ω− 6 ns
t
r
rise time 13 ns
t
d(off)
turn-off delay time 8 ns
t
f
fall time 5 ns
Source-drain (reverse) diode
V
SD
source-drain (diode forward) voltage I
S
= 0.85 A; V
GS
=0V;Figure 13 0.84 1 V
t
rr
reverse recovery time I
S
= 0.5 A; dI
S
/dt = 100 A/µs;
V
GS
=0V;V
DS
=30V
24 ns
Q
r
recovered charge 37 nC

BSH114,215

Mfr. #:
Manufacturer:
Nexperia
Description:
MOSFET TAPE7 PWR-MO
Lifecycle:
New from this manufacturer.
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