Philips Semiconductors Product data
PCA9510; PCA9511
Hot swappable I
2
C and
SMBus bus buffer
2003 Dec 18
10
R7
10 k
R8
10 k
R6
10 k
I
2
C SYSTEM 2
V
CC
SCL1
SDA1
TO OTHER
SYSTEM 2
DEVICES
SW02122
R3
5.1 k
R2
5.1 k
C1
0.01 µF
R5
10 k
ENABLE
V
CC
SDAOUT
SDAIN
READY
SCLOUT
SCLIN
GND
R4
10 k
R1
10 k
I
2
C SYSTEM 1
SCL1
SDA1
TO OTHER
SYSTEM 1
DEVICES
V
CC
= 5 V OR 3.3 V
LONG
DISTANCE
BUS
ENABLE
V
CC
SDAOUT
SDAIN
READY
SCLOUT
SCLIN
GND
C2
0.01 µF
R9
10 k
R9
10 k
NOTE:
1. See Application Note AN255 - I
2
C Repeaters, Hubs, and Expanders for more information on other devices better optimized for long distance
transmission of the I
2
C or SMBus.
Figure 10. Repeater/bus extender application using the PCA9510 and PCA9511
R5
10 k
R4
10 k
C2
0.01 µF
R6
10 k
ENABLE
V
CC
SDAOUT
SDAIN
READY
SCLOUT
SCLIN
GND
R2
10 k
R1
10 k
SCL
SDA
V
CC
SCL2
SDA2
R
DROP
V
CC_LOW
SW02123
R3
10 k
Figure 11. System with disparate V
CC
voltages
Philips Semiconductors Product data
PCA9510; PCA9511
Hot swappable I
2
C and
SMBus bus buffer
2003 Dec 18
11
ABSOLUTE MAXIMUM RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134).
Voltages with respect to pin GND.
LIMITS
SYMBOL PARAMETER MIN. MAX. UNIT
V
CC
Supply voltage range V
CC
-0.5 +7 V
V
n
SDAIN, SCLIN, SDAOUT, SCLOUT, READY, ENABLE -0.5 +7 V
T
opr
Operating temperature range -40 +85 °C
T
stg
Storage temperature range -65 +125 °C
T
sld
Lead soldering temperature (10 sec max) +300 °C
T
j(max)
Maximum junction temperature +125 °C
NOTE:
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the
device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
Philips Semiconductors Product data
PCA9510; PCA9511
Hot swappable I
2
C and
SMBus bus buffer
2003 Dec 18
12
ELECTRICAL CHARACTERISTICS
V
CC
= 2.7 V to 5.5 V; T
amb
= -40 to +85 °C unless otherwise noted.
LIMITS
SYMBOL PARAMETER TEST CONDITIONS
MIN. TYP. MAX.
UNIT
Power supply
V
CC
Supply voltage Note 1. 2.7 5.5 V
I
CC
Supply current V
CC
= 5.5 V;
V
SDAIN
= V
SCLIN
= 0 V; Note 1.
2.8 6 mA
I
CC(sd)
Supply current in shut-down mode V
ENABLE
= 0 V, all other pins at
V
CC
or GND
200 µA
Start-up circuitry
V
PRE
Precharge voltage SDA, SCL floating; Note 1. 0.8 1.0 1.2 V
V
EN
Enable threshold voltage 0.5 x V
CC
0.7 x V
CC
V
V
DIS
Disable threshold voltage 0.3 x V
CC
0.5 x V
CC
V
I
EN
Enable input current Enable from 0 V to V
CC
±0.1 ±1 µA
t
EN
Enable delay or initialization time 130 µs
t
IDLE
Bus idle time Note 1. 50 120 250 µs
t
DIS
Disable time, ENABLE to Ready 15 ns
t
STOP
SDA
IN
to READY deLay after
STOP
Note 7 1.3 µs
t
READY
SCL
OUT
/SDA
OUT
to READY Note 7 1.2 µs
I
OFF
Ready off state leakage current V
EN
= V
CC
±0.3 µA
C
i
ENABLE capacitance V
I
= V
CC
or GND, Note 4 2 pF
C
O
Ready capacitance V
I
= V
CC
or GND, Note 4 2 pF
V
OL(READY)
LOW-level output voltage on
READY pin
I
pull-up
= 3 mA; V
EN
= V
CC;
Note
1.
0.4 V
Rise time accelerators
I
PULLUPAC
Transient boosted pull-up current Positive transition on SDA, SCL,
V
CC
= 2.7 V;
Slew rate = 1.25 V/µs Note 2.
1 2 mA
Input-output connection
V
OS
Input-output offset voltage 10 k to V
CC
on SDA, SCL;
V
CC
= 3.3 V; Note 1; Note 3.
0 65 150 mV
f
SCL_SDA
operating frequency 0 400 kHz
t
PLH
SCL to SCL and SDA to SDA 10 k to V
CC
, C
L
= 100 pF each
side
25 ns
t
PHL
SCL to SCL and SDA to SDA 10 k to V
CC
, C
L
= 100 pF each
side
380 ns
C
IN
Digital input capacitance Note 4 10 pF
V
OL
LOW-level output voltage Input = 0 V,
SDA, SCL pins, I
SINK
= 3 mA;
V
CC
= 2.7 V; Note 1
0 0.4 V
I
LI
Input leakage current SDA, SCL pins = V
CC
= 5.5 V ±5 µA

PCA9511D,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
IC BUFFER I2C/SMBUS HOTSWAP 8SO
Lifecycle:
New from this manufacturer.
Delivery:
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