NCP1521B
http://onsemi.com
14
PACKAGE DIMENSIONS
UDFN6 2x2, 0.65P
CASE 517AB−01
ISSUE B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.47
0.40
0.65
1.70
2.30
1
DIMENSIONS: MILLIMETERS
6X
0.95
PITCH
6X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
C
A
SEATING
PLANE
D
B
E
0.10 C
A3
A
A1
2X
2X
0.10 C
DIM
A
MIN MAX
MILLIMETERS
0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.25 0.35
D 2.00 BSC
D2 1.50 1.70
0.80 1.00
E
2.00 BSC
E2
e 0.65 BSC
K
0.25 0.35
L
PIN ONE
REFERENCE
0.08 C
0.10 C
6X
A0.10 C
L
e
E2
b
B
3
6
6X
1
K
4
6X
6X
0.05 C
4X
D2
BOTTOM VIEW
0.20 ---
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