Data Sheet HMC1131
Rev. A | Page 5 of 14
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
NIC
2
GND
3
RFIN
4
GND
5
NIC
6
NIC
18
NIC
17
GND
16
RFOUT
15
GND
14
NIC
13
NIC
24
NIC
23
V
DD
1
22
V
DD
2
21
V
DD
3
20
V
DD
4
19
NIC
7
NIC
8
V
GG
1
9
NIC
10
NIC
11
V
GG
2
12
NIC
HMC1131
TOP VIEW
(Not to Scale)
NOTES
1. NIC = NOT INTERNALLY CONNECTED.
2. THE EXPOSED PAD MUST BE CONNECTED
TO RF/DC GROUND.
13105-100
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 5 to 7, 9, 10, 12 to 14,
18, 19, 24
NIC
Not Internally Connected. However, all data was measured with these pins connected to RF/dc
ground externally.
2, 4, 15, 17 GND Ground. These pins must be connected to RF/dc ground.
3 RFIN RF Input. This pin is ac-coupled and matched to 50 Ω.
8 V
GG
1
Gate Bias Pin for the First and Second Stages. External bypass capacitors of 100 pF, 10 nF, and 4.7 μF
are required for this pin.
11 V
GG
2
Gate Bias Pin for the Third and Fourth Stages. External bypass capacitors of 100 pF, 10 nF, and 4.7 μF
are required for this pin.
16 RFOUT RF Output. This pin is ac-coupled and matched to 50 Ω.
20 to 23 V
DD
4 to V
DD
1
Drain Bias Voltage Pins. External bypass capacitors of 100 pF, 10 nF, and 4.7 μF are required for
these pins.
EPAD Exposed Pad. The exposed pad must be connected to RF/dc ground.