AD8641AKSZ-R2 Datasheet AD8641AKSZ-REEL7, AD8642ARMZ, AD8643ACPZ-REEL7 | P13-P15

Data Sheet AD8641/AD8642/AD8643

Rev. F | Page 13 of 15

OUTLINE DIMENSIONS

CO

M

PL

IA

N

T T

O J

E

DE

C S

T

AN

D

AR

DS

M

O-

20

3-AA

1

.

00

0.

9

0

.

70

0.

4

6

0

.

36

0

.2

6

2

.2

0

2.

0

1

.8

0

2.

40

2

.

10

1

.8

0

1.

35

1

.

25

1

.1

5

0

7

2

80

9-

A

0

.

10

M

AX

1

.1

0

0.

80

0.

4

0

0.

10

0.

2

0.

0

8

3

1 2

45

0

.6

5

BS

C

COPLAN

AR

I

TY

0

.

10

S

E

AT

I

NG

PL

AN

E

0.

30

0

.

15

Figure 44. 5-Lead Thin Shrink Small Outline Transistor Package [SC70]

(KS-5)

Dimensions shown in millimeters

CON

TROL

LIN

G DI

MEN

SION

S AR

E IN

MILL

IME

TER

S; INCH DI

MENS

ION

S

(

IN P

ARENTHESES

) AR

E RO

UNDE

D-O

FF M

ILL

IMET

ER E

QUI

VAL

ENTS FOR

R

EFE

RENC

E ON

LY A

ND ARE NOT A

PPRO

PRI

ATE

FOR

USE I

N DE

SIG

N.

C

OMP

LI

AN

T TO

JED

EC STANDARDS MS-012-AA

012407-A

0.25 (0.0098)

0.17 (0.0067)

1.27 (0.0500)

0.40 (0.0157)

0.50 (0.0196)

0.25 (0.0099)

45°

8°

0°

1.75 (0.0688)

1.35 (0.0532)

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0040)

4

1

8 5

5.00 (0.1968)

4.80 (0.1890)

4.00 (0.1574)

3.80 (0.1497)

1.27 (0.0500)

BSC

6.20 (0.2441)

5.80 (0.2284)

0.51 (0.0201)

0.31 (0.0122)

COPLANARITY

0.10

Figure 45. 8-Lead Standard Small Outline Package [SOIC_N]

(R-8)

Dimensions shown in millimeters and (inches)

COMPLIANT TO JEDEC STANDARDS MO-187-AA

6°

0°

0.80

0.55

0.40

4

8

1

5

0.65 BSC

0.40

0.25

1.10 MAX

3.20

3.00

2.80

COPLANARITY

0.

10

0.23

0.09

3.20

3.00

2.

80

5

.15

4.90

4.65

PIN 1

I

DENT

IFIER

15° MAX

0.95

0.85

0.75

0.15

0.05

10-07-2009-B

Figure 46. 8-Lead Mini Small Outline Package [MSOP]

(RM-8)

Dimensions shown in millimeters

AD8641/AD8642/AD8643 Data Sheet

Rev. F | Page 14 of 15

CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS

(IN

PARENTHESES)

ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR

REFERENCE ONLY AND

ARE NOT APPROPRIATE FOR USE IN DESIGN.

COMPLIANT TO JEDEC STANDARDS MS-012-AB

060606-

A

14

8

7

1

6.20 (0.2441)

5.80 (0.2283)

4.00 (0.1575)

3.80 (0.1496)

8.75 (0.3445)

8.55 (0.3366)

1.27 (0.0500)

BSC

SEATING

PLANE

0.25 (0.0098)

0.10 (0.0039)

0.51 (0.0201)

0.31 (0.0122)

1.75 (0.0689)

1.35 (0.0531)

0.50 (0.0197)

0.25 (0.0098)

1.27 (0.0500)

0.40 (0.0157)

0.25 (0.0098)

0.17 (0.0067)

COPLANARITY

0.10

8°

0°

45°

Figure 47. 14-Lead Standard Small Outline Package [SOIC_N]

(R-14)

Dimensions shown in millimeters and (inches)

3.10

3.00 SQ

2.90

0.30

0.25

0.20

1.65

1.50 SQ

1.45

1

0.50

BSC

BOTTOM VIEWTOP VIEW

16

5

8

9

12

13

4

EXPOSED

PAD

PIN 1

INDICA

TOR

0.50

0.40

0.30

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

0.20 MIN

COPLANARITY

0.08

PIN 1

INDICATOR

0.80

0.75

0.70

COMPLIANT

TO

JEDEC STANDARDS MO-220-WEED-6.

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

01-26-2012-A

Figure 48. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-16-27)

Dimensions shown in millimeters

ORDERING GUIDE

Model

1

Temperature Range

Package Description

Package Option

Branding

AD8641AKSZ-R2 −40°C to +125°C 5-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-5 A07

AD8641AKSZ-REEL7 −40°C to +125°C 5-Lead Thin Shrink Small Outline Transistor Package [SC70] KS-5 A07

AD8641ARZ −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8

AD8641ARZ-REEL7 −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8

AD8642ARMZ −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 A0A

AD8642ARMZ-REEL −40°C to +125°C 8-Lead Mini Small Outline Package [MSOP] RM-8 A0A

AD8642ARZ −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8

AD8642ARZ-REEL7

−40°C to +125°C

8-Lead Standard Small Outline Package [SOIC_N]

R-8

AD8642ARZ-REEL −40°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8

AD8643ARZ −40°C to +125°C 14-Lead Standard Small Outline Package [SOIC_N] R-14

AD8643ARZ-REEL7 −40°C to +125°C 14-Lead Standard Small Outline Package [SOIC_N] R-14

AD8643ACPZ-R2 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-27 AUA

AD8643ACPZ-REEL7 −40°C to +125°C 16-Lead Lead Frame Chip Scale Package [LFCSP] CP-16-27 AUA

1

Z = RoHS Compliant Part.

Data Sheet AD8641/AD8642/AD8643

Rev. F | Page 15 of 15

NOTES

registered trademarks are the property of their respective owners.

D05072-0-4/16(F)

AD8641AKSZ-R2

AD8641AKSZ-R2

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