CY7C1011DV33
2-Mbit (128 K × 16) Static RAM
Cypress Semiconductor Corporation 198 Champion Court San Jose, CA 95134-1709 408-943-2600
Document Number: 38-05609 Rev. *H Revised November 12, 2014
2-Mbit (128 K × 16) Static RAM
Features
Pin-and function-compatible with CY7C1011CV33
High speed
t
AA
= 10 ns
Low active power
I
CC
= 90 mA @ 10 ns (Industrial)
Low CMOS standby power
I
SB2
= 10 mA
Data Retention at 2.0 V
Automatic power-down when deselected
Independent control of upper and lower bits
Easy memory expansion with CE and OE features
Available in Pb-free 44-pin TSOP II, and 48-ball VFBGA
Functional Description
The CY7C1011DV33
[1]
is a high-performance CMOS Static
RAM organized as 128 K words by 16 bits.
Writing to the device is accomplished by taking Chip Enable (CE
)
and Write Enable (WE
) inputs LOW. If Byte Low Enable (BLE) is
LOW, then data from I/O pins (I/O
0
through I/O
7
), is written into
the location specified on the address pins (A
0
through A
16
). If
Byte High Enable (BHE
) is LOW, then data from I/O pins (I/O
8
through I/O
15
) is written into the location specified on the address
pins (A
0
through A
16
).
Reading from the device is accomplished by taking Chip Enable
(CE
) and Output Enable (OE) LOW while forcing the Write
Enable (WE
) HIGH. If Byte Low Enable (BLE) is LOW, then data
from the memory location specified by the address pins will
appear on I/O
0
to I/O
7
. If Byte High Enable (BHE) is LOW, then
data from memory will appear on I/O
8
to I/O
15
. See the truth table
at the back of this data sheet for a complete description of read
and write modes.
The input/output pins (I/O
0
through I/O
15
) are placed in a
high-impedance state when the device is deselected (CE
HIGH),
the outputs are disabled (OE
HIGH), the BHE and BLE are
disabled (BHE
, BLE HIGH), or during a write operation (CE LOW,
and WE
LOW).
The CY7C1011DV33 is available in standard Pb-free 44-pin
TSOP II with center power and ground pinout, as well as 48-ball
very fine-pitch ball grid array (VFBGA) packages.
For a complete list of related resources, click here.
14
15
A
1
A
2
A
3
A
4
A
5
A
6
A
7
A
8
COLUMN
DECODER
ROW DECODER
SENSE AMPS
INPUT BUFFER
128K X 16
A
0
A
11
A
13
A
12
A
A
A
16
A
9
A
10
I/O
0
–I/O
7
OE
I/O
8
–I/O
15
CE
WE
BLE
BHE
Logic Block Diagram
Note
1. For guidelines on SRAM system design, please refer to the “System Design Guidelines” Cypress application note, available on the internet at www.cypress.com
CY7C1011DV33
Document Number: 38-05609 Rev. *H Page 2 of 17
Contents
Selection Guide ................................................................3
Pin Configurations ...........................................................3
Maximum Ratings ............................................................. 4
Operating Range ............................................................... 4
DC Electrical Characteristics ..........................................4
Capacitance ...................................................................... 5
Thermal Resistance ..........................................................5
AC Test Loads and Waveforms ....................................... 5
Data Retention Characteristics .......................................6
Data Retention Waveform ................................................ 6
AC Switching Characteristics .........................................7
Switching Waveforms ......................................................8
Truth Table ...................................................................... 11
Ordering Information ...................................................... 12
Ordering Code Definitions ......................................... 12
Package Diagrams .......................................................... 13
Acronyms ........................................................................ 14
Document Conventions ................................................. 14
Units of Measure ....................................................... 14
Document History ........................................................... 15
Sales, Solutions, and Legal Information ...................... 17
Worldwide Sales and Design Support ....................... 17
Products .................................................................... 17
PSoC® Solutions ...................................................... 17
Cypress Developer Community ................................. 17
Technical Support ..................................................... 17
CY7C1011DV33
Document Number: 38-05609 Rev. *H Page 3 of 17
Selection Guide
Description -10 Unit
Maximum Access Time 10 ns
Maximum Operating Current 90 mA
Maximum CMOS Standby Current 10 mA
Pin Configurations
Figure 1. 44-pin TSOP II pinout (Top View)
Figure 2. 48-ball VFBGA pinout (Top View)
WE
1
2
3
4
5
6
7
8
9
10
11
14
31
32
36
35
34
33
37
40
39
38
Top View
TSOP II
12
13
41
44
43
42
16
15
29
30
V
CC
A
15
A
14
A
13
A
4
A
3
OE
V
SS
A
5
I/O
15
A
2
CE
I/O
2
I/O
0
I/O
1
BHE
NC
A
1
A
0
18
17
20
19
I/O
3
27
28
25
26
22
21
23
24
NC
V
SS
I/O
6
I/O
4
I/O
5
I/O
7
A
6
A
7
BLE
V
CC
I/O
14
I/O
13
I/O
12
I/O
11
I/O
10
I/O
9
I/O
8
A
8
A
9
A
10
A
11
A
12
A
16
WE
V
CC
A
11
A
9
NC
A
6
A
0
A
3
CE
I/O
10
I/O
8
I/O
9
A
4
A
5
I/O
11
I/O
13
I/O
12
I/O
14
I/O
15
V
SS
A
8
A
7
OE
V
SS
NC
I/O
0
BHE
NC
A
10
A
2
A
1
BLE
V
CC
I/O
2
I/O
1
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
A
15
A
14
A
13
A
12
NC
NC
NC
3
2
6
5
4
1
D
E
B
A
C
F
G
H
A
16
48-ball VFBGA
(Top View)

CY7C1011DV33-10ZSXI

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 2Mb 10ns3.3V 128Kx16 Fast Async SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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