6.42
19
IDT71V3577YS_79YS, IDT71V3577YSA_79YSA, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with
3.3V I/O, Flow-Through Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges
JTAG Interface Specification (SA Version only)
TCK
Device Inputs
(1)
/
TDI/TMS
Device Outputs
(2)
/
TDO
TRST
(
3)
t
JCD
t
JDC
t
JRST
t
JS
t
JH
t
JCYC
t
JRSR
t
JF
t
JCL
t
JR
t
JCH
M6450 drw 01
x
Symbol Parameter Min. Max. Units
t
JCYC
JTAG Clock Input Period 100
____
ns
t
JCH
JTAG Clock HIGH 40
____
ns
t
JCL
JTAG Clock Low 40
____
ns
t
JR
JTAG Clock Rise Time
____
5
(1)
ns
t
JF
JTAG Clock Fall Time
____
5
(1)
ns
t
JRST
JTAG Reset 50
____
ns
t
JRSR
JTAG Reset Recovery 50
____
ns
t
JCD
JTAG Data Output
____
20 ns
t
JDC
JTAG Data Output Hold 0
____
ns
t
JS
JTAG Setup 25
____
ns
t
JH
JTAG Hold 25
____
ns
I6450 tbl 01
Register Name Bit Size
Instruction (IR) 4
Bypass (BYR) 1
JTAG Identification (JIDR) 32
Boundary Scan (BSR) Note (1)
I6450 tbl 03
NOTES:
1. Device inputs = All device inputs except TDI, TMS and TRST.
2. Device outputs = All device outputs except TDO.
3. During power up, TRST could be driven low or not be used since the JTAG circuit resets automatically. TRST is an optional JTAG reset.
NOTE:
1. The Boundary Scan Descriptive Language (BSDL) file for this device is available
by contacting your local IDT sales representative.
JTAG AC Electrical
Characteristics
(1,2,3,4)
Scan Register Sizes
NOTES:
1. Guaranteed by design.
2. AC Test Load (Fig. 1) on external output signals.
3. Refer to AC Test Conditions stated earlier in this document.
4. JTAG operations occur at one speed (10MHz). The base device may run at any speed specified in this datasheet.
6.4220
IDT71V3577YS_79YS, IDT71V3577YSA_79YSA, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with
3.3V I/O, Flow-Through Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges
NOTES:
1. Device outputs = All device outputs except TDO.
2. Device inputs = All device inputs except TDI, TMS, and TRST.
Instruction Field Value Description
Revision Number (31:28) 0x2 Reserved for version number.
IDT Device ID (27:12) 0x22C, 0x22E Defines IDT part number 71V3577YSA and 71V3579YSA, respectively.
IDT JEDEC ID (11:1) 0x33 Allows unique identification of device vendor as IDT.
ID Register Indicator Bit (Bit 0) 1 Indicates the presence of an ID register.
I6450 tbl 02
JTAG Identification Register Definitions (SA Version only)
Instruction Description OPCODE
EXTEST
Forces contents of the boundary scan cells onto the device outputs
(1)
.
Places the boundary scan register (BSR) between TDI and TDO.
0000
SAMPLE/PRELOAD
Places the boundary scan register (BSR) between TDI and TDO.
SAMPLE allows data from device inputs
(2)
and outputs
(1 )
to be captured
in the boundary scan cells and shifted serially through TDO. PRELOAD
allows data to be input serially into the boundary scan cells via the TDI.
0001
DEVICE_ID
Loads the JTAG ID register (JIDR) with the vendor ID code and places
the register between TDI and TDO.
0010
HIGHZ
Places the bypass register (BYR) between TDI and TDO. Forces all
device output drivers to a High-Z state.
0011
RESERVED
Several combinations are reserved. Do not use codes other than those
identified for EXTEST, SAMPLE/PRELOAD, DEVICE_ID, HIGHZ, CLAMP,
VALIDATE and BYPASS instructions.
0100
RESERVED 0101
RESERVED 0110
RESERVED 0111
CLAMP
Uses BYR. Forces contents of the boundary scan cells onto the device
outputs. Places the bypass register (BYR) between TDI and TDO.
1000
RESERVED
Same as above.
1001
RESERVED 1010
RESERVED 1011
RESERVED 1100
VALIDATE
Automatically loaded into the instruction register whenever the TAP
controller passes through the CAPTURE-IR state. The lower two bits '01'
are mandated by the IEEE std. 1149.1 specification.
1101
RESERVED Same as above. 1110
BYPASS
The BYPASS instruction is used to truncate the boundary scan register
as a single bit in length.
1111
I6450 tbl 04
Available JTAG Instructions
6.42
21
IDT71V3577YS_79YS, IDT71V3577YSA_79YSA, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with
3.3V I/O, Flow-Through Outputs, Burst Counter, Single Cycle Deselect Commercial and Industrial Temperature Ranges
Ordering Information
100-pin Plastic Thin Quad Flatpack (TQFP)
119 Ball Grid Array (BGA)
165 Fine Pitch Ball Grid Array (fBGA)
S
Power
X
Speed
XX
Package
PF**
BG
BQ
I
DT XXX
65*
75*
80
85
Access Time in Tenths of Nanoseconds
6450 drw 12
Device
Type
71V3577
71V3579
128K x 36 Flow-Through Burst Synchronous SRAM with 3.3V
I/O
256K x 18 Flow-Through Burst Synchronous SRAM with 3.3V
I/O
,
X
Process/
Temperature
Range
Commercial (0°C to +70°C)
Industrial (-40°C to +85°C)
Blank
I
*Commercial temperature range only.
** JTAG (SA version) is not available with 100 pin TQFP package
X
S
SA
Y
Standard Power
Standard Power with JTAG Interface
Y Generation die step
X
G
Restricted hazardous substance device
Package Information
100-Pin Thin Quad Plastic Flatpack (TQFP)
119 Ball Grid Array (BGA)
165 Fine Pitch Ball Grid Array (fBGA)
Information available on the IDT website

IDT71V3577YS85PFI8

Mfr. #:
Manufacturer:
Description:
IC SRAM 4.5M PARALLEL 100TQFP
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union