STTH802 Ordering information scheme
5/11
2 Ordering information scheme
Figure 11. Thermal resistance, junction to
ambient, versus copper surface
under tab - Epoxy printed circuit
board FR4, e
CU
= 35 µm (D
2
PAK )
Figure 12. Thermal resistance, junction to
ambient, versus copper surface
under tab - Epoxy printed circuit
board FR4, e
CU
= 35 µm (DPAK)
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
DPAK
2
S
CU
(cm²)
0
10
20
30
40
50
60
70
80
90
100
0 5 10 15 20 25 30 35 40
R
th(j-a)
(°C/W)
DPAK
S
CU
(cm²)
STTH 8 02 XXX
Ultrafast switching diode
Average forward current
8 = 8 A
02 = 200 V
D = TO-220AC in Tube
FP = TO-220FPAC in Tube
B = DPAK in Tube
B-TR = DPAK in Tape and reel
G = D PAK in Tube
G-TR = D PAK in Tape and reel
2
2
Repetitive peak reverse voltage
Package