A165
DF15 Series●0.65mm Pitch SMT Board to Board Connector
1.
Recommended Temperature Profile
(
SMT
)
2.
Recommended Manual Soldering Condition
(
SMT
)
3.
Recommended Screen Thickness
(
SMT
)
4. Board Warp
(
SMT
)
5. Cleaning Condition
6. Cautions
Note1: Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that
there is a return to normal temperature between the first and second cycle.
Note2: The temperature profile indicates the board surface temperature at the point of contacts
with the connector terminals.
Soldering iron temperature: 350±10ç, Soldering time: Within 3 seconds
0.15mm
Max 0.02mm in the connector center area, based on the both connector edges
Refer to the "Nylon Connector Use Hand book".
■The receptacle is designed in a structure where contacts are exposed. Touching it with bare
hands would cause contact failure or electrostatic element damage.
■
Where no board is mounted, the insertion or extraction will cause damage or deformation in the contacts.
■
Avoid retaining the board with the connector only, and fix the board by any other means than the connector.
■Excessive scoop insertion or extraction may result in damage.
■
In the manual soldering process, don't carry out the flux coating which will cause a flux blister on the connector.
■The color phase of this product may be slightly different from that of the formed product
according to the manufacturing lot. However, the difference doesn't affect the performance.
BPrecautions
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
