LIS302SG Package information
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6 Package information
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second Level Interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK
®
is an ST trademark.
ECOPACK
®
specifications are available at: www.st.com.
Figure 19. LGA-14: mechanical data and package dimensions
OUTLINE AND
MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A1 0.920 1.000 0.0362 0.0394
A2 0.700 0.0275
A3 0.180 0.220 0.260 0.0071 0.0087 0.0102
D1 2.850 3.000 3.150 0.1122 0.1181 0.1240
E1 4.850 5.000 5.150 0.1909 0.1968 0.2027
e0.800 0.0315
d0.300 0.0118
L1 4.000 0.1575
N1.360 0.0535
N1 1.200 0.0472
P1 0.965 0.975 0.9850.0380 0.03840.0386
P2 0.640 0.650 0.660 0.0252 0.0256 0.0260
T1 0.750 0.800 0.850 0.0295 0.0315 0.0335
T2 0.450 0.500 0.550 0.0177 0.0197 0.0217
R 1.200 1.600 0.0472 0.0630
h 0.150 0.0059
k 0.050 0.0020
i 0.100 0.0039
s 0.100 0.0039
LGA-14 (3x5x0.92mm) Pitch 0.8mm
Land Grid Array Package
7773587 C
Obsolete Product(s) - Obsolete Product(s)
