10
Figure 3 shows the start-up sequence as initiated by a fast
rising 5V supply, VCC
,
applied to the ISL6552. Note the
short rise to the three state level in PWM 1 output during first
32 PWM cycles.
Figure 4 shows the waveforms when the regulator is
operating at 200kHz. Note that the Soft-Start duration is a
function of the channel frequency as explained previously.
Also note the pulses on the COMP terminal. These pulses
are the current correction signal feeding into the comparator
input (see the Block Diagram).
Figure 5 shows the regulator operating from an ATX supply.
In this figure, note the slight rise in PGOOD as the 5V supply
rises. The PGOOD output stage is made up of NMOS and
PMOS transistors. On the rising VCC, the PMOS device
becomes active slightly before the NMOS transistor pulls
“down”, generating the slight rise in the PGOOD voltage.
Note that Figure 5 shows the 12V gate driver voltage
available before the 5V supply to the ISL6552 has reached
its threshold level. If conditions were reversed and the 5V
supply was to rise first, the start-up sequence would be
different. In this case the ISL6552 will sense an over-current
condition due to charging the output capacitors. The supply
will then restart and go through the normal Soft-Start cycle.
Fault Protection
The ISL6552 protects the microprocessor and the entire
power system from damaging stress levels. Within the
ISL6552 both Over-Voltage and Over-Current circuits are
incorporated to protect the load and regulator.
Over-Voltage
The VSEN pin is connected to the microprocessor CORE
voltage. A CORE over-voltage condition is detected when
the VSEN pin goes more than 15% above the programmed
VID level.
The over-voltage condition is latched, disabling normal PWM
operation, and causing PGOOD to go low. The latch can
only be reset by lowering and returning VCC high to initiate a
POR and Soft-Start sequence.
During a latched over-voltage, the PWM outputs will be
driven either low or three state, depending upon the VSEN
input. PWM outputs are driven low when the VSEN pin
detects that the CORE voltage is 15% above the
programmed VID level. This condition drives the PWM
outputs low, resulting in the lower or synchronous rectifier
MOSFETs to conduct and shunt the CORE voltage to ground
to protect the load.
If after this event, the CORE voltage falls below the over-
voltage limit (plus some hysteresis), the PWM outputs will
three state. The HIP6601 family drivers pass the three state
information along, and shuts off both upper and lower
MOSFETs. This prevents “dumping” of the output capacitors
back through the lower MOSFETs, avoiding a possibly
PWM 1
PGOOD
V
CORE
5V
OUTPUT
VCC
V
IN
= 12V
DELAY TIME
FIGURE 3. START-UP OF 4 PHASE SYSTEM OPERATING AT
500kHz
PGOOD
V
CORE
5V
V COMP
VCC
V
IN
= 12V
DELAY TIME
FIGURE 4. START-UP OF 4 PHASE SYSTEM OPERATING AT
200kHz
12V ATX
SUPPLY
PGOOD
5 V ATX
V
CORE
SUPPLY
ATX SUPPLY ACTIVATED BY ATX “PS-ON PIN”
V
IN
= 5V, CORE LOAD CURRENT = 31A
FIGURE 5. SUPPLY POWERED BY ATX SUPPLY
FREQUENCY 200kHz
ISL6552
11
destructive ringing of the capacitors and output inductors. If
the conditions that caused the over-voltage still persist, the
PWM outputs will be cycled between three state and V
CORE
clamped to ground, as a hysteretic shunt regulator.
Under-Voltage
The VSEN pin also detects when the CORE voltage falls
more than 10% below the VID programmed level. This
causes PGOOD to go low, but has no other effect on
operation and is not latched. There is also hysteresis in this
detection point.
Over-Current
In the event of an over-current condition, the over-current
protection circuit reduces the RMS current delivered to 41%
of the current limit. When an over-current condition is
detected, the controller forces all PWM outputs into a three
state mode. This condition results in the gate driver
removing drive to the output stages. The ISL6552 goes into
a wait delay timing cycle that is equal to the Soft-Start ramp
time. PGOOD also goes “low” during this time due to VSEN
going below its threshold voltage. To lower the average
output dissipation, the Soft-Start initial wait time is increased
from 32 to 2048 cycles, then the Soft-Start ramp is initiated.
At a PWM frequency of 200kHz, for instance, an over-
current detection would cause a dead time of 10.24ms, then
a ramp of 10.08ms.
At the end of the delay, PWM outputs are restarted and the
soft start ramp is initiated. If a short is present at that time,
the cycle is repeated. This is the hiccup mode.
Figure 6 shows the supply shorted under operation and the
hiccup operating mode described above. Note that due to
the high short circuit current, over-current is detected before
completion of the start-up sequence so the delay is not quite
as long as the normal Soft-Start cycle.
CORE Voltage Programming
The voltage identification pins (VID0, VID1, VID3, and
VID25mV) set the CORE output voltage. Each VID pin is
pulled to VCC by an internal 20A current source and
accepts open-collector/open-drain/open-switch-to-ground or
standard low-voltage TTL or CMOS signals.
Table 1 shows the nominal DAC voltage as a function of the
VID codes. The power supply system is 1% accurate over
the operating temperature and voltage range.
PGOOD
SHORT
50A/DIV
CURRENT
ATX SUPPLY ACTIVATED BY ATX “PS-ON PIN”
SUPPLY FREQUENCY = 200kHz, V
IN
= 12V
HICCUP MODE. SUPPLY POWERED BY ATX SUPPLY
CORE LOAD CURRENT = 31A, 5V LOAD = 5A
SHORT APPLIED HERE
FIGURE 6. SHORT APPLIED TO SUPPLY AFTER POWER-UP
TABLE 1. VOLTAGE IDENTIFICATION CODES
VOLTAGE IDENTIFICATION CODE AT
PROCESSOR PINS
VCC
CORE
(V
DC
)VID25mV VID3 VID2 VID1 VID0
0 01001.05
1 01001.075
0 00111.10
1 00111.125
0 00101.15
1 00101.175
0 00011.20
1 00011.225
0 00001.25
1 00001.275
0 11111.30
1 11111.325
0 11101.35
1 11101.375
0 11011.40
1 11011.425
0 11001.45
1 11001.475
0 10111.50
1 10111.525
0 10101.55
1 10101.575
0 10011.60
1 10011.625
0 10001.65
1 10001.675
0 01111.70
1 01111.725
0 01101.75
1 01101.775
0 01011.80
1 01011.825
ISL6552
12
Current Sensing and Balancing
Overview
The ISL6552 samples the on-state voltage drop across each
synchronous rectifier FET, Q2, as an indication of the
inductor current in that phase, see Figure 7. Neglecting AC
effects (to be discussed later), the voltage drop across Q2 is
simply r
DS(ON)
(Q2) x inductor current (I
L
). Note that I
L
, the
inductor current, is either 1/2, 1/3, or 1/4 of the total current
(I
LT
), depending on how many phases are in use.
The voltage at Q2’s drain, the PHASE node, is applied to the
R
ISEN
resistor to develop the I
ISEN
current to the ISL6552
ISEN pin. This pin is held at virtual ground, so the current
through R
ISEN
is I
L
x r
DS(ON)
(Q2)/R
ISEN
.
The I
ISEN
current provides information to perform the
following functions:
1. Detection of an over-current condition
2. Reduce the regulator output voltage with increasing load
current (droop)
3. Balance the I
L
currents in multiple channels
Over-Current, Selecting R
ISEN
The current detected through the R
ISEN
resistor is
averaged with the current(s) detected in the other 1, 2, or 3
channels. The averaged current is compared with a
trimmed,
internally generated current, and used to detect
an over-current condition.
The nominal current through the R
ISEN
resistor should be
50A at full output load current, and the nominal trip point for
over-current detection is 165% of that value, or 82.5A.
Therefore, R
ISEN
= I
L
x r
DS(ON)
(Q2)/50A.
For a full load of 25A per phase, and an r
DS(ON)
(Q2) of
4m, R
ISEN
= 2k.
The over-current trip point would be 165% of 25A, or ~41A
per phase. The R
ISEN
value can be adjusted to change the
over-current trip point, but it is suggested to stay within
25% of nominal.
Droop, Selection of R
IN
The average of the currents detected through the R
ISEN
resistors is also steered to the FB pin. There is no DC return
path connected to the FB pin except for R
IN
, so the average
current creates a voltage drop across R
IN
. This drop
increases the apparent V
CORE
voltage with increasing load
current, causing the system to decrease V
CORE
to maintain
balance at the FB pin. This is the desired “droop” voltage used
to maintain V
CORE
within limits under transient conditions.
With a high dv/dt load transient, typical of high performance
microprocessors, the largest deviations in output voltage occur
at the leading and trailing edges of the load transient. In order to
fully utilize the output-voltage tolerance range, the output
voltage is positioned in the upper half of the range when the
output is unloaded and in the lower half of the range when the
FIGURE 7. SIMPLIFIED FUNCTIONAL BLOCK DIAGRAM SHOWING CURRENT AND VOLTAGE SAMPLING
CURRENT
SENSING
COMPARATOR
PWM
CIRCUIT
AVERAGING
CURRENT
FROM
OTHER
CHANNELS
SAWTOOTH
GENERATOR
+
DIFFERENCE
R
ISEN
+
CORRECTION
ERROR
AMPLIFIER
FB
COMP
REFERENCE
TO OTHER
CHANNELS
ISEN
R
IN
R
FB
C
c
V
CORE
Q1
Q2
COMPARATOR
REFERENCE
TO OVER
CURRENT
TRIP
L
01
PHASE
INDUCTOR
CURRENT(S)
FROM
OTHER
CHANNELS
PWM
I
L
DAC
ISL6552
C
OUT
R
LOAD
V
IN
ONLY ONE OUTPUT
HIP6601
-
-
STAGE SHOWN
SENSING
+
-
+
-
+
-
ISL6552

ISL6552CBZA

Mfr. #:
Manufacturer:
Renesas / Intersil
Description:
Switching Controllers W/ANNEAL 20L 2-4 PHS 5 PWM BUCK CONTR
Lifecycle:
New from this manufacturer.
Delivery:
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