NCP1526
http://onsemi.com
17
PACKAGE DIMENSIONS
10 PIN UDFN
CASE 506AT−01
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
C
A
SEATING
PLANE
D
B
E
0.15 C
A3
A
A1
2X
2X
0.15 C
DIM
A
MIN NOM MAX
MILLIMETERS
0.45 0.50 0.55
A1 0.00 0.03 0.05
A3 0.127 REF
b 0.18 0.25 0.30
D 3.00 BSC
D2 2.40 2.50 2.60
E 3.00 BSC
1.70 1.80 1.90
E2
e 0.50 BSC
0.19 TYP
K
PIN ONE
REFERENCE
0.08 C
0.10 C
10X
A0.10 C
NOTE 3
L
e
D2
E2
b
B
5
6
10X
1
K 10
10X
10X
0.05 C
8X
0.30 0.40 0.50
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
2.1746
2.6016
1.8508
0.5000 PITCH
0.5651
10X
3.3048
0.3008
10X
DIMENSIONS: MILLIMETERS
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NCP1526/D
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