LQM21PN1R0MCHD

Spec No. JELF243B-0075-01 P.4/8
MURATA MFG. CO., LTD.
Reference
Only
9. Specification of Packaging
9.1 Appearance and Dimensions of plastic tape (8mm-wide)
(in mm)
Dimension of the Cavity is measured at the bottom side.
9.2 Specification of Taping
(1) Packing quantity (standard quantity)
3,000 pcs. / reel
(2) Packing Method
Products shall be packed in the cavity of the base tape and sealed by top tape and bottom tape.
(3) Sprocket hole
The sprocket holes are to the right as the tape is pulled toward the user.
(4) Spliced point
Base tape and Top tape has no spliced point.
(5) Missing components number
Missing components number within 0.1% of the number per reel or 1 pc., whichever is greater,
and are not continuous. The Specified quantity per reel is kept.
9.3 Pull Strength
Plastic tape 10N min.
Cover tape 5N min.
9.4 Peeling off force of Top tape
Speed of Peeling off 300mm/ min
Peeling off force 0.1 to 0.7N
(minimum value is typical)
9.5 Dimensions of Leader-tape, Trailer and Reel
There shall be leader-tape ( top tape and empty tape) and trailer-tape (empty tape) as follows.
(in mm)
Empty tape
190 min.
Leader
Trailer
Cover tape
2.0±0.5
13.0±0.2
21.0±0.8
180±
60±
13±1.4
1
0
0
3
Direction of feed
210 min.
160 min.
1
0
Label
F
165 to 180 degree
Top tape
Bottom tape
Base tape
Direction of feed
φ
1.5
2.0±0.05
2.25±0.1
1.45±0.05
4.0±0.1
+0.1
-0
3.5±0.05
1.75±0.1
8.0±0.3
0.7 max
4.0±0.1
Spec No. JELF243B-0075-01 P.5/8
MURATA MFG. CO., LTD.
Reference
Only
9.6 Marking for reel
Customer part number, MURATA part number, Inspection number (1), RoHS marking (2), Quantity
etc ・・・
1) <Expression of Inspection No.>
□□ OOOO 
(1) (2) (3)
(1) Factory Code
(2) Date First digit : Year / Last digit of year
Second digit : Month / Jan. to Sep. 1 to 9, Oct. to Dec. O, N, D
Third, Fourth digit : Day
(3) Serial No.
2) <Expression of RoHS marking > ROHS Y ()
(1) (2)
(1)
RoHS regulation conformity parts.
(2) MURATA classification number
9.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS
marking (2), Quantity, etc ・・・
9.8. Specification of Outer Case
Outer Case Dimensions
(mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
186 186 93 5
Above Outer Case size is typical. It depends on a quantity of an order.
10.
Caution
Limitation of Applications
Please contact us before using our products for the applications listed below which require especially
high reliability for the prevention of defects which might directly cause damage to the third party's life,
body or property.
(1) Aircraft equipment (6) Transportation equipment (vehicles, trains, ships, etc.)
(2) Aerospace equipment (7) Traffic signal equipment
(3) Undersea equipment (8) Disaster prevention / crime prevention equipment
(4) Power plant control equipment (9) Data-processing equipment
(5) Medical equipment (10) Applications of similar complexity and /or reliability
requirements to the applications listed in the above
11. Notice
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
11.1 Land pattern designing
Operating
Current
(A)
abc
Land pad thickness
and dimension d
18µm 35µm 70µm
0 to 1.0
1.2
3.0
to
4.0
1.0
1.0 1.0 1.0
1.0 to 1.5
1.5 1.0 1.0
Over 1.5
2.0 1.5 1.0
(in mm)
W
D
Label
H
a
b
Chip Ferrite Bead
Solder Resist
Pattern
d
c
Chip coil
Spec No. JELF243B-0075-01 P.6/8
MURATA MFG. CO., LTD.
Reference
Only
11.2 Flux, Solder
Use rosin-based flux.
Don’t use highly acidic flux with halide content exceeding 0.2(wt) % (chlorine conversion value).
Don’t use water-soluble flux.
Use Sn-3.0Ag-0.5Cu solder.
Standard thickness of solder paste: 100μm to 150μm.
11.3 Reflow soldering conditions
Products can be applied to reflow soldering.
Pre-heating should be in such a way that the temperature difference between solder and product
surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that
the temperature difference is limited to 100°C max.
Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of products
quality.
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the
deterioration of product quality.
Reflow soldering profile
Standard Profile Limit Profile
Pre-heating 150°C180°C, 90s±30s
Heating above 220°C, 30s60s above 230°C, 60s max.
Peak temperature 245°C±3°C 260°C, 10s
Cycle of reflow 2 times 2 times
11.4 Reworking with soldering iron
The following conditions must be strictly followed when using a soldering iron.
Pre-heating 150°C, 1 min
Tip temperature 350°C max.
Soldering iron output 80W max.
Tip diameter φ3mm max.
Soldering time 3(+1, -0)s
Time 2 times
Note : Do not directly touch the products with the tip of the soldering iron in order to prevent the crack on
the products due to the thermal shock.
11.5 Solder Volume
Solder shall be used not to be exceeded the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to Chip is also increased.
Exceeding solder volume may cause the failure of mechanical or electrical performance.
1/3TtT
T thickness of electrode
Upper Limit
Recommendable
t
Limit Profile
Standard Profile
90s±30s
230
260℃
245℃±3
220
30s~60s
60s max.
180
150
Temp.
(s)
(℃)
Time.

LQM21PN1R0MCHD

Mfr. #:
Manufacturer:
Description:
FIXED IND 1UH 1.2A 188 MOHM
Lifecycle:
New from this manufacturer.
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