LQM21PN1R0MCHD

Spec No. JELF243B-0075-01 P.7/8
MURATA MFG. CO., LTD.
Reference
Only
11.6 Product’s location
The following shall be considered when designing and laying out P.C.B.'s.
(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.
Products direction
Products shall be located in the sideways
direction (Length: a‹b) to the mechanical
stress.
(2) Products location on P.C.B. separation
Products (A, B, C, D) shall be located carefully so
that products are not subject to the mechanical
stress due to warping the board.
Because they may be subjected the mechanical
stress in order of ACBD.
11.7 Cleaning Conditions
Products shall be cleaned on the following conditions.
(1) Cleaning temperature shall be limited to 60°C max. (40°C max for IPA.)
(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance
phenomenon at the mounted products and P.C.B.
Power : 20 W / l max. Frequency : 28kHz to 40kHz Time : 5 min max.
(3) Cleaner
1. Alcohol type cleaner
Isopropyl alcohol (IPA)
2. Aqueous agent
PINE ALPHA ST-100S
(4) There shall be no residual flux and residual cleaner after cleaning. In the case of using aqueous agent,
products shall be dried completely after rinse with de-ionized water in order to remove the cleaner.
(5) Other cleaning Please contact us.
11.8 Resin coating
The inductance value may change and/or it may affect on the product's performance due to high
cure-stress of resin to be used for coating/molding products. So please pay your careful attention when you
select resin.
In prior to use, please make the reliability evaluation with the product mounted in your application set.
11.9 Caution for use
There is possibility that the inductance value change due to magnetism. Don‘t use a magnet or a pair of
tweezers with magnetism when chip coil are handled. (The tip of the tweezers should be molded with resin or
pottery.)
11.10 Magnetic Saturation
When the excessive current over rated current is applied, the inductance value may change due to
magnetism.
Seam
Slit
A
D
B
C
b
a
Length:ab
Poor example
Good example
b
a
Spec No. JELF243B-0075-01 P.8/8
MURATA MFG. CO., LTD.
Reference
Only
11.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or
twisting to the substrate when cropping the substrate, inserting and removing a connector from the
substrate or tightening screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
11.12 Storage and Handing Requirements
(1) Storage period
Use the products within 6 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
Products should be stored in the warehouse on the following conditions.
Temperature -10°C to 40°C
Humidity
15% to 85% relative humidity No rapid change on temperature and humidity
Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization
of electrode, resulting in poor solderability.
Products should be stored on the palette for the prevention of the influence from humidity, dust and so
on.
Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
Products should be stored under the airtight packaged condition.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical
shock.
12! Note
(1) Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2) You are requested not to use our product deviating from the reference specifications.
(3) The contents of this reference specification are subject to change without advance notice.
Please approve our product specifications or transact the approval sheet for product specifications
before ordering.

LQM21PN1R0MCHD

Mfr. #:
Manufacturer:
Description:
FIXED IND 1UH 1.2A 188 MOHM
Lifecycle:
New from this manufacturer.
Delivery:
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