AS1371
400mA, Low Input Voltage, Low Quiescent Current LDO
Datasheet
www.austriamicrosystems.com/LDOs/AS1371 Revision 1.6 1 - 17
1 General Description
The AS1371 low input voltage, positive voltage regulator is designed
to deliver up to 400mA while consuming typically only 15µA of
quiescent current. The device operates from input voltages of 1.2V
to 3.6V, and is available in fixed output voltages between 0.6V and
3.3V (programmable in 50mV steps).
Operation at the full 400mA load current is dependent upon the
maximum power dissipation available from package and
environment.
The low input voltage and ultra-low dropout voltage (20mV @
100mA load and 80mV @ 400mA load) supports single primary cell
operation in small applications, when operated with minimum input-
to-output voltage differentials. In addition, the regulator provides a
power management life extension by operating from pre-existing
1.8V and 2.5V outputs to provide low output voltages for new
generation portable processor cores.
The device features stable output voltage with ceramic capacitors
down to a value of 1µF, strict output voltage regulation tolerances
(±1%), and good line- and load-regulation.
The AS1371 is available in a 6-pin 2x2 TDFN package and is
qualified for -40°C to +85°C operation.
Figure 1. AS1371 - Typical Application Diagram
2 Key Features
Ultra-Low Dropout Voltage: 20mV @ 100mA load
Operating Input Voltage Range: 1.2V to 3.6V
Output Voltages: 0.6V to 3.3V in 50mV steps
Max. Output Current: 400mA
Output Voltage Accuracy: ±1%
Low Shutdown Current: 10nA
Low Quiescent Current: 50µA @ max load
Integrated Overtemperature/Overcurrent Protection
Under-Voltage Lockout Feature
Chip Enable Input
Power-OK and Low Battery Detection
Sense Input Option
Minimal External Components Required
Operating Temperature Range: -40°C to +85°C
6-pin 2x2 TDFN Package
3 Applications
The devices are ideal for powering cordless and mobile phones,
MP3 players, CD and DVD players, PDAs, hand-held computers,
digital cameras, and any other hand-held and/or battery-powered
device.
Input
1.2V to 3.6V
C
IN
1µF
ON
OFF
100k
C
OUT
1µF
Output
0.6V to 3.3V
IN
EN
GND
SENSE
OUT
AS1371
POK
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AS1371
Datasheet - Pin Assignments
4 Pin Assignments
Figure 2. Pin Assignments (Top View)
4.1 Pin Descriptions
Table 1. Pin Descriptions
Pin Number Pin Name Description
1IN
LDO Input. Input voltage range: 1.2V to 3.6V. Bypass with 1µF to GND.
2POK
Power-OK Output. Active-low, open-drain output indicates an out-of-regulation condition.
Connect a 100k pull-up resistor to pin OUT for logic levels. Leave this pin unconnected if the
Power-OK feature is not used.
3 EN
Active-High Enable Input. A logic low reduces the supply current to < 1µA.
Connect to pin IN for normal operation.
4GND
Ground. This pin also functions as a heat sink. Solder it to a large pad or to the circuit-board
ground plane to maximize power dissipation.
5 SENSE
Sense Input. Represents the input for the Power-OK behavior. If connected to GND the POK
output is related to OUT.
6OUT
LDO Output. Bypass with 1µF to GND.
Exposed Pad GND
Exposed Pad. This pin also functions as a heat sink. Solder it to a large pad or to the circuit-
board ground plane to maximize power dissipation. Internally it is connected GND.
AS1371
1
2
3
IN
POK
EN
GND
OUT
SENSE
6
5
4
Exposed Pad
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AS1371
Datasheet - Absolute Maximum Ratings
5 Absolute Maximum Ratings
Stresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of
the device at these or any other conditions beyond those indicated in Section 6 Electrical Characteristics on page 4 is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
Table 2. Absolute Maximum Ratings
Parameter Min Max Units Notes
Electrical Parameters
IN and EN to GND -0.3 +5.0 V
POK and OUT to GND -0.3 V
IN + 0.3 V
Input Current (latch-up immunity) -100 100 mA Norm: JEDEC 78
Electrostatic Discharge
Electrostatic Discharge HBM ±1000 V Norm: MIL 883 E method 3015
Temperature Ranges and Storage Conditions
Thermal Resistance
JA
+78.6 ºC/W
Junction-to-ambient thermal resistance is very
dependent on application and board-layout. In
situations where high maximum power
dissipation exists, special attention must be paid
to thermal dissipation during board design.
Junction Temperature +125 ºC
Storage Temperature Range -55 +125 ºC
Package Body Temperature
+260
ºC
The reflow peak soldering temperature (body
temperature) specified is in accordance with IPC/
JEDEC J-STD-020“Moisture/Reflow Sensitivity
Classification for Non-Hermetic Solid State
Surface Mount Devices”.
The lead finish for Pb-free leaded packages is
matte tin (100% Sn).
Humidity non-condensing 5 85 %
Moisture Sensitive Level 1 Represents a maximum floor life time of unlimited

AS1371-BTDT-105

Mfr. #:
Manufacturer:
ams
Description:
LDO Voltage Controllers
Lifecycle:
New from this manufacturer.
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