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NLASB3157MTR2G

P1-P3P4-P6P7-P9P10-P10
NLASB3157
http://onsemi.com
7
t
W
V
CC
GND
V
OH
V
OL
50%
10%10%
50% 50%
90% 90%
t
f
= 2.5 nst
r
= 2.5 ns
SWITCH
INPUT
OUTPUT
50%
t
PHL
t
PLH
V
CC
GND
V
TRI
50%
10%10%
50% 50%
90% 90%
t
f
= 2.5 ns t
r
= 2.5 ns
SELECT
INPUT
OUTPUT
t
PZL
V
TRI
OUTPUT
50%
t
PZH
V
OL
V
OH
t
PHZ
t
PLZ
V
OL
+ 0.3 V
V
OH
− 0.3 V
NOTE: Input driven by 50 W source terminated in 50 W
NOTE: C
L
includes load and stray capacitance
NOTE: Input PRR = 1.0 MHz; t
W
= 500 ns
V
I
RD
RU
C
L
FROM
OUTPUT
UNDER
TEST
Figure 2. AC Test Circuit
Figure 3. AC Waveforms
Figure 4. Break Before Make Interval Timing
LOGIC
INPUT
V
OUT
t
D
0.9 × V
OUT
R
L
C
L
V
OUT
V
IN
LOGIC
INPUT
A
S
B
0
B
1
AC LOADING AND WAVEFORMS
NLASB3157
http://onsemi.com
8
Figure 5. Charge Injection Test
R
L
1
M
W
C
L
100
pF
V
OUT
LOGIC
INPUT
A
S
B
N
R
GEN
V
GE
Q = (DV
OUT
)(C
L
)
DV
OUT
ON OFFOFF
V
OUT
LOGIC
INPUT
Figure 6. Off Isolation Figure 7. Crosstalk
S
B
N
LOGIC INPUT
0 V or V
IH
10 nF
V
CC
Analyzer
A
GND
50 W
50 W
S
B
0
10 nF
V
CC
Analyzer
A
GND
50 W
Signal
Generator
0 dBm
50 W
B
1
Figure 8. Channel Off Capacitance Figure 9. Channel On Capacitance
Figure 10. Bandwidth
S
B
N
10 nF
V
CC
A
GND
Signal
Generator
0 dBm
50 W
LOGIC INPUT
0 V or V
CC
S
B
N
LOGIC INPUT
0 V or V
CC
10 nF
V
CC
A
GND
Capacitance
Meter
S
B
N
LOGIC INPUT
0 V or V
CC
10 nF
V
CC
A
GND
Capacitance
Meter
f = 1 MHz
f = 1 MHz
AC LOADING AND WAVEFORMS
NLASB3157
http://onsemi.com
9
PACKAGE DIMENSIONS
SC−88/SOT−363/SC−70
DF SUFFIX
CASE 419B−02
ISSUE Y
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E1 DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS,
OR GATE BURRS SHALL NOT EXCEED 0.20 PER END.
4. DIMENSIONS D AND E1 AT THE OUTERMOST EXTREMES OF
THE PLASTIC BODY AND DATUM H.
5. DATUMS A AND B ARE DETERMINED AT DATUM H.
6. DIMENSIONS b AND c APPLY TO THE FLAT SECTION OF THE
LEAD BETWEEN 0.08 AND 0.15 FROM THE TIP.
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION.
ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 TOTAL IN
EXCESS OF DIMENSION b AT MAXIMUM MATERIAL CONDI-
TION. THE DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OF THE FOOT.
Cddd
M
123
A1
A
c
654
E
b6X
DIM MIN NOM MAX
MILLIMETERS
A −−− −−− 1.10
A1 0.00 −−− 0.10
ddd
b 0.15 0.20 0.25
C 0.08 0.15 0.22
D 1.80 2.00 2.20
−−− −−− 0.043
0.000 −−− 0.004
0.006 0.008 0.010
0.003 0.006 0.009
0.070 0.078 0.086
MIN NOM MAX
INCHES
0.10 0.004
E1 1.15 1.25 1.35
e 0.65 BSC
L 0.26 0.36 0.46
2.00 2.10 2.20
0.045 0.049 0.053
0.026 BSC
0.010 0.014 0.018
0.078 0.082 0.086
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.65
0.66
6X
DIMENSIONS: MILLIMETERS
0.30
PITCH
2.50
6X
RECOMMENDED
TOP VIEW
SIDE VIEW END VIEW
bbb H
B
SEATING
PLANE
DETAIL A
E
A2 0.70 0.90 1.00 0.027 0.035 0.039
L2 0.15 BSC 0.006 BSC
aaa 0.15 0.006
bbb 0.30 0.012
ccc 0.10 0.004
A-B D
aaa C
2X 3 TIPS
D
E1
D
e
A
2X
aaa H D
2X
D
L
PLANE
DETAIL A
H
GAGE
L2
C
ccc C
A2
6X
P1-P3P4-P6P7-P9P10-P10

NLASB3157MTR2G

Mfr. #:
Buy NLASB3157MTR2G
Manufacturer:
ON Semiconductor
Description:
Analog Switch ICs LOG CMOS 2:1 MLTPLXR
Lifecycle:
New from this manufacturer.
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