General Description
The MAX16016/MAX16020/MAX16021 supervisory cir-
cuits monitor power supplies, provide battery-backup
control, and chip-enable (CE) gating to write protect
memory in microprocessor (µP)-based systems. These
low-power devices improve system reliability by providing
several supervisory functions in a small, single integrated
solution.
The MAX16016/MAX16020/MAX16021 perform four
basic system functions:
1) Provide a µP reset output during V
CC
supply power-
up, power-down, and brownout conditions.
2) Control V
CC
to battery-backup switching internally
to maintain data or low-power operation for memo-
ries, real-time clocks (RTCs), and other digital logic
when the main power is removed.
3) Provide memory write protection through internal
chip-enable gating during brownout.
4) Provide a combination of additional supervisory
functions listed in the
Features
section.
The MAX16016/MAX16020/MAX16021 operate from a
1.53V to 5.5V supply voltage and offer fixed reset
thresholds for monitoring 5V, 3.3V, 3V, 2.5V, and 1.8V
systems. Each device is available with either a push-
pull or open-drain reset output.
The MAX16016/MAX16020/MAX16021 are available in
small TDFN/TQFN packages and are fully specified for
an operating temperature range of -40°C to +85°C.
Applications
Main/Backup Power for RTCs, CMOS Memories
Industrial Control
GPS Systems
Set-Top Boxes
Point-of-Sale Equipment
Portable/Battery Equipment
Features
o System Monitoring for 5V, 3.3V, 3V, 2.5V, or 1.8V
Power-Supply Voltages
o 1.53V to 5.5V Operating Voltage Range
o Low 1.2µA Supply Current (0.25µA in Battery-
Backup Mode)
o 145ms (min) Reset Timeout Period
o Battery Freshness Seal
o On-Board Gating of CE Signals, 1.5ns
Propagation Delay (MAX16020/MAX16021)
o Debounced Manual Reset Input
o Watchdog Timer, 1.2s (typ) Timeout
o Power-Fail Comparator and Low-Line Indicator for
Monitoring Voltages Down to 0.6V
o Battery-On, Battery-OK, and Battery Test
Indicators
o Small 10-Pin TDFN or 16-Pin TQFN Packages
o UL
®
-Certified to Conform to IEC 60950-1
MAX16016/MAX16020/MAX16021
Low-Power µP Supervisory Circuits with
Battery-Backup Circuit and Chip-Enable Gating
________________________________________________________________
Maxim Integrated Products
1
TOP VIEW
MAX16020
16
V
CC
CEIN
CEOUT
OUT
LL
BATT_TEST
BATTOK
BATTON
5
15
6
TQFN
14
7
13
8
EP
121
+
112
103
94
BATT
MR
PFI
WDI
RESET
GND
PFO
WDO
Pin Configurations
19-4145; Rev 6; 11/11
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
Ordering Information continued at end of data sheet.
Pin Configurations continued at end of data sheet.
Selector Guide located at end of data sheet.
Ordering Information
PART TEMP RANGE
PIN-PACKAGE
MAX16016_TB_+T -40°C to +85°C 10 TDFN-EP*
The first placeholder “_” designates all output options. Letter
“L” indicates push-pull outputs and letter “P” indicates open-
drain outputs. The last placeholder “_” designates the reset
threshold (see Table 1).
T = Tape and reel.
+
Denotes a lead(Pb)-free/RoHS-compliant package.
*
EP = Exposed pad.
UL is a registered trademark of Underwriters Laboratories, Inc.
MAX16016/MAX16020/MAX16021
Low-Power µP Supervisory Circuits with
Battery-Backup Circuit and Chip-Enable Gating
2 _______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(V
CC
= 1.53V to 5.5V, V
BATT
= 3V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
V
CC
, BATT, OUT, BATT_TEST to GND.....................-0.3V to +6V
RESET, RESET, PFO, BATTOK, WDO, BATTON,
BATT_TEST, LL, (all open-drain) to GND .................-0.3V to +6V
RESET, RESET, BATTOK, WDO, BATTON,
LL (all push-pull) to GND......................-0.3V to (V
OUT
+ 0.3V)
WDI, PFI to GND.......................................-0.3V to (V
OUT
+ 0.3V)
CEIN, CEOUT to GND ..............................-0.3V to (V
OUT
+ 0.3V)
MR to GND .................................................-0.3V to (V
CC
+ 0.3V)
Input Current
V
CC
Peak Current.................................................................1A
V
CC
Continuous Current ...............................................250mA
BATT Peak Current .......................................................500mA
BATT Continuous Current ...............................................70mA
Output Current
OUT Short Circuit to GND Duration ....................................10s
RESET, RESET, BATTON ....................................................20mA
Continuous Power Dissipation (T
A
= +70°C)
10-Pin TDFN (derate 24.4mW/°C above +70°C) .......1951mW
16-Pin TQFN (derate 25mW/°C above +70°C) ..........2000mW
Operating Temperature Range ...........................-40°C to +85°C
Junction Temperature......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow)
TDFN............................................................................+260°C
TQFN............................................................................+240°C
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Junction-to Ambient Thermal Resistance (θ
JA
) ...........41°C/W
Junction-to Case Thermal Resistance (θ
JC
) ..................9°C/W
TQFN
Junction-to Ambient Thermal Resistance (θ
JA
) ...........40°C/W
Junction-to Case Thermal Resistance (θ
JC
) ..................6°C/W
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
Operating Voltage Range (Note 3) V
CC
,
V
BATT
V
CC
or V
BATT
> V
TH
0 5.5 V
V
CC
= 1.62V 1.2 2
V
CC
= 2.8V 1.9 3
V
CC
= 3.6V 2.3 3.5
Supply Current I
CC
V
CC
> V
TH
V
CC
= 5.5V 3.4 5
µA
Supply Current in
Battery-Backup Mode
I
BATT
V
CC
= 0V 0.25 0.5 µA
V
CC
Switchover Threshold Voltage V
CC
rising, V
CC
- V
BATT
0.1
x V
CC
V
BATT Switchover Threshold
Voltage
V
CC
falling, V
CC
< V
TH
, V
CC
- V
BATT
0mV
BATT Standby Current V
CC
> V
BATT
+ 0.2V -10 +10 nA
BATT Freshness Leakage Current V
BATT
= 5.5V 20 nA
V
CC
= 4.75V, I
OUT
= 150mA 1.4 4.5
V
CC
= 3.15V, I
OUT
= 65mA 1.7 4.5
V
CC
= 2.35V, I
OUT
= 25mA 2.1 5.0
V
CC
to OUT On-Resistance R
ON
V
CC
= 1.91V, I
OUT
= 10mA 2.6 5.5
V
BATT
= 4.5V, I
OUT
= 20mA V
BATT
- 0.1
Output Voltage in
Battery-Backup Mode
V
OUT
V
BATT
= 2.5V, I
OUT
= 20mA V
BATT
- 0.15
V
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial
.
MAX16016/MAX16020/MAX16021
Low-Power µP Supervisory Circuits with
Battery-Backup Circuit and Chip-Enable Gating
_______________________________________________________________________________________ 3
ELECTRICAL CHARACTERISTICS (continued)
(V
CC
= 1.53V to 5.5V, V
BATT
= 3V, T
A
= -40°C to +85°C, unless otherwise noted. Typical values are at T
A
= +25°C.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
RESET OUTPUT (RESET, RESET)
Reset Threshold V
TH
(see Table 1) V
V
CC
Falling to Reset Delay t
RD
V
CC
falling at 10V/ms 20 µs
Reset Timeout Period t
RP
145 215 285 ms
V
CC
3.3V, I
SINK
= 3.2mA, RESET asserted 0.3
V
CC
1.6V, I
SINK
= 1mA, RESET asserted 0.3RESET Output Low Voltage V
OL
V
CC
1.2V, I
SINK
= 100µA, RESET asserted 0.3
V
RESET Output High Voltage
(Push-Pull Output)
V
OH
V
CC
= 1.1 x V
TH
, I
SOURCE
= 100µA,
RESET deasserted
V
OUT
- 0.3
V
RESET Output Leakage Current
(Open-Drain Output)
V
RESET
= 5.5V, RESET deasserted 1 µA
V
CC
3.3V, I
SINK
= 3.2mA, RESET
deasserted
0.3
RESET Output Low Voltage V
OL
V
CC
1.8V, I
SINK
= 1.0mA, RESET
deasserted
0.3
V
RESET Output High Voltage
(Push-Pull Output)
V
OH
V
CC
= 0.9 x V
TH
, I
SOURCE
= 100µA,
RESET asserted
V
OUT
- 0.3
V
RESET Output Leakage Current
(Open-Drain Output)
V
RESET
= 5.5V, RESET asserted 1 µA
POWER-FAIL COMPARATOR
PFI, Input Threshold V
PFT
V
IN
falling, 1.6V V
CC
5.5V 0.572 0.590 0.611 V
PFI, Hysteresis V
PFT-HYS
30 mV
PFI Input Current V
CC
= 5.5V -1 +1 µA
V
CC
1.6V, I
SINK
= 1mA, output asserted 0.3
PFO Output Low Voltage V
OL
V
CC
1.2V, I
SINK
= 100µA, output asserted 0.3
V
PFO Output Voltage
High (Push-Pull Output)
V
OH
V
CC
= 1.1 x V
TH
, I
SOURCE
= 100µA, output
asserted
V
OUT
- 0.3
V
PFO, Leakage Current
(Open-Drain Output)
V
PFO
= 5.5V, output deasserted 1 µA
PFO, Delay Time V
PFT
+ 100mV to V
PFT
- 100mV 20 µs
MANUAL RESET (MR)
Input Low Voltage V
IL
0.3 x V
CC
V
Input High Voltage V
IH
0.7 x V
CC
V
Pullup Resistance 20 30 k
Glitch Immunity V
CC
= 3.3V 100 ns
MR to Reset Delay 120 ns

MAX16020PTEV+T

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Supervisory Circuits MPU Supervisor w/Battery-Backup
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union