DLW5AHN402SQ2L Datasheet DLW5AHN402SQ2L | P1-P3

Spec No. JEFL243C-0022E-01 P1/9

MURATA MFG CO.,LTD.

Reference Only

Wire Wound Chip Common Mode Choke Coil

DLW5AHN402SQ2

□

Reference Specification

1. Scope

This reference specification applies to Wire Wound Chip Common Mode Choke Coil DLW5AH Series.

2. Part Numbering

(ex.) DL W 5A H N 402 S Q 2 L

(1) (2) (3) (4) (5) (6) (7) (8) (9)

(1) Chip Common Mode Choke Coil

(2) Structure (W : Winding Type)

(3) Dimension (L×W)

(4) Category

3.Rating

Customer

Part Number

MURATA

Part Number

Impedance

at 10MHz,

Under Standard

Tesiting Conditions

(Ω min.)

Impedance

at 100MHz,

Under Standard

Tesiting Conditions

(Ω Typ.)

Rated

Voltage

V(DC)

Withstanding

Voltage

V(DC)

Rated

Current

(A)

Resistance

(Rdc)

(Ω max.)

Insulation

Resistance

(MΩ min.)

DLW5AHN402SQ2L

300 4000 50 125 0.2 3.0 10

DLW5AHN402SQ2K

DLW5AHN402SQ2B

· Operating Temperature : -25°C to +85°C

· Storage Temperature : - 40 °C to + 85 °C

4. Standard Testing Conditions

< Unless otherwise specified > < In case of doubt >

Temperature : Ordinary Temp. 15 ºC to 35 °C Temperature : 20 °C ± 2 °C

Humidity : Ordinary Humidity 25 %(RH) to 85 %(RH) Humidity : 60 %(RH) to 70 %(RH)

Atmospheric pressure : 86 kPa to 106 kPa

5. Style and Dimensions

(in:mm)

■Equivalent Circuits ■Unit Mass (Typical value)

0.30g

6. Marking

No polarity

(1)

(4)

(2)

(3)

(5) Impedance (Typ. at 100MHz)

(6) Circuit

(7) Features

(8) Number of Line

(9) Packaging Code L : Taping (φ180mm/ reel)

K : Taping(φ330mm reel)

B : Bulk

(L)5.0±0.3

(W)3.6±0.3

1.7

±0.3

1.3

(1) (2)

(4) (3)

(T)4.3max.

0.45min.

Starting position of wiring shall

covered with resin.

: Electrode

1.3

±0.3

1.3

±0.3

0.9

±0.3

0.5min.

±0.3

1.7

±0.3

Spec No. JEFL243C-0022E-01 P2/9

MURATA MFG CO.,LTD.

Reference Only

7. Electrical Performance

No. Item Specifications Test Method

7.1 Impedance

(|Z|) (at 10MHz)

Meet item 3. Measuring Equipment : Agilent 4191A or the

equivalents.

Measuring Frequency : 10MHz (ref. Item 10.)

7.2 Insulation

Resistance

(I.R.)

Measuring Equipment : R8340A or the equivalents.

Test Voltage : 100 V(DC)

Time : within 60 s (ref. Item 10.)

7.3 DC Resistance

(Rdc)

Measuring Current : 100 mA max. (ref. Item 10.)

(In case of doubt in the above mentioned standard

condition,measure by 4 terminal method.)

7.4 Withstanding

Voltage

Products shall not be damaged. Voltage : 125 V(DC)

Time : 60 s

Charge Current : 1 mA max. (ref. Item 10.)

8. Mechanical Performance

No. Item Specifications Test Method

8.1 Appearance and

Dimensions

Meet item 5. Visual Inspection and measured with Slide

Calipers.

8.2 Bonding Strength

and

Core Strength

No evidence of chipping,breakage.

No evidence of coming off

glass-epoxy substrate.

Applying Force (F) : 9.8N

Applying Time : 5 ± 1s

8.3 Body strength No evidence of chipping,breakage. Applying Force (F) : 9.8N

Applying Time : 5 ± 1s

8.4 Bending

Strength

Meet Table 1.

Table 1

Substrate : Glass-epoxy (t=1.6mm)

Deflection : 2mm

Keeping Time : 30 s

Speed of Applying Force : 0.5 mm/s

Appearance No damaged.

Impedance

change

(at 10MHz)

within ± 20%

I.R. 10MΩ min.

Withstanding

Voltage

No damaged.

8.5 Vibration Products shall be soldered on the substrate.

Oscillation Frequency : 10 to 55 to 10Hz for 1 min.

Total Amplitude : 1.5mm

Testing Time : A period of 2 hours in each of

3 mutually perpendicular

directions(Total 6 hours).

8.6 Drop Products shall be dropped concrete or steel board.

Method : free fall

Height : 1m

The Number of Times : 10 direction

Nozzle

Product

Substrate

Test board fixture

R340

Deflection

Product

Pressure jig

(in mm)

Pressure jig

Product

Substrate

Test board fixture

Spec No. JEFL243C-0022E-01 P3/9

MURATA MFG CO.,LTD.

Reference Only

No. Item Specifications Test Method

8.7 Solderability The electrodes shall be at least

90% covered with new solder

coating.

Flux : Ethanol solution of rosin,25(wt)%

Pre heating : 150 ± 10°C, 1 minute.

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 245±5°C

Immersion Time : 4 ± 1s

Immersion and Immersion rates : 25mm/s

8.8 Resistance to

Soldering heat

Meet Table 1. Flux : Ethanol solution of rosin,25(wt)%

Pre heating : 150 ± 10°C, 1 minute.

Solder : Sn-3.0Ag-0.5Cu

Solder Temperature : 270 ± 5°C

Immersion Time : 10 ± 1s

Immersion and Immersion rates : 25mm/s

Then measured after exposure in the room

condition for 4 to 48 hours.

9. Enviromental Performance (Product shall be solderd on the glass-epoxy substrate (t=1.6mm).)

No. Item Specifications Test Method

9.1 Temperature

Cycle

Meet Table 1. 1 cycle

1step : -25 °C (+0, -3)°C/ 30min (+ 3,- 0) min

2 step : Ordinary temp. / 3 min max.

3 step : +85 °C (+3, -0)°C / 30min (+ 3,- 0) min

4 step : Ordinary temp. / 3 min max.

Total of 100 cycles

Then measured after exposure in the room

condition for 4 to 48 hours.

9.2 Humidity Temperature : 40 ± 2 °C

Humidity : 90 to 95 %(RH)

Time : 1000 h (+48 h , -0 h)

Then measured after exposure in the room

condition for 4 to 48 hours.

9.3 Humidity Load Temperature : 40 ± 2 °C

Humidity : 90 to 95 %(RH)

Test Voltage : Rated Voltage

Time : 1000 h (+48 h , -0 h)

Then measured after exposure in the room

condition for 4 to 48 hours. (ref. Item 10.)

9.4 Heat life Temperature : 85 ± 2 °C

Test Voltage : Rated Voltage × 200%

Time : 1000 h (+48 h , -0 h)

Then measured after exposure in the room

condition for 4 to 48 hours. (ref. Item 10.)

9.5 Cold Resistance Temperature : - 40 ± 2 °C

Time : 1000 h (+48 h , -0 h)

Then measured after exposure in the room

condition for 4 to 48 hours. (ref. Item 10.)

Product

Stainless

tweezers

P1-P3 P4-P6 P7-P9

DLW5AHN402SQ2L

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Common Mode Filters / Chokes 2014 4000ohm@100MHz

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DLW5AHN402SQ2L