DLW5AHN402SQ2L

Spec No. JEFL243C-0022E-01 P7/9
MURATA MFG CO.,LTD.
Reference Only
×
×
P.C.B.
Portion of
Perforation
Portion of
Perforation
Product
Pick- up nozzle
Support pin
P.C.B.
Product
(2) Products location on P.C.B. near seam for separation.
Products (A,B,C,D) shall be located carefully
so that products are not subject to the
mechanical stress due to warping the board.
Because they may be subjected the mechanical
stress in order of A
>C>B D.
14.6. Attention Regarding P.C.B. Design
< The Arrangement of Products >
•P.C.B. shall be designed so that products are
far from the portion of perforation.
•The portion of perforation shall be designed
as narrow as possible, and shall be designed
so as not to be applied the stress in the case
of P.C.B. separation.
•Products shall not be arranged on the
line of a series of holes when there
are big holes in P.C.B.
(Because the stress concentrate on the
line of holes.)
< Products Placing >
•Support pins shall be set under P.C.B.
to prevent causing a warp to P.C.B.
during placing the products on the other
side of P.C.B..
< P.C.B. Separation >
•P.C.B. shall not be separated with hand.
P.C.B. shall be separated with the fixture so as not to cause P.C.B. bending.
14.7. Standard Land Dimensions
Seam
Slit
A
D
B
C
b
a
Lengh:a<b
Product
P.C.B.
Hole
×
0.9
2.9
5.5
1.3
3.3
4.7
*
(1)(2)(3)(4) indicates terminal number
.
(1)(2)
(4)(3)
Resist
Copper foil pattern
No pattern
(in mm)
Spec No. JEFL243C-0022E-01 P8/9
MURATA MFG CO.,LTD.
Reference Only
14.8. Reflow Soldering
(1) Standard printing pattern of solder paste
Standard thickness of solder paste
should be 150 to 200µm.
Solderability is subjected to reflow condition
and thermal conductivity.
Please make sure that your product has been evaluated
in view of your specifications with our product being
mounted to your product.
Use the solder paste printing pattern of the
right pattern.
For the resist and copper foil pattern,
use standard land dimensions.
Use the Solder Sn-3.0Ag-0.5Cu for pattern printing.
(2) Soldering Conditions
Standard soldering profile and the limit soldering profile is as follows.
The excessive limit soldering conditions may cause leaching of the electrode and / or resulting
in the deterioration of product quality.
Standard Profile Limit Profile
Pre-heating 150180°C 90s±30s
Heating above 220°C30s60s above 230°C60s max.
Peak temperature 250±3°C 260°C10s
Cycle of reflow 2 times 2 times
14.9. Reworking with Soldering iron
The following conditions must be strictly followed when using a soldering iron after being mounted
by reflow soldering.
· Pre-heating: 150°C, 1 min · Soldering iron output: 30W max.
· Tip temperature: 350°C max. · Tip diameter:φ3mm max.
· Soldering time : 3(+1,-0) seconds. · Times : 2times max.
Notes: Do not touch the products directly with the soldering iron.
0.9
2.9
5.5
1.3
3.3
4.7
(in mm)
150
90s±30s
Time(s)
250±3°C
Tem
p
.
(°C)
220°C
3060s
180
260°C,10s
230°C
60s max.
Limit Profile
Standard Profile
Spec No. JEFL243C-0022E-01 P9/9
MURATA MFG CO.,LTD.
Reference Only
14.10 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to
the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening
screw to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
14.11 Brushing of neighborhood of products
When you clean the neighborhood of products such as connector pins, bristles of cleaning brush
shall not be touched to the winding portion to prevent the breaking of wire.
14.12. Operating Environment
Do not use this product under the following environmental conditions,on deterioration of the performance,
such as inslation resistance may result from the use.
(1) in corrosive gases (acidic gases,alkaline gases,chlorine,sulfur gases,organic gases and etc.)
(2) in the atmosphere where liquid such as organic solvent,may splash on the products.
14.13. Storage condition
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage environment conditions
· Products should be stored in the warehouse on the following conditions.
Temperature : -10 °C to +40 °C
Humidity : 15 % to 85% relative humidity No rapid change on temperature and humidity.
·Products should be stored in corrosive gases, such as sulfureous, acid gases, alkaline gases,
to prevent the following deterioration.
Poor solderabirity due to the oxidized electrode.
· Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.
· Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
· Products should not be stored under the air tights packaged condition.
(3) Delivery
Care should be taken when transporting or handling product to avoid excessive vibration or mechanical shock.
15.
!
Note
(1)Please make sure that your product has been evaluated in view of your specifications with our product being
mounted to your product.
(2)You are requested not to use our product deviating from the reference specifications.
(3)The contents of this reference specification are subject to change without advance notice. Please approve our
product specifications or transact the approval sheet for product specifications before ordering.

DLW5AHN402SQ2L

Mfr. #:
Manufacturer:
Description:
Common Mode Filters / Chokes 2014 4000ohm@100MHz
Lifecycle:
New from this manufacturer.
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