87974I Data Sheet
©2016 Integrated Device Technology, Inc Revision E January 26, 201610
FIGURE 2A. 87974I LVCMOS/LVTTL ZERO DELAY BUFFER SCHEMATIC EXAMPLE
LAYOUT GUIDELINE
The schematic of the 87974I layout example used in this layout
guideline is shown in Figure 2A. The 87974I recommended
PCB board layout for this example is shown in Figure 2B. This
layout example is used as a general guideline. The layout in the
actual system will depend on the selected component types,
the density of the components, the density of the traces, and
the stack up of the P.C. board.
Q1
3.3V LVCMOS Driver
Zo = 50 Ohm
RS
C13
0.01u
3.3V
VDDO
(U1-49)(U1-45)(U1-41)
C12
0.1uF
C9
0.1uF
C10
0.1uF
nMR
Reset
pulse or
pull up
(U1-28)(U1-17) (U1-33)(U1-22) (U1-37)(U1-26)
VDD
CLK_EN
PLL_SEL
SELA
SELB
SELC
CLK_SEL
RU6
SP
RD6
1K
RU5
SP
RD2
SP
RD4
1K
RU4
SP
RD5
1K
RU7
SP
RD3
SP
RU3
1K
RD7
1K
RU2
1K
C8
0.1uF
R7
10
C6
0.1uF
C7
0.1uF
C16
10u
C5
0.1uF
C4
0.1uF
C11
0.01u
SP = Space (i.e. not intstalled)
C3
0.1uF
VDD
U3
87974
GND
1
nMR
2
CLK_EN
3
SELB
4
SELC
5
PLL_SEL
6
SELA
7
CLK_SEL
8
CLK0
9
CLK1
10
nc
11
VDD
12
VDDA
13
FB_SEL0
14
GND
15
QA4
16
VDDOA
17
QA3
18
GND
19
FB_SEL1
20
QA2
21
VDDOA
22
QA1
23
GND
24
QA0
25
VDDOA
26
GND
39
QB1
38
VDDOB
37
QB2
36
GND
35
QB3
34
VDDOB
33
QB4
32
FB_IN
31
GND
30
QFB
29
VDDOFB
28
nc
27
VCO_SEL
52
GND
51
QC0
50
VDDOC
49
QC1
48
GND
47
QC2
46
VDDOC
45
QC3
44
GND
43
nc
42
VDDOB
41
QB0
40
VDDO
R5
43
Zo = 50
Receiver
R8
43
Receiver
Receiver
R1
43
Receiver
Zo = 50
Zo = 50
Zo = 50
R3
43
CLK_SEL
CLK_EN
SELB
SELC
VDD
PLL_SEL
SELA
VCO_SEL
Example of Reconfigurable Logic Control Input
87974I Data Sheet
©2016 Integrated Device Technology, Inc Revision E January 26, 201611
FIGURE 2B. PCB BOARD LAYOUT FOR 87974I
The following component footprints are used in this layout
example:
All the resistors and capacitors are size 0603.
POWER AND GROUNDING
Place the decoupling capacitors as close as possible to the pow-
er pins. If space allows, placement of the decoupling capacitor
on the component side is preferred. This can reduce unwanted
inductance between the decoupling capacitor and the power
pin caused by the via.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power
and ground planes and the component power and ground pins.
The RC fi lter consisting of R7, C11, and C16 should be placed
as close to the V
DDA
pin as possible.
CLOCK TRACES AND TERMINATION
Poor signal integrity can degrade the system performance or
cause system failure. In synchronous high-speed digital sys-
tems, the clock signal is less tolerant to poor signal integrity
than other signals. Any ringing on the rising or falling edge or
excessive ring back can cause system failure. The shape of the
trace and the trace delay might be restricted by the available
space on the board and the component location. While routing
the traces, the clock signal traces should be routed fi rst and
should be locked prior to routing other signal traces.
The differential 50Ω output traces should have same
length.
Avoid sharp angles on the clock trace. Sharp angle turns
cause the characteristic impedance to change on the
transmission lines.
Keep the clock traces on the same layer. Whenever pos-
sible, avoid placing vias on the clock traces. Placement
of vias on the traces can affect the trace characteristic
impedance and hence degrade signal integrity.
To prevent cross talk, avoid routing other signal traces
in parallel with the clock traces. If running parallel traces
is unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
Make sure no other signal traces are routed between
the clock trace pair.
The series termination resistors should be located as
close to the driver pins as possible.
87974I Data Sheet
©2016 Integrated Device Technology, Inc Revision E January 26, 201612
RELIABILITY INFORMATION
TRANSISTOR COUNT
The transistor count for 87974I is: 4225
TABLE 6. θ
JA
VS. AIR FLOW TABLE FOR 52 LEAD LQFP
θ
JA
by Velocity (Linear Feet per Minute)
0 200 500
Single-Layer PCB, JEDEC Standard Test Boards 58.0°C/W 47.1°C/W 42.0°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 42.3°C/W 36.4°C/W 34.0°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.

87974CYILFT

Mfr. #:
Manufacturer:
IDT
Description:
Clock Generators & Support Products Low Skew 1-to-15 LVC MOS Clock Generator
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
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