LT3782
16
3782fg
For best electrical performance, the LT3782 circuit should
be laid out as follows:
Place all power components in a tight area. This will
minimize the size of high current loops. Orient the input
and output capacitors and current sense resistors in a way
that minimizes the distance between the pads connected
to ground plane.
Place the LT3782 and associated components tightly to-
gether and next to the section with power components.
Use a local via to ground plane for all pads that connect to
ground. Use multiple vias for power components.
Connect the current sense inputs of LT3782 directly to the
current sense resistor pads. Connect the current sense
traces on the opposite sides of pads from the traces
carrying the MOSFETs source currents to ground. This
technique is referred to as Kelvin sensing.
APPLICATIONS INFORMATION
LT3782
17
3782fg
I
OUT
(A)
0
EFFICIENCY (%)
100
96
98
94
92
90
88
86
7
3782 TA02b
12 4 6
3
5
8
12V
IN
15V
IN
Effi ciency
10Ω
CS2
C
OUT2
330μF, 35V, 2x
+
27
26
25
24
23
22
21
20
19
18
17
16
15
28
2
3
4
5
6
7
8
9
10
11
12
13
14
1
10Ω
CS1
59k
82k
274k
825k
2R2
24.9k
221k
R
C1
13.3k
10nF
4.7nF
C
C2
100pF
C
C1
6.8nF
2.2μF
C
IN
22μF
25V
C
OUT1
22μF, 25V, 4x
10nF
1μF
3782 TA02
10V TO 24V INPUT
Q1
PH3330
Q2
PH3330
OUTPUT
24V
8A
L1, L2: PULSE PB2020-103
ALL CERAMIC CAPACITORS ARE X7R, TDK
*OUTPUT CURRENT WITH BOTH INPUTS PRESENT
L1
PB2020-103
D1
UPS840
L2
PB2020-103
D2
UPS840
CS1
CS2
0.004Ω
0.004Ω
LT3782
V
CC
NC
NC
V
EE1
BGATE1
GBIAS1
GBIAS2
BGATE2
V
EE2
NC
RUN
FB
V
C
GBIAS
SGATE1
NC
GND
SYNC
DELAY
DCL
SENSE1
+
SENSE1
SLOPE
R
SET
SENSE2
SENSE2
+
SS
SGATE2
10V to 24V Input to 24V, 8A Output Boost Converter
TYPICAL APPLICATIONS
LT3782
18
3782fg
FE Package
28-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
Exposed Pad Variation EB
FE28 (EB) TSSOP 0204
0.09 – 0.20
(.0035 – .0079)
0° – 8°
0.25
REF
0.50 – 0.75
(.020 – .030)
4.30 – 4.50*
(.169 – .177)
134
5
6
7
8910
11
12 13 14
192022 21 151618 17
9.60 – 9.80*
(.378 – .386)
4.75
(.187)
2.74
(.108)
28 2726 25 24 23
1.20
(.047)
MAX
0.05 – 0.15
(.002 – .006)
0.65
(.0256)
BSC
0.195 – 0.30
(.0077 – .0118)
TYP
2
RECOMMENDED SOLDER PAD LAYOUT
EXPOSED
PAD HEAT SINK
ON BOTTOM OF
PACKAGE
0.45 ±0.05
0.65 BSC
4.50 ±0.10
6.60 ±0.10
1.05 ±0.10
4.75
(.187)
2.74
(.108)
MILLIMETERS
(INCHES)
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
SEE NOTE 4
4. RECOMMENDED MINIMUM PCB METAL SIZE
FOR EXPOSED PAD ATTACHMENT
6.40
(.252)
BSC
PACKAGE DESCRIPTION

LT3782EFE#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators 2-Phase Step-Up Controller
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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