NDS9953A

February 1996
NDS9953A
Dual P-Channel Enhancement Mode Field Effect Transistor
General Description Features
________________________________________________________________________________
Absolute Maximum Ratings T
A
= 25°C unless otherwise noted
Symbol Parameter NDS9953A Units
V
DSS
Drain-Source Voltage -30 V
V
GSS
Gate-Source Voltage ± 20 V
I
D
Drain Current - Continuous (Note 1a) ± 2.9 A
- Pulsed ± 10
P
D
Power Dissipation for Dual Operation 2 W
Power Dissipation for Single Operation (Note 1a) 1.6
(Note 1b) 1
(Note 1c) 0.9
T
J
,T
STG
Operating and Storage Temperature Range -55 to 150 °C
THERMAL CHARACTERISTICS
R
θ
JA
Thermal Resistance, Junction-to-Ambient (Note 1a) 78 °C/W
R
θ
JC
Thermal Resistance, Junction-to-Case (Note 1) 40 °C/W
NDS9953A.SAM
-2.9A, -30V. R
DS(ON)
= 0.13 @ V
GS
= -10V.
High density cell design for extremely low R
DS(ON)
.
High power and current handling capability in a widely used
surface mount package.
Dual MOSFET in surface mount package.
These P-Channel enhancement mode power field effect
transistors are produced using Fairchild's proprietary, high
cell density, DMOS technology. This very high density
process is especially tailored to minimize on-state resistance,
provide superior switching performance, and withstand high
energy pulses in the avalanche and commutation modes.
These devices are particularly suited for low voltage
applications such as notebook computer power management
and other battery powered circuits where fast switching, low
in-line power loss, and resistance to transients are needed.
1
5
6
7
8
4
3
2
© 1997 Fairchild Semiconductor Corporation
Electrical Characteristics (T
A
= 25°C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units
OFF CHARACTERISTICS
BV
DSS
Drain-Source Breakdown Voltage V
GS
= 0 V, I
D
= -250 µA -30 V
I
DSS
Zero Gate Voltage Drain Current
V
DS
= -24 V, V
GS
= 0 V
-2 µA
T
J
= 55°C
-25 µA
I
GSSF
Gate - Body Leakage, Forward V
GS
= 20 V, V
DS
= 0 V 100 nA
I
GSSR
Gate - Body Leakage, Reverse
V
GS
= -20 V, V
DS
= 0 V
-100 nA
ON CHARACTERISTICS (Note 2)
V
GS(th)
Gate Threshold Voltage V
DS
= V
GS
, I
D
= -250 µA -1 -1.6 -2.8 V
T
J
= 125°C
-0.85 -1.25 -2.5
R
DS(ON)
Static Drain-Source On-Resistance
V
GS
= -10 V, I
D
= -1.0 A
0.11 0.13
T
J
= 125°C 0.15 0.21
V
GS
= -4.5 V, I
D
= -0.5 A
0.17 0.2
T
J
= 125°C
0.24 0.32
I
D(on)
On-State Drain Current V
GS
= -10 V, V
DS
= -5 V -10 A
V
GS
= -4.5 V, V
DS
= -5 V
-1.5
g
FS
Forward Transconductance V
DS
= -15 V, I
D
= -2.9 A 4 S
DYNAMIC CHARACTERISTICS
C
iss
Input Capacitance
V
DS
= -10 V, V
GS
= 0 V,
f = 1.0 MHz
350 pF
C
oss
Output Capacitance 260 pF
C
rss
Reverse Transfer Capacitance 100 pF
SWITCHING CHARACTERISTICS (Note 2)
t
D(on)
Turn - On Delay Time V
DD
= -10 V, I
D
= -1 A,
V
GEN
= -10 V, R
GEN
= 6
9 40 ns
t
r
Turn - On Rise Time 21 40 ns
t
D(off)
Turn - Off Delay Time 21 90 ns
t
f
Turn - Off Fall Time 8 50 ns
Q
g
Total Gate Charge V
DS
= -10 V,
I
D
= -2.9 A, V
GS
= -10 V
10 25 nC
Q
gs
Gate-Source Charge 1.6 nC
Q
gd
Gate-Drain Charge 3.4 nC
NDS9953A.SAM
Electrical Characteristics (T
A
= 25°C unless otherwise noted)
Symbol Parameter Conditions Min Typ Max Units
DRAIN-SOURCE DIODE CHARACTERISTICS AND MAXIMUM RATINGS
I
S
Maximum Continuous Drain-Source Diode Forward Current -1.2 A
V
SD
Drain-Source Diode Forward Voltage
V
GS
= 0 V, I
S
= -1.25 A
(Note 2)
-0.8 -1.3 V
t
rr
Reverse Recovery Time V
GS
= 0 V, I
F
= -1.25 A, dI
F
/dt = 100 A/µs 100 ns
Notes:
1. R
θ
JA
is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R
θ
JC
is guaranteed by
design while R
θ
CA
is determined by the user's board design.
P
D
(
t
)
=
T
J
T
A
R
θJ A
(t)
=
T
J
T
A
R
θJ C
+R
θCA
(
t
)
= I
D
2
(t) × R
DS(ON ) T
J
Typical R
θ
JA
for single device operation using the board layouts shown below on 4.5"x5" FR-4 PCB in a still air environment:
a. 78
o
C/W when mounted on a 0.5 in
2
pad of 2oz cpper.
b. 125
o
C/W when mounted on a 0.02 in
2
pad of 2oz cpper.
c. 135
o
C/W when mounted on a 0.003 in
2
pad of 2oz cpper.
Scale 1 : 1 on letter size paper
2. Pulse Test: Pulse Width < 300µs, Duty Cycle < 2.0%.
NDS9953A.SAM
1a
1b
1c

NDS9953A

Mfr. #:
Manufacturer:
ON Semiconductor / Fairchild
Description:
MOSFET SO-8 P-CH ENHANCE
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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