CY7C1019CV33-10ZXA

CY7C1019CV33
Document Number: 38-05130 Rev. *O Page 10 of 14
Package Diagram
Figure 8. 32-pin TSOP II (20.95 × 11.76 × 1.0 mm) ZS32 Package Outline, 51-85095
51-85095 *D
CY7C1019CV33
Document Number: 38-05130 Rev. *O Page 11 of 14
Acronyms Document Conventions
Units of Measure
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
CE
Chip Enable
I/O Input/Output
OE
Output Enable
SRAM Static Random Access Memory
TSOP Thin Small Outline Package
TTL Transistor-Transistor Logic
WE
Write Enable
Symbol Unit of Measure
°C degree Celsius
MHz megahertz
µA microampere
mA milliampere
mm millimeter
ms millisecond
ns nanosecond
% percent
pF picofarad
Vvolt
Wwatt
CY7C1019CV33
Document Number: 38-05130 Rev. *O Page 12 of 14
Document History Page
Document Title: CY7C1019CV33, 1-Mbit (128 K × 8) Static RAM
Document Number: 38-05130
Rev. ECN No.
Submission
Date
Orig. of
Change
Description of Change
** 109245 12/16/01 HGK New data sheet.
*A 113431 04/10/02 NSL Updated AC Test Loads and Waveforms:
AC Test Loads split based on speed.
*B 115047 08/01/02 HGK Added TSOP II Package related information in all instances across the
document.
Added Industrial Temperature related information in all instances across the
document.
Improved I
CC
limits in all instances across the document.
*C 119796 10/11/02 DFP Updated Selection Guide (Changed value of maximum standby current from
5 nA to 5 mA).
*D 123030 12/17/02 DFP Updated Truth Table (To reflect single Chip Enable option).
*E 419983 See ECN NXR Added 48-ball VFBGA Package related information in all instances across the
document.
Updated Ordering Information:
Added lead-free parts.
Replaced “Package Name” with “Package Diagram” in column heading and
updated details in the column.
*F 493543 See ECN NXR Removed 8 ns speed bin related information in all instances across the
document.
Updated Pin Configuration:
Added Note 1 and referred the same note in Figure 1.
Updated Electrical Characteristics:
Changed the description of I
IX
parameter from “Input Load Current” to “Input
Leakage Current”.
Removed I
OS
parameter and its details.
Updated Ordering Information.
*G 2761448 09/09/2009 VKN Added Automotive-A Temperature Range related information in all instances
across the document.
*H 2897691 03/23/2010 RAME Updated Ordering Information.
Updated Package Diagram.
*I 3057593 10/13/2010 PRAS Updated Ordering Information and added Ordering Code Definitions.
Updated Package Diagram.
*J 3072834 11/11/2010 PRAS Updated Ordering Information:
Removed obsolete parts.
Updated Package Diagram.
*K 3277371 06/08/2011 AJU Updated Features.
Updated Selection Guide (Removed -12 (Industrial) and -15 (Industrial)
columns).
Updated Electrical Characteristics (Removed -12 (Industrial) and -15
(Industrial) columns).
Updated Switching Characteristics (Removed -12 (Industrial) and -15
(Industrial) columns).
Updated Package Diagram.
Updated to new template.
*L 4146968 10/04/2013 VINI Updated to new template.
Completing Sunset Review.

CY7C1019CV33-10ZXA

Mfr. #:
Manufacturer:
Cypress Semiconductor
Description:
SRAM 1Mb 128K x 8 Fast Async SRAM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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