OMO ElectronicOMO Electronic
Expand menu
Hello, Sign inMy Account
0 Cart

SL3S1203FUF,003

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 7 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
9. Mechanical specification
The UCODE G2iL/G2iL+ wafers are available in 75 m and 120 m thickness. The 75m
thick wafer allows ultra thin label design but require a proper tuning of the glue dispenser
during production. Because of the more robust structure of the 120m wafer, the wafer is
ideal for harsh applications. The 120 m thick wafer is also enhanced with 7m Polyimide
spacer allowing additional protection of the active circuit.
9.1 Wafer specification
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”.
9.1.1 Wafer
Table 5. Specifications
Wafer
Designation each wafer is scribed with batch number
and wafer number
Diameter 200 mm (8”)
Thickness
SL3S12x3FUF 75
m 15 m
SL3S12x3FUD 120
m 15 m
Number of pads
4
Pad location non diagonal/ placed in chip corners
Distance pad to pad RFN-RFP 333.0
m
Distance pad to pad OUT-RFN 383.0
m
Process CMOS 0.14
m
Batch size 25 wafers
Potential good dies per wafer 139.351
Wafer backside
Material Si
Treatment ground and stress release
Roughness R
a
max. 0.5 m, R
t
max. 5 m
Chip dimensions
Die size including scribe 0.485 mm 0.435 mm = 0.211 mm
2
Scribe line width: x-dimension = 15 m
y-dimension = 15
m
Passivation on front
Type Sandwich structure
Material PE-Nitride (on top)
Thickness 1.75 m total thickness of passivation
Polyimide spacer 7 m 1 m (SL3S12x3FUD only)
Au bump
Bump material > 99.9 % pure Au
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 8 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
[1] Because of the 7 m spacer, the bump will measure 18 m relative height protruding the spacer.
9.1.2 Fail die identification
No inkdots are applied to the wafer.
Electronic wafer mapping (SECS II format) covers the electrical test results and
additionally the results of mechanical/visual inspection.
See Ref. 20 “
Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
9.1.3 Map file distribution
See Ref. 20 “Data sheet - Delivery type description – General specification for 8” wafer on
UV-tape with electronic fail die marking, BU-ID document number: 1093**”
10. Functional description
10.1 Air interface standards
The UCODE G2iL fully supports all parts of the "Specification for RFID Air Interface
EPCglobal, EPC Radio-Frequency Identity Protocols, Class-1 Generation-2 UHF RFID,
Protocol for Communications at 860 MHz to 960 MHz, Version 1.2.0".
10.2 Power transfer
The interrogator provides an RF field that powers the tag, equipped with a UCODE G2iL.
The antenna transforms the impedance of free space to the chip input impedance in order
to get the maximum possible power for the G2iL on the tag. The G2iL+ can also be
supplied externally.
The RF field, which is oscillating on the operating frequency provided by the interrogator,
is rectified to provide a smoothed DC voltage to the analog and digital modules of the IC.
Bump hardness 35 – 80 HV 0.005
Bump shear strength > 70 MPa
Bump height
SL3S12x3FUF 18
m
SL3S12x3FUD 25
m
[1]
Bump height uniformity
within a die
2 m
– within a wafer
3 m
– wafer to wafer
4 m
Bump flatness
1.5 m
Bump size
– RFP, RFN
60
60 m
– OUT, VDD
60
60 m
Bump size variation
5 m
Table 5. Specifications
SL3S1203_1213 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved.
Product data sheet
COMPANY PUBLIC
Rev. 4.4 — 17 March 2014
178844 9 of 37
NXP Semiconductors
SL3S1203_1213
UCODE G2iL and G2iL+
The antenna that is attached to the chip may use a DC connection between the two
antenna pads. Therefore the G2iL also enables loop antenna design. Possible examples
of supported antenna structures can be found in the reference antenna design guide.
10.3 Data transfer
10.3.1 Reader to tag Link
An interrogator transmits information to the UCODE G2iL by modulating an UHF RF
signal. The G2iL receives both information and operating energy from this RF signal. Tags
are passive, meaning that they receive all of their operating energy from the interrogator's
RF waveform. In order to further improve the read range the UCODE G2iL+ can be
externally supplied as well so the energy to operate the chip does not need to be
transmitted by the reader.
An interrogator is using a fixed modulation and data rate for the duration of at least one
inventory round. It communicates to the G2iL by modulating an RF carrier using DSB-ASK
with PIE encoding.
For further details refer to Section 16
, Ref. 1. Interrogator-to-tag (R=>T) communications.
10.3.2 Tag to reader Link
An interrogator receives information from a G2iL by transmitting an unmodulated RF
carrier and listening for a backscattered reply. The G2iL backscatters by switching the
reflection coefficient of its antenna between two states in accordance with the data being
sent. For further details refer to Section 16
, Ref. 1, chapter 6.3.1.3.
The UCODE G2iL communicates information by backscatter-modulating the amplitude
and/or phase of the RF carrier. Interrogators shall be capable of demodulating either
demodulation type.
The encoding format, selected in response to interrogator commands, is either FM0
baseband or Miller-modulated subcarrier.
10.4 G2iL and G2iL+ differences
The UCODE G2iL is tailored for application where mainly EPC or TID number space is
needed. The G2iL+ in addition provides functionality such as tag tamper alarm, external
supply operation to further boost read/write range (external supply mode), a Privacy mode
reducing the read range or I/O functionality (data transfer to externally connected devices)
required.
The following table provides an overview of G2iL, G2iL+ special features.
Table 6. Overview of G2iL and G2iL+ features
Features G2iL G2iL+
Read protection (bankwise) yes yes
PSF (Built-in
Product Status Flag) yes yes
Backscatter strength reduction yes yes
Real read range reduction yes yes
Digital switch / Digital input - yes
External supply mode - yes
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P33P34-P36P37-P37

SL3S1203FUF,003

Mfr. #:
Buy SL3S1203FUF,003
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders UCODE G2IL AND G2IL+
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

Products related to this Datasheet