BGF106CE6328XTSA1

Power Management & Multimarket
Datasheet
Rev. 3.1, 2013-01-16
Final
BGF106C
SIM Card Interface Filter and ESD Protection
BGF106C
Hipac
High performance passive and actives on chip
BGF106C
Final Datasheet 2 Rev. 3.1, 2013-01-16
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, EconoPACK™, CoolMOS™, CoolSET™,
CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, EasyPIM™, EconoBRIDGE™, EconoDUAL™,
EconoPIM™, EconoPACK™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™,
ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, ORIGA™,
POWERCODE™; PRIMARION™, PrimePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™,
ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™,
PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR
development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™,
FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG.
FLEXGO™ of Microsoft Corporation. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of
Hilgraeve Incorporated. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of
MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA
MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of
OmniVision Technologies, Inc. Openwave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF
Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™
of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co.
TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™
of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas
Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes
Zetex Limited.
Last Trademarks Update 2011-11-11
Revision History Rev. 3.0, 2011-05-13
Page or Item Subjects (major changes since previous revision)
Rev. 3.1, 2013-01-16
4 Features updated
BGF106C
SIM Card Interface Filter and ESD Protection
Final Datasheet 3 Rev. 3.1, 2013-01-16
1 SIM Card Interface Filter and ESD Protection
1.1 Features
1.2 Description
BGF106C is an ESD protection circuit and filtering interface for SIM cards. All external IOs are protected against
ESD pulses of
±15 kV contact discharge according to IEC61000-4-2. The wafer level package is a green lead-free
and halogen-free package with a size of only 1.2 mm x 1.2 mm and a total height of 0.6 mm
Figure 1-1 Schematic Diagram and Package Configuration
ESD protection circuit and interface filter for SIM cards
ESD protection according to IEC61000-4-2 for
±15 kV contact discharge on external
IOs
Wafer level package with SnAgCu solder balls
•400μm solder ball pitch
Pb-free (RoHS compliant) and halogen free package
Type Package Marking Chip
BGF106C WLP-8-11 6C N0727
WLP-8-11-N-3D
BGF106_ schematic_app.vsd
GND, B2
C1
B1
A2
C3
B3
A3
R1, 100Ω
R2, 47Ω
R3, 100Ω
C2
Vcc
RST_extRST_int
CLK_int CLK_ext
Data I/O_extData I/O_int

BGF106CE6328XTSA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
FILTER RC 290MHZ ESD SMD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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