BGF106CE6328XTSA1

BGF106C
Characteristics
Final Datasheet 4 Rev. 3.1, 2013-01-16
2 Characteristics
Attention: Stresses above the max. values listed here may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device
reliability. Maximum ratings are absolute ratings; exceeding only one of these values may
cause irreversible damage to the integrated circuit.
2.1 Electrical Characteristics
Table 2-1 Maximum Ratings
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Voltage at all pins to GND
V
P
0–5.5V
Operating temperature range
T
OP
-40 +85 °
Storage temperature range
T
STG
-65 +150 °C
Summed up input power for all pins
P
in
––60mWT
S
<7C
Electrostatic discharge according to IEC61000-4-2
Contact discharge at internal pins A3, B3, C3 to
any other pin
V
ESD
-2 2 kV
Contact discharge at external pins A2, B1, C1,
C2 to GND
V
ESD
-15 15 kV
Table 2-2 Electrical Characteristics
1)
1) at T
A
=2C
Parameter Symbol Values Unit Note /
Test Condition
Min. Typ. Max.
Resistors
R
1
, R
3
R
1,3
80 100 120
Resistor
R
2
R
2
37.6 47 56.4
Reverse current of ESD protection diodes
I
R
1
2
100
1000
nA
nA
V =3V
V =5V
Breakdown voltage of ESD diodes
V
(BR)
6.5 7.8 V I
(BR)
=1mA
Line capacitance
Capacitance of all lines to GND
C
T
–16.520pFV =0V
BGF106C
Typical Characteristics
Final Datasheet 5 Rev. 3.1, 2013-01-16
3 Typical Characteristics
Figure 3-1 Insertion loss, Z
S
=Z
L
=50 Ω
Figure 3-2 Cross talk, Z
S
=Z
L
=50 Ω (all unused input and output pins are terminated with 50 Ω)
Typical Insertion Loss
-40
-35
-30
-25
-20
-15
-10
-5
0
1 10 100 1000 10000
f [MHz]
S21 [dB]
Line B3-B1
Line C3-C1
Line A3-A2
Typical Cross Talk
-120
-100
-80
-60
-40
-20
0
1 10 100 1000 10000
f [MHz]
S21 [dB]
BGF106C
Package
Final Datasheet 6 Rev. 3.1, 2013-01-16
4 Package
Figure 4-1 WLP-8-11 Package outline (dimension in mm)
Figure 4-2 WLP-8-11 Footprint (dimension in mm)
Figure 4-3 WLP-8-11 Packing (dimension in mm)
2)
COPLANARITY
0.6
SEATING PLANE
0.08
8x
C
C
STANDOFF
3)
±0.05
0.2
±0.05
0.1
C
0.4
±0.05
1.2
B
2 x 0.4 = 0.8
0.4
1.2
±0.05
A
A
8x
ø0.05
M
0.25
B
±0.04
1)
3) Primary datum C and seating plane are defined by the domed crowns of the balls
1) Dimension is measured at the maximum solder ball diameter, parallel to primary datum C
2) A1 corner identified by marking
WLP-8-11-N-PO V01
2 x 0.4 = 0.8
A3 A2
B3
C3
B2 B1
C2 C1
(0.
2
)
±0.05
(0.
2
)
±0.05
(0.
2
)
±0.05
(0.
2
)
±0.05
Pin A1
Corner Index Area
Solder balls face down Solder balls face up
WLP-8-11-N-
FP V01
0.4
0.8
0.4
0.8
0.25
WLP-8-11-N-TP V01
Pin A1
Corner Index Area
8
±0.1
1.33
±0.05
1.33
±0.05
0.25
0.75
±0.1
4

BGF106CE6328XTSA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
FILTER RC 290MHZ ESD SMD
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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