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ATZB-900-B0

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20
Specifications
ZigBit™ 700/800/900 MHz Wireless Modules 3-9
8227C–MCU Wireless–06/09
Figure 3-3. Typical Reference Schematic
3.4 Mounting Information
The below diagrams show the PCB layout recommended for ZigBit 900 module. Neither via-holes nor
wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement,
RF_GND pins should be grounded via several holes to be located right next to the pins thus minimizing
inductance and preventing both mismatch and losses.
SPI_CLK
SPI_MISO
SPI_MOSI
GPIO0
GPIO1
GPIO2
OSC32K_OUT
RESET
DGND
CPU_CLK
I2C_CLK
I2C_DATA
UART_TXD
UART_RXD
UART_RTS
UART_CTS
GPIO6
GPIO7
GPIO3
GPIO4
GPIO5
DGND
DGND
D_VCC
D_VCC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
JTAG_TMS
JTAG_TDI
JTAG_TDO
JTAG_TCK
ADC_INPUT_3
ADC_INPUT_2
ADC_INPUT_1
BAT
A_VREF
AGND
GPIO9
UART_DTR
USART0_RXD
USART0_TXD
USART0_EXTCLK
GPIO8
IRQ_7
IRQ_6
RF_GND
RFP_IO
RF_GND
RFN_IO
RF_GND
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
JTAG_VCC
NC
JTAG_TCK
JTAG_TDI
JTAG_TDO
JTAG_TMS
NC
JTAG_RST
5
9
3
1
4
7
8
6
JTAG_GND
2
JTAG_GND
10
100k
1uF
Host MCU
UART_CTS
UART_RTS
UART_TXD
UART_RXD
VCC
1,8..3,6V
*) 68 pF
GRM 1555C1H101JZ01D
VCC
RST
44
45
46
47
48
Balun
0900BL18B100
5
6
4
3
1
2
two capacitors*
Specifications
ZigBit™ 700/800/900 MHz Wireless Modules 3-10
8227C–MCU Wireless–06/09
Figure 3-4. ATZB-900-B0 PCB Recommended Layout, Top View
3.5 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended, as given below.
Note: 1. The package is backward compatible with Pb/Sn soldering profile
3.6 Antenna Reference Design
This section presents PCB design which may be used to combine ZigBit 900 with an external antenna
This antenna reference designs is recommended for successful design-in.
Table 3-7. Soldering Profile
(1)
Profile Feature Green Package
Average ramp-up rate (217 °C to peak) 3 °C/s max.
Preheat temperature 175 °C ± 25 °C 180 s max.
Temperature maintained above 217 °C 60 s to 150 s
Time within 5 °C of actual peak temperature 20 s to 40 s
Peak temperature range 6 °C/s max.
Ramp-down rate 8 minutes max.
Specifications
ZigBit™ 700/800/900 MHz Wireless Modules 3-11
8227C–MCU Wireless–06/09
Figure 3-5. FCC/CE compliant RF reference design with RP-SMA connector recommended for ATZB-900-B0
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors
are the board material and thickness, shields, the material used for enclosure, the board neighborhood,
and other components adjacent to antenna.
3.6.1 General recommendations
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
Placing high profile components next to antenna should be avoided.
Having holes punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
ZigBit 900 module should not be placed next to the consumer electronics which might interfere with
ZigBit 900's RF frequency band.
The board design should prevent propagation of microwave field inside the board material. Electromag-
netic waves of high frequency may penetrate the board thus making the edges of the board radiate,
which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes must be
placed around the board's edges.
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P20

ATZB-900-B0

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Description:
RF TXRX MODULE 802.15.4 RP-SMA
Lifecycle:
New from this manufacturer.
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