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PMEG3010AESAYL
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
NXP Semiconductors
PMEG3010AESA
30 V
, 1 A low VF MEGA Schottky barrier rectifier
PMEG3010AESA
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Preliminary data sheet
3 August 2015
9 / 15
T
sp
(°C)
0
50
100
150
175
125
75
25
aaa-016858
0.5
1.0
1.5
I
F(A
V)
(A)
0.0
(1)
(2)
(3)
(4)
T
j
= 150 °C
(1) δ = 1 (DC)
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 12.
A
verage forward current as a function of solder point temperature; typical values
1
1.
T
est information
time
I
F
I
R
t
rr
I
R(meas)
006aad022
Fig. 13.
Reverse recovery definition; step recovery
t
1
t
2
P
t
006aaa812
duty cycle δ
=
t
1
t
2
Fig. 14.
Duty cycle definition
NXP Semiconductors
PMEG3010AESA
30 V
, 1 A low VF MEGA Schottky barrier rectifier
PMEG3010AESA
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Preliminary data sheet
3 August 2015
10 / 15
The current ratings for the typical waveforms are calculated according to the equations:
I
F(A
V)
= I
M
× δ with I
M
defined as peak current, I
RMS
= I
F(A
V)
at DC, and I
RMS
= I
M
× √δ with
I
RMS
defined as RMS current.
12.
Package outline
15-06-15
Dimensions in mm
1
2
0.03
max
1.05
0.95
0.30
0.24
0.325
0.25
0.65
0.55
0.51
0.49
0.26
0.24
0.41
0.39
Fig. 15.
Package outline DSN1006U-2 (SOD995)
13.
Soldering
SOD995
sod995_fr
occupied area
solder paste
solder resist
solder lands
Dimensions in mm
15-02-09
15-02-20
0.3
0.37
0.67
1.3
1.4
0.5
(2x)
0.6
(2x)
0.7
0.8
0.5
0.6
0.37
0.13
0.47
Fig. 16.
Reflow soldering footprint for DSN1006U-2 (SOD995)
NXP Semiconductors
PMEG3010AESA
30 V
, 1 A low VF MEGA Schottky barrier rectifier
PMEG3010AESA
All information provided in this document is subject to legal disclaimers.
© NXP Semiconductors N.V. 2015. All rights reserved
Preliminary data sheet
3 August 2015
11 / 15
14.
Mounting
SOD995 is an ultra small Discretes Silicon No-leads (DSN) package allowing maximized
utilization of the package area for active silicon. Due to the special product design, NXP
investigated the board assembly process parameters. In order to have an optimum
soldering quality
, NXP advices to follow the assembly recommendations explained in
AN1
1689
.
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P16
PMEG3010AESAYL
Mfr. #:
Buy PMEG3010AESAYL
Manufacturer:
Nexperia
Description:
Schottky Diodes & Rectifiers BL Bipolar Discretes
Lifecycle:
New from this manufacturer.
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