Data Sheet ADP1972
Rev. B | Page 15 of 18
Selecting R
FREQ
for a Slave Device
To configure the ADP1972 as a slave device, drive V
SCFG
< 4.53 V.
When functioning as a slave device, the ADP1972 operates at
the frequency of the external clock applied to the SYNC pin. To
ensure proper synchronization, select R
FREQ
to set the frequency
to a value slightly slower than that of the master clock by using
the following equation:
R
FREQ
(SLAVE)
= 1.11 × R
FREQ
(MASTER)
(5)
where:
R
FREQ (MASTER)
is the resistor value that corresponds to the
frequency of the master clock applied to the SYNC pin.
R
FREQ (SLAVE)
is the resistor value that appropriately scales the
frequency for the slave device, and 1.11 is the R
FREQ
slave to
master ratio for synchronization.
The frequency of the slave device is set to a frequency slightly
lower than that of the master device to allow the digital
synchronization loop of the ADP1972 to synchronize to the
master clock period. The slave device has approximately a 30%
range capability to adjust to match the master clock value.
Setting R
FREQ (SLAVE)
to 1.11× larger than R
FREQ (MASTER)
runs the
synchronization loop in approximately the center of the
adjustment range.
Programming the External Clock Phase Shift
If a phase shift is not required for slave devices, connect SCFG
of each slave device to ground. For devices that require a phase
shifted version of the synchronization clock that is applied to
the SYNC pin of the slave devices, connect a resistor (R
SCFG
)
from SCFG to ground to program the desired phase shift. To
determine the R
SCFG
for a desired phase shift (φ
SHIFT
),
start by
calculating the frequency of the slave clock (f
SLAVE
).
)FREQ(SLAVE
SLAVE
R
f
4
10
(kHz) (6)
Next, calculate the period of the slave clock.

3
10
(kHz)
1
s
SLAVE
SLAVE
f
T
(7)
where:
T
SLAVE
is the period of the master clock in µs.
f
SLAVE
is the frequency of the master clock in kHz.
Next, determine the phase time delay (T
DELAY
) for the desired
phase shift (φ
SHIFT
) using the following equation:

360
sφ
s
SLAVE
SHIFT
DELAY
T
T
(8)
where:
T
DELAY
is the phase delay in µs.
φ
SHIFT
is the desired phase shift.
Lastly, to calculate the phase delay (T
DELAY
), use the following
equation:
R
SCFG
(kΩ) = 0.45 × R
FREQ (SLAVE)
(kΩ) + 50 × T
DELAY
(µs)
(9)
where:
R
SCFG
is the corresponding resistor for the desired phase shift
in kHz.
When using the phase shift feature, connect a capacitor of 47 pF
or greater in parallel with R
SCFG
.
Alternatively, the SCFG pin can be controlled with a voltage
source. When using an independent voltage source, ensure
V
SCFG
≤ VREG under all conditions. When the ADP1972 is
disabled via the EN pin or UVLO, VREG = 0 V, and the voltage
source must adjust accordingly to ensure V
SCFG
≤ VREG.
Figure 23 shows the internal voltage ramp of the ADP1972. The
voltage ramp has a well controlled 4 V p-p.
4.5V
T
0.5V
0.01T
0.99T
11884-027
Figure 23. Internal Voltage Ramp
PROGRAMMING THE MAXIMUM DUTY CYCLE
The ADP1972 is designed with a 98% (typical) internal
maximum duty cycle. By connecting a resistor from DMAX to
ground, the maximum duty cycle can be programmed at any
value from 0% to 98%, using the following equation:

5.10
5.21
%
FREQ
DMAXFREQ
MAX
R
RV
D (10)
where:
D
MAX
is the programmed maximum duty cycle.
V
FREQ
is 1.252 V (typical).
R
DMAX
is the value of the resistance used to program the
maximum duty cycle.
R
FREQ
is the frequency set resistor used in the application.
The current source of DMAX is equivalent to the programmed
current of the FREQ pin:
FREQ
FREQ
FREQDMAX
R
V
II (11)
where I
DMAX
= I
FREQ
= the current programmed on the
FREQ pin.
The maximum allowable duty cycle of the ADP1972 is 98%
(typical). If the resistor on DMAX sets a maximum duty cycle
larger than 98%, the ADP1972 defaults to its internal
maximum. If the 98% internal maximum duty cycle is sufficient
for the application, tie the DMAX pin to VREG or leave it floating.
The C
DMAX
capacitor connected from the DMAX pin to GND
must be 47 pF or greater.
ADP1972 Data Sheet
ADJUSTING THE SOFT START PERIOD
The ADP1972 has a programmable soft start feature that
prevents output voltage overshoot during startup. Refer to
Figure 18 for a soft start diagram. Use the following equation to
calculate the delay time before switching is enabled (t
REG
):
SS
SS
REG
C
I
t ×=
0.52
(12)
where I
SS
= 5 µA, typical.
A C
SS
capacitor is not required for the ADP1972. When the C
SS
capacitor is not used, the internal 5 µA (typical) current source
immediately pulls the SS pin voltage to VREG. When a C
SS
capacitor is not used, there is no soft start control internal to the
ADP1972, and the system could produce a large output overshoot
and a large peak inductor spike during startup. When a C
SS
is
not used, ensure that the output overshoot is not large enough
to trip the hiccup current limit during startup.
Rev. B | Page 16 of 18
Data Sheet ADP1972
PCB LAYOUT GUIDELINES
For high efficiency, good regulation, and stability, a well
designed PCB layout is required.
Use the following guidelines when designing the PCB (see
Figure 16 for the block diagram and Figure 2 for the pin
configuration).
Keep the low effective series resistance (ESR) input supply
capacitor for VIN (C
IN
) as close as possible to the VIN and
GND pins to minimize noise being injected into the device
from board parasitic inductance.
Keep the low ESR input supply capacitor for VREG (C
VREG
)
as close as possible to the VREG and GND pins to
minimize noise being injected into the device from board
parasitic inductance.
Place the components for the SCFG, FREQ, DMAX, and SS
pins close to the corresponding pins. Tie these components
collectively to an AGND plane that makes a Kelvin connection
to the GND pin.
Keep the trace from the COMP pin to the accompanying
device (for example, AD8450) as short as possible. Avoid
routing this trace near switching signals and shield the
trace if possible.
Place any trace or components for the SYNC pin away from
sensitive analog nodes. When using an external pull-up, it is
best to use a local 0.1 µF bypass capacitor from the supply
of the pull-up resistor to GND.
Keep the traces from the DH and DL pins to the external
components as short as possible to minimize parasitic
inductance and capacitance, which affect the control
signal. The DH and DL pins are switching nodes; do not
route them near any sensitive analog circuitry.
Keep high current traces as short and as wide as possible.
Connect the ground connection of the ADP1972 directly
to the ground connection of the current sense, R
S
, resistor.
Connect CL through a 20 kΩ resistor directly to R
S
.
Use a Kelvin connection shown in Figure 24 and Figure 25
from the following:
o The GND pin to the ground point for R
S
o The GND
SENSE
pin to the ground point for R
S
o The system power ground to the ground point of R
S
Extra resistance due to PCB routing introduces a voltage
difference between the GND pin and the GND
SENSE
pin.
This voltage difference must not exceed ±0.3 V.
When building a system with a master and multiple slave
devices, the capacitance of the trace attached to the SYNC
pin must be minimized.
o For small systems with only a few slave devices, a
resistor connected in series between the master SYNC
signal and the slave SYNC input pins limits the
capacitance of the trace and reduces the fast ground
currents that can inject noise into the master device.
o For larger applications, the series resistance is not
enough to isolate the master SYNC clock. In larger
systems, use an external buffer to reduce the
capacitance of the trace. The external buffer has the
drive capability to support a large number of slave
devices.
R
S
GND
SENSE
GND
CL
R
CL
20kΩ
NMOS
POWER
FET
SOURCE
GROUND
BUS
11884-028
Figure 24. Recommended R
S
Kelvin Ground Connection
CL
GND
SENSE
GND
11884-029
Figure 25. Recommended R
S
Kelvin Ground Connection on PCB Layout
Rev. B | Page 17 of 18

ADP1972ARUZ-R7

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Controllers GSM Power Management System
Lifecycle:
New from this manufacturer.
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