Data Sheet ADP1972
Rev. B | Page 5 of 18
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VIN, EN, FAULT to GND −0.3 V to +61 V
SYNC, COMP, MODE to GND −0.3 V to +5.5 V
DH, DL, SS, DMAX, SCFG, CL to GND −0.3 V to VREG + 0.3 V
GND
SENSE
to GND −0.3 V to +0.3 V
Operating Ambient Temperature Range −40°C to +85°C
Junction Temperature 125°C
Storage Temperature Range −65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Absolute maximum ratings apply individually only, not in
combination.
THERMAL OPERATING RANGES
The ADP1972 can be damaged when the junction temperature
limits are exceeded. The maximum operating junction
temperature (T
J
MAX
) takes precedence over the maximum
operating ambient temperature (T
A
MAX
). Monitoring ambient
temperature does not guarantee that the junction temperature
(T
J
) is within the specified temperature limits.
In applications with high power dissipation and poor printed
circuit board (PCB) thermal resistance, the maximum ambient
temperature may need to be derated. In applications with
moderate power dissipation and low PCB thermal resistance,
the maximum ambient temperature can exceed the maximum
limit when the junction temperature is within specification
limits.
The junction temperature (T
J
) of the device is dependent on the
ambient temperature (T
A
), the power dissipation of the device (P
D
),
and the junction to ambient thermal resistance of the package (θ
JA
).
Use the following equation to calculate the maximum junction
temperature (T
J
) from the ambient temperature (T
A
) and power
dissipation (P
D
):
T
J
= T
A
+ (P
D
× θ
JA
) (1)
For additional information on thermal resistance, refer to
Application Note AN-000, Thermal Characteristics of IC
Assembly.
ESD CAUTION