MMBT5551M3T5G

MMBT5551M3
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4
TYPICAL CHARACTERISTICS
C, CAPACITANCE (pF)
V
R
, REVERSE VOLTAGE (VOLTS)
100
1.0
0.2 0.5 1.0 2.0 5.0 10 20
C
ibo
70
50
30
20
10
7.0
5.0
3.0
2.0
0.3 0.7 3.0 7.0
C
obo
10.2 V
V
in
10 ms
INPUT PULSE
V
BB
-8.8 V
100
R
B
5.1 k
0.25 mF
V
in
100
1N914
V
out
R
C
V
CC
30 V
3.0 k
t
r
, t
f
10 ns
DUTY CYCLE = 1.0%
Values Shown are for I
C
@ 10 mA
T
J
= 25°C
I
C
, COLLECTOR CURRENT (mA)
1000
0.3 1.0 10
20 30 50
0.50.2
t, TIME (ns)
10
20
30
50
100
200
300
500
2.0
100 200
I
C
/I
B
= 10
T
J
= 25°C
t
r
@ V
CC
= 120 V
3.0 5.0
t
r
@ V
CC
= 30 V
t
d
@ V
EB(off)
= 1.0 V
V
CC
= 120 V
I
C
, COLLECTOR CURRENT (mA)
5000
t, TIME (ns)
50
100
200
300
500
3000
2000
1000
0.3 1.0 10
20 30 50
0.50.2 2.0
100 200
3.0 5.0
I
C
/I
B
= 10
T
J
= 25°C
t
f
@ V
CC
= 120 V
t
f
@ V
CC
= 30 V
t
s
@ V
CC
= 120 V
I
C
, COLLECTOR CURRENT (mA)
2.5
q
VC
for V
CE(sat)
q
VB
for V
BE(sat)
Figure 5. Temperature Coefficients
T
J
= - 55°C to +135°C
V
, TEMPERATURE COEFFICIENT (mV/ C)°θ
2.0
1.5
1.0
0.5
0
- 0.5
- 1.0
- 1.5
- 2.0
- 2.5
1.0 2.0 5.0 10 20 50 1000.1 0.2 0.5 3.0 300.3
Figure 6. Switching Time Test Circuit
Figure 7. Capacitances Figure 8. Turn−On Time
Figure 9. Turn−Off Time
0.001
0.01
0.1
1
1 10 100
V
CE
, COLLECTOR EMITTER VOLTAGE (V)
I
C
, COLLECTOR CURRENT (A)
100 ms
Figure 10. Safe Operating Area
10 ms
100 ms 10 ms 1 ms1 s
MMBT5551M3
www.onsemi.com
5
PACKAGE DIMENSIONS
STYLE 1:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
SOT−723
CASE 631AA
ISSUE D
DIM MIN NOM MAX
MILLIMETERS
A 0.45 0.50 0.55
b 0.15 0.21 0.27
b1 0.25 0.31 0.37
C 0.07 0.12 0.17
D 1.15 1.20 1.25
E 0.75 0.80 0.85
e
0.40 BSC
H 1.15 1.20 1.25
L
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS.
D
b1
E
b
e
A
L
C
H
−Y−
−X−
X0.08 Y
2X
E
1
2
3
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
L2 0.15 0.20 0.25
0.29 REF
3X
L2
3X
1
2X
TOP VIEW
BOTTOM VIEW
SIDE VIEW
RECOMMENDED
DIMENSIONS: MILLIMETERS
0.40
1.50
2X
PACKAGE
OUTLINE
0.27
2X
0.52
3X
0.36
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MMBT5551M3/D
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MMBT5551M3T5G

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Bipolar Transistors - BJT SOT-723 GP NPN TRANS
Lifecycle:
New from this manufacturer.
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