Spec.No. JENF243H-0008K-01 P 10/ 14
MURATA MFG.CO.,LTD.
Reference Only
11.7 Marking for Outside package (corrugated paper box)
Customer name, Purchasing Order Number, Customer Part Number, MURATA part number,
RoHS discrimination(
∗2) , Quantity , etc
11.8 Specification of Outer Case
Reel
Outer Case Dimensions
(mm)
Standard Reel Quantity
in Outer Case (Reel)
W D H
φ178mm
186 186 93 3
φ330mm
340 340 85 2
∗ Above Outer Case size is typical. It depends on a quantity of an order.
12. ! Caution
12.1.Direction of mounting
Please make sure of the direction of mounting and connect to the circuit properly.
As shown in the equivalent circuit shown in item 5, this product has a directionality.
Wrong connection to the circuit may cause open/short circuit of the part, burnout and serious accidents.
12.2.Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high
reliability for the prevention of defects which might directly cause damage to the third party’s life,body or property.
(1)Aircraft equipment (2)Aerospace equipment (3)Undersea equipment (4)Power plant control equipment
(5)Medical equipment (6)Transportation equipment(automobiles,trains,ships,etc.) (7)Traffic signal equipment
(8)Disaster prevention / crime prevention equipment (9)Data-processing equipment
(10)Applications of similar complexity or with reliability requirements comparable to the applications listed in the above
12.3.ESD
ESD to this product, exceeding condition of IEC61000-4-2 with 30kV, may cause short circuit and fuming or firing.
13.Notice
Products can only be soldered with reflow.
This product is designed for solder mounting.
Please consult us in advance for applying other mounting method such as conductive adhesive.
13.1. Flux and Solder
Flux
Use rosin-based flux, Do not use highly acidic flux (with chlorine content
exceeding 0.2(wt)%).
Do not use water soluble flux.
Solder Use Sn-3.0Ag-0.5Cu solder
Other flux (except above) Please contact us for details, then use.
13.2. Note for Assembling
<Exclusive Use of Reflow Soldering>
When installing by the flow soldering, the degradation of the insulation resistance sometimes occurs.
Products can only be soldered with reflow.
The use in flow soldering be reserved.
< Thermal Shock >
Pre-heating should be in such a way that the temperature difference between solder and products
surface is limited to 100 °C max. Also cooling into solvent after soldering should be in such a way
that the temperature difference is limited to 100 °C max.
Insufficient pre-heating may cause cracks on the ferrite, resulting in the deterioration of product quality.
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Label
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