NCR169D

© Semiconductor Components Industries, LLC, 2005
October, 2005 − Rev. 1
1 Publication Order Number:
NCR169D/D
NCR169D
General Purpose
Sensitive Gate
Silicon Controlled Rectifier
Reverse Blocking Thyristor
PNPN device designed for line-powered general purpose
applications such as relay and lamp drivers, small motor controls, gate
drivers for larger thyristors, and sensing and detection circuits.
Supplied in a cost effective plastic TO-226AA package.
Features
Sensitive Gate Allows Direct Triggering by Microcontrollers and
Other Logic Circuits
On−State Current Rating of 0.8 Amperes RMS at 80°C
Surge Current Capability − 10 Amperes
Immunity to dV/dt − 20 V/μsec Minimum at 110°C
Glass-Passivated Surface for Reliability and Uniformity
Device Marking: NCR169D, Date Code
Pb−Free Packages are Available
MAXIMUM RATINGS (T
J
= 25°C unless otherwise noted)
Rating
Symbol Value Unit
Peak Repetitive Off−State Voltage (Note 1.)
(T
J
= *40 to 110°C, Sine Wave, 50 to
60 Hz; Gate Open)
V
DRM,
V
RRM
400 Volts
On-State RMS Current
(T
C
= 80°C) 180° Conduction Angles
I
T(RMS)
0.8 Amp
Peak Non-Repetitive Surge Current
(1/2 Cycle, Sine Wave, 60 Hz,
T
J
= 25°C)
I
TSM
10 Amps
Circuit Fusing Consideration (t = 10 ms) I
2
t 0.415 A
2
s
Forward Peak Gate Power
(T
A
= 25°C, Pulse Width v 1.0 μs)
P
GM
0.1 Watt
Forward Average Gate Power
(T
A
= 25°C, t = 20 ms)
P
G(AV)
0.10 Watt
Forward Peak Gate Current
(T
A
= 25°C, Pulse Width v 1.0 μs)
I
GM
1.0 Amp
Reverse Peak Gate Voltage
(T
A
= 25°C, Pulse Width v 1.0 μs)
V
GRM
5.0 Volts
Operating Junction Temperature Range
@ Rate V
RRM
and V
DRM
T
J
−40 to
110
°C
Storage Temperature Range T
stg
−40 to
150
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. V
DRM
and V
RRM
for all types can be applied on a continuous basis. Ratings
apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking
voltages shall not be tested with a constant current source such that the
voltage ratings of the devices are exceeded.
SCR
0.8 AMPERES RMS
400 VOLTS
TO−92
(TO−226AA)
CASE 029
STYLE 10
A
G
K
PIN ASSIGNMENT
1
2
3
Gate
Anode
Cathode
K
G
A
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAM
A = Assembly Location
L = Wafer Lot
Y = Year
WW = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
NCR
169D
ALYWWG
G
123
http://onsemi.com
NCR169D
http://onsemi.com
2
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance − Junction to Case
− Junction to Ambient
R
θ
JC
R
θ
JA
75
200
°C/W
Lead Solder Temperature
(t1/16 from case, 10 secs max)
T
L
260 °C
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Forward or
Reverse Blocking Current (Note 1.) T
C
= 25°C
(V
D
= Rated V
DRM
and V
RRM
; R
GK
= 1.0 kΩ)T
C
= 110°C
I
DRM
, I
RRM
10
0.1
μA
mA
ON CHARACTERISTICS
Peak Forward On−State Voltage
(*)
(I
TM
= 1.0 Amp Peak @ T
A
= 25°C)
V
TM
1.7 Volts
Gate Trigger Current (Continuous dc) (Note 2.) T
C
= 25°C
(V
AK
= 12 V, R
L
= 100 Ohms)
I
GT
40 200 μA
Holding Current (Note 2.) T
C
= 25°C
(V
AK
= 12 V, I
GT
= 0.5 mA) T
C
= −40°C
I
H
0.5
5.0
10
mA
Latch Current T
C
= 25°C
(V
AK
= 12 V, I
GT
= 0.5 mA, R
GK
= 1.0 k) T
C
= −40°C
I
L
0.6
10
15
mA
Gate Trigger Voltage (Continuous dc) (Note 2.) T
C
= 25°C
(V
AK
= 12 V, R
L
= 100 Ohms, I
GT
= 10 mA) T
C
= −40°C
V
GT
0.62
0.8
1.2
Volts
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Off−State Voltage
(V
D
= Rated V
DRM
, Exponential Waveform, R
GK
= 1000 Ohms,
T
J
= 110°C)
dV/dt 20 35 V/μs
Critical Rate of Rise of On−State Current
(I
PK
= 20 A; Pw = 10 μsec; diG/dt = 1.0 A/μsec, Igt = 20 mA)
di/dt 50 A/μs
*Indicates Pulse Test: Pulse Width 1.0 ms, Duty Cycle 1%.
1. R
GK
= 1000 Ohms included in measurement.
2. Does not include R
GK
in measurement.
NCR169D
http://onsemi.com
3
+ Current
+ Voltage
V
TM
I
DRM
at V
DRM
I
H
Symbol Parameter
V
DRM
Peak Repetitive Off State Forward Voltage
I
DRM
Peak Forward Blocking Current
V
RRM
Peak Repetitive Off State Reverse Voltage
I
RRM
Peak Reverse Blocking Current
V
TM
Peak on State Voltage
I
H
Holding Current
Voltage Current Characteristic of SCR
Anode +
on state
Reverse Blocking Region
(off state)
Reverse Avalanche Region
Anode −
Forward Blocking Region
I
RRM
at V
RRM
(off state)
Figure 1. Typical Gate Trigger Current versus
Junction Temperature
T
J
, JUNCTION TEMPERATURE (°C)
100
90
80
70
60
50
40
30
1105035205−10−25−40
GATE TRIGGER CURRENT ( A)
Figure 2. Typical Gate Trigger Voltage versus
Junction Temperature
T
J
, JUNCTION TEMPERATURE (°C)
110655035205−10−25−40
0.8
0.7
0.6
0.5
0.4
0.3
GATE TRIGGER VOLTAGE (VOLTS)
0.2
20
10
0.9
1.0
958065
m
9580

NCR169D

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
SCRs 400V 800mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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