NCR169D

NCR169D
http://onsemi.com
4
DC
Figure 3. Typical Holding Current versus
Junction Temperature
T
J
, JUNCTION TEMPERATURE (°C)
1000
100
110655035205−10−25−40
HOLDING CURRENT ( A)
Figure 4. Typical Latching Current versus
Junction Temperature
10
Figure 5. Typical RMS Current Derating
I
T(RMS)
, RMS ON-STATE CURRENT (AMPS)
120
110
100
90
80
70
60
50
0.50.40.30.20.10
T
C
, MAXIMUM ALLOWABLE CASE TEMPERATURE ( C)°
Figure 6. Typical On−State Characteristics
V
T
, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS)
3.53.22.32.01.71.41.10.80.5
1
I
T
, INSTANTANEOUS ON−STATE CURRENT (AMPS)
0.140
10
9580
m
T
J
, JUNCTION TEMPERATURE (°C)
1000
100
110655035205−10−25−40
LATCHING CURRENT ( A)
10
9580
m
30° 60° 90° 120°
180°
2.92.6
MAXIMUM @ T
J
= 110°C
MAXIMUM @ T
J
= 25°C
NCR169D
http://onsemi.com
5
TO−92 EIA RADIAL TAPE IN FAN FOLD BOX OR ON REEL
H2A H2A
H
F1
F2
P2 P2
P1
P
D
W
W1
L1
W2
H2B H2B
T1
T
T2
H4
H5
H1
L
Figure 7. Device Positioning on Tape
Symbol Item
Specification
Inches Millimeter
Min Max Min Max
D
Tape Feedhole Diameter
0.1496 0.1653 3.8 4.2
D2
Component Lead Thickness Dimension
0.015 0.020 0.38 0.51
F1, F2
Component Lead Pitch
0.0945 0.110 2.4 2.8
H
Bottom of Component to Seating Plane
.059 .156 1.5 4.0
H1
Feedhole Location
0.3346 0.3741 8.5 9.5
H2A
Deflection Left or Right
0 0.039 0 1.0
H2B
Deflection Front or Rear
0 0.051 0 1.0
H4
Feedhole to Bottom of Component
0.7086 0.768 18 19.5
H5
Feedhole to Seating Plane
0.610 0.649 15.5 16.5
L
Defective Unit Clipped Dimension
0.3346 0.433 8.5 11
L1
Lead Wire Enclosure
0.09842 2.5
P
Feedhole Pitch
0.4921 0.5079 12.5 12.9
P1
Feedhole Center to Center Lead
0.2342 0.2658 5.95 6.75
P2
First Lead Spacing Dimension
0.1397 0.1556 3.55 3.95
T
Adhesive Tape Thickness
0.06 0.08 0.15 0.20
T1
Overall Taped Package Thickness
0.0567 1.44
T2
Carrier Strip Thickness
0.014 0.027 0.35 0.65
W
Carrier Strip Width
0.6889 0.7481 17.5 19
W1
Adhesive Tape Width
0.2165 0.2841 5.5 6.3
W2
Adhesive Tape Position
.0059 0.01968 .15 0.5
NOTES:
1. Maximum alignment deviation between leads not to be greater than 0.2 mm.
2. Defective components shall be clipped from the carrier tape such that the remaining protrusion (L) does not exceed a maximum of 11 mm.
3. Component lead to tape adhesion must meet the pull test requirements.
4. Maximum non−cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches.
5. Holddown tape not to extend beyond the edge(s) of carrier tape and there shall be no exposure of adhesive.
6. No more than 1 consecutive missing component is permitted.
7. A tape trailer and leader, having at least three feed holes is required before the first and after the last component.
8. Splices will not interfere with the sprocket feed holes.
NCR169D
http://onsemi.com
6
ORDERING & SHIPPING INFORMATION: MCR100 Series packaging options, Device Suffix
Device Description of TO92 Tape Orientation Shipping
NCR169D N/A, Bulk Bulk in Box (5K/Box)
NCR169DG N/A, Bulk Bulk in Box (5K/Box)
(Pb−Free)
NCR169DRLRA Round side of TO92 and adhesive tape visible Radial Tape and Reel (2K/Reel)
NCR169DRLRAG Round side of TO92 and adhesive tape visible Radial Tape and Reel (2K/Reel)
(Pb−Free)
NCR169DRLRM Flat side of TO92 and adhesive tape visible Radial Tape and Fan Fold Box (2K/Box)
NCR169DRLRMG Flat side of TO92 and adhesive tape visible Radial Tape and Fan Fold Box (2K/Box)
(Pb−Free)
NCR169DRLRP Flat side of TO92 and adhesive tape visible Radial Tape and Fan Fold Box (2K/Box)
NCR169DRLRPG Flat side of TO92 and adhesive tape visible Radial Tape and Fan Fold Box (2K/Box)
(Pb−Free)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.

NCR169D

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
SCRs 400V 800mA
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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