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TC647VUATR

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TC647
DS21447D-page 16 2001-2012 Microchip Technology Inc.
FIGURE 5-10: TC647 as a Microcontroller Peripheral.
TC647
V
IN
C
F
V
MIN
GND
V
DD
V
OUT
FAULT
SENSE
(Optional)
(MSB)
R
1
110 kΩ
R
2
240 kΩ
R
3
360 kΩ
(LSB)
R
5
1.5 kΩ
+5V
R
6
1 kΩ
R
4
18 kΩ
R
7
33 kΩ
+5V
R
8
18 kΩ
C
B
.01 μF
+
1 μF
C
B
.01 μF
Fan
+12V
+5V
C
B
1 μF
+
800Ω
+5V
R
10
10 kΩ
0.1 μF
2N2222A
R
11
2.2Ω
1
2
3
4
5
6
7
8
(RESET)
CMOS
Microcontroller
+5V
Analog or Digital
Temperature
Data from one or
more Sensors
I/O0
I/O1
I/O2
I/O3
INT
GND
CMOS
Outputs
Open-drain
Outputs
R
9
2001-2012 Microchip Technology Inc. DS21447D-page 17
TC647
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
XXXXXXXX
NNN
YYWW
8-Lead PDIP (300 mil)
Example:
8-Lead SOIC (150 mil)
Example:
XXXXXXXX
YYWW
NNN
TC647VPA
025
0215
TC647VOA
0215
025
8-Lead MSOP
Example:
XXXXXX
YWWNNN
TC647E
215025
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
TC647
DS21447D-page 18 2001-2012 Microchip Technology Inc.
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
E
eB
c
E1
n
D
1
2
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
88
Pitch
p
.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness
A2
.115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness
c
.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top
51015 51015
Mold Draft Angle Bottom
51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
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TC647VUATR

Mfr. #:
Buy TC647VUATR
Manufacturer:
Microchip Technology
Description:
Motor / Motion / Ignition Controllers & Drivers w/Fault Dtct
Lifecycle:
New from this manufacturer.
Delivery:
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