LTC3407A-2
13
3407a2f
APPLICATIO S I FOR ATIO
WUU
U
LTC3407A-2. These items are also illustrated graphically
in the layout diagram of Figure 2. Check the following in
your layout:
1. Does the capacitor C
IN
connect to the power V
IN
(Pin 3)
and GND (exposed pad) as closely as possible? This
capacitor provides the AC current to the internal power
MOSFETs and their drivers.
2. Are C
OUT
and L1 closely connected? The (–) plate of
C
OUT
returns current to GND and the (–) plate of C
IN
.
3. The resistor divider formed by R1 and R2 must be
connected between the (+) plate of C
OUT
and a ground
sense line terminated near GND (exposed pad). The feed-
back signals V
FB1
and V
FB2
should be routed away from
noisy components and traces, such as the SW lines (Pins
4 and 7), and their traces should be minimized.
4. Keep sensitive components away from the SW pins. The
input capacitor C
IN
and the resistors R1 to R4 should be
routed away from the SW traces and the inductors.
5. A ground plane is preferred, but if not available keep the
signal and power grounds segregated with small signal
components returning to the GND pin at one point.
Addtionally the two grounds should not share the high
current paths of C
IN
or C
OUT
.
6. Flood all unused areas on all layers with copper.
Flooding with copper will reduce the temperature rise of
power components. These copper areas should be con-
nected to V
IN
or GND.
Figure 2. LTC3407A-2 Layout Diagram (See Board Layout Checklist)
RUN/SS2 V
IN
V
IN
V
OUT2
V
OUT1
RUN/SS1
POR
SW1
V
FB1
GND
V
FB2
SW2
MODE/SYNC
LTC3407A-2
C
IN
C4C5
L1
L2
R4 R2
R1
R3
C
OUT2
C
OUT1
3407A2 F02
BOLD LINES INDICATE HIGH CURRENT PATHS
Choosing the next highest standardized inductor value of
2.2μH, results in a maximum ripple current of:
Δ =
μ
=I
V
MHz H
V
V
m
L
25
225 22
1
25
42
204
.
.•.
.
.
AA
For cost reasons, a ceramic capacitor will be used. C
OUT
selection is then based on load step droop instead of ESR
requirements. For a 5% output droop:
C
mA
MHz V
F
OUT
= μ25
800
225 5 25
71.
.•(%.)
.
The closest standard value is 10μF. Since the output
impedance of a Li-Ion battery is very low, C
IN
is typically
10μF.
The output voltage can now be programmed by choosing
the values of R1 and R2. To maintain high efficiency, the
current in these resistors should be kept small. Choosing
2μA with the 0.6V feedback voltage makes R1~300k. A
close standard 1% resistor is 280k, and R2 is then 887k.
The POR pin is a common drain output and requires a pull-
up resistor. A 100k resistor is used for adequate speed.
Figure 3 shows the complete schematic for this design
example. The specific passive components chosen allow
for a 1mm height power supply that maintains a high
efficiency across load.
Board Layout Considerations
When laying out the printed circuit board, the following
checklist should be used to ensure proper operation of the
LTC3407A-2
14
3407a2f
TYPICAL APPLICATIO S
U
RUN/SS2 V
IN
V
IN
= 2.5V
TO 5.5V
V
OUT2
= 2.5V
AT 800mA
V
OUT1
= 1.8V
AT 800mA
RUN/SS1
POR
SW1
V
FB1
GND
V
FB2
SW2
MODE/SYNC
LTC3407A-2
C1
10μF
R5
100k
POWER-ON
RESET
C4, 22pFC5, 22pF
L1
2.2μH
L2
2.2μH
R4
887k
R2
604k
R1
301k
R3
280k
C3
10μF
C2
10μF
3407A2 TA03
C1, C2, C3: TAIYO YUDEN JMK316BJ106MD
L1, L2: TDK VLF3010AT-2R2M1R0
Figure 3. 1mm Height Core Supply
Efficiency vs Load Current
Figure 4. Low Ripple Buck Regulators with Soft-Start
RUN/SS2
V
IN
V
IN
= 2.5V TO 5.5V
V
OUT2
= 2.5V
AT 800mA
V
OUT1
= 1.2V
AT 800mA
RUN/SS1
POR
SW1
V
FB1
GND
V
FB2
SW2
MODE/SYNC
LTC3407A-2
C
IN
10μF
R7
100k
R6
4.7MΩ
R5
4.7MΩ
POWER-ON
RESET
C1, 22pFC2, 22pF
L1
4.7μH
L2
4.7μH
R4
887k
R2
604k
R1
604k
R3
280k
C
OUT2
10μF
C4
680pF
C3
680pF
C
OUT1
10μF
3407A2 TA04
C
IN
, C
OUT1
, C
OUT2:
TAIYO YUDEN JMK316BJ106ML L1, L2: TDK VLF3012AT-4R7M74
Efficiency vs Load Current
LOAD CURRENT (mA)
1
0
EFFICIENCY (%)
30
20
10
70
60
50
40
100
90
80
10 100 1000
3407A2 TA03b
2.5V
V
IN
= 3.3V
Burst Mode OPERATION
NO LOAD ON OTHER CHANNEL
1.8V
LOAD CURRENT (mA)
1
0
EFFICIENCY (%)
30
20
10
70
60
50
40
100
90
80
10 100 1000
3407A2 TA04b
2.5V
V
IN
= 3.3V
Burst Mode OPERATION
NO LOAD ON OTHER CHANNEL
1.2V
LTC3407A-2
15
3407a2f
PACKAGE DESCRIPTIO
U
MSE Package
10-Lead Plastic MSOP
(Reference LTC DWG # 05-08-1664)
MSOP (MSE) 0603
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
0.18
(.007)
1.10
(.043)
MAX
0.17 – 0.27
(.007 – .011)
TYP
0.127 ± 0.076
(.005 ± .003)
0.86
(.034)
REF
0.50
(.0197)
BSC
12
3
45
4.90 ± 0.152
(.193 ± .006)
0.497 ± 0.076
(.0196 ± .003)
REF
8910
10
1
7
6
3.00 ± 0.102
(.118 ± .004)
(NOTE 3)
3.00 ± 0.102
(.118 ± .004)
(NOTE 4)
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
0.254
(.010)
0
° – 6° TYP
DETAIL “A”
DETAIL “A”
GAUGE PLANE
5.23
(.206)
MIN
3.20 – 3.45
(.126 – .136)
0.889 ± 0.127
(.035 ± .005)
RECOMMENDED SOLDER PAD LAYOUT
0.305 ± 0.038
(.0120 ± .0015)
TYP
2.083 ± 0.102
(.082 ± .004)
2.794 ± 0.102
(.110 ± .004)
0.50
(.0197)
BSC
BOTTOM VIEW OF
EXPOSED PAD OPTION
1.83
± 0.102
(.072 ± .004)
2.06 ± 0.102
(.081 ± .004)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
3.00 ±0.10
(4 SIDES)
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.38 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.65 ± 0.10
(2 SIDES)
0.75 ±0.05
R = 0.115
TYP
2.38 ±0.10
(2 SIDES)
15
106
PIN 1
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DD) DFN 1103
0.25 ± 0.05
2.38 ±0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.65 ±0.05
(2 SIDES)2.15 ±0.05
0.50
BSC
0.675 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.25 ± 0.05
0.50 BSC
DD Package
10-Lead Plastic DFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1699)

LTC3407AEDD-2#TRPBF

Mfr. #:
Manufacturer:
Analog Devices / Linear Technology
Description:
Switching Voltage Regulators Dual 800mA, 2.25MHz Synchronous Step-Down with Improved BurstMode
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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