HUFA76419S3ST

©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B
HUFA76419P3, HUFA76419S3S
27A, 60V, 0.040 Ohm, N-Channel, Logic
Level UltraFET® Power MOSFETs
Packaging
Symbol
Features
Ultra Low On-Resistance
-r
DS(ON)
= 0.035Ω, V
GS
= 10V
-r
DS(ON)
= 0.040Ω, V
GS
= 5V
Simulation Models
- Temperature Compensated PSPICE® and SABER™
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.fairchildsemi.com
Peak Current vs Pulse Width Curve
UIS Rating Curve
Switching Time vs R
GS
Curves
Ordering Information
Absolute Maximum Ratings
T
C
= 25
o
C, Unless Otherwise Specified
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy
of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
JEDEC TO-220AB JEDEC TO-263AB
DRAIN
(FLANGE)
DRAIN
SOURCE
GATE
HUFA76419P3
GATE
SOURCE
DRAIN
(FLANGE)
HUFA76419S3S
D
G
S
PART NUMBER PACKAGE BRAND
HUFA76419P3 TO-220AB 76419P
HUFA76419S3S TO-263AB 76419S
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUFA76419S3ST.
HUFA76419P3, HUFA76419S3S UNITS
Drain to Source Voltage (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DSS
60 V
Drain to Gate Voltage (R
GS
= 20k) (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
DGR
60 V
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
±16 V
Drain Current
Continuous (T
C
= 25
o
C, V
GS
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 25
o
C, V
GS
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 100
o
C, V
GS
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Continuous (T
C
= 100
o
C, V
GS
= 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
DM
27
29
19
18
Figure 4
A
A
A
A
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS Figures 6, 17, 18
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
D
Derate Above 25
o
C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
75
0.5
W
W/
o
C
Operating and Storage Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
J
, T
STG
-55 to 175
o
C
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T
L
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
pkg
300
260
o
C
o
C
NOTES:
1. T
J
= 25
o
C to 150
o
C.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Data Sheet December 2001
©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B
Electrical Specifications
T
C
= 25
o
C, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
OFF STATE SPECIFICATIONS
Drain to Source Breakdown Voltage BV
DSS
I
D
= 250µA, V
GS
= 0V (Figure 12) 60 - - V
I
D
= 250µA, V
GS
= 0V , T
C
= -40
o
C (Figure 12) 55 - - V
Zero Gate Voltage Drain Current I
DSS
V
DS
= 55V, V
GS
= 0V - - 1 µA
V
DS
= 50V, V
GS
= 0V, T
C
= 150
o
C - - 250 µA
Gate to Source Leakage Current I
GSS
V
GS
= ±16V - - ±100 nA
ON STATE SPECIFICATIONS
Gate to Source Threshold Voltage V
GS(TH)
V
GS
= V
DS
, I
D
= 250µA (Figure 11) 1 - 3 V
Drain to Source On Resistance r
DS(ON)
I
D
= 29A, V
GS
= 10V (Figures 9, 10) - 0.029 0.035
I
D
= 19A, V
GS
= 5V (Figure 9) - 0.033 0.040
I
D
= 18A, V
GS
= 4.5V (Figure 9) - 0.035 0.044
THERMAL SPECIFICATIONS
Thermal Resistance Junction to Case R
θJC
TO-220 and TO-263 - - 2.0
o
C/W
Thermal Resistance Junction to
Ambient
R
θJA
--62
o
C/W
SWITCHING SPECIFICATIONS (V
GS
= 4.5V)
Turn-On Time t
ON
V
DD
= 30V, I
D
= 18A
V
GS
= 4.5V, R
GS
= 12
(Figures 15, 21, 22)
- - 245 ns
Turn-On Delay Time t
d(ON)
-12-ns
Rise Time t
r
- 150 - ns
Turn-Off Delay Time t
d(OFF)
-27-ns
Fall Time t
f
-55-ns
Turn-Off Time t
OFF
- - 125 ns
SWITCHING SPECIFICATIONS (V
GS
= 10V)
Turn-On Time t
ON
V
DD
= 30V, I
D
= 29A
V
GS
= 10V,
R
GS
= 12
(Figures 16, 21, 22)
- - 110 ns
Turn-On Delay Time t
d(ON)
-6.7-ns
Rise Time t
r
-66-ns
Turn-Off Delay Time t
d(OFF)
-45-ns
Fall Time t
f
- 76 - ns
Turn-Off Time t
OFF
- - 185 ns
GATE CHARGE SPECIFICATIONS
Total Gate Charge Q
g(TOT)
V
GS
= 0V to 10V V
DD
= 30V,
I
D
= 19A,
I
g(REF)
= 1.0mA
(Figures 14, 19, 20)
-2228nC
Gate Charge at 5V Q
g(5)
V
GS
= 0V to 5V - 13 16 nC
Threshold Gate Charge Q
g(TH)
V
GS
= 0V to 1V - 0.9 1.1 nC
Gate to Source Gate Charge Q
gs
-2.7-nC
Gate to Drain "Miller" Charge Q
gd
-6-nC
CAPACITANCE SPECIFICATIONS
Input Capacitance C
ISS
V
DS
= 25V, V
GS
= 0V,
f = 1MHz
(Figure 13)
- 900 - pF
Output Capacitance C
OSS
- 250 - pF
Reverse Transfer Capacitance C
RSS
-45-pF
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage V
SD
I
SD
= 19A - - 1.25 V
I
SD
= 10A - - 1.0 V
Reverse Recovery Time t
rr
I
SD
= 19A, dI
SD
/dt = 100A/µs--78ns
Reverse Recovered Charge Q
RR
I
SD
= 19A, dI
SD
/dt = 100A/µs - - 230 nC
HUFA76419P3, HUFA76419S3S
©2001 Fairchild Semiconductor Corporation HUFA76419P3, HUFA76419S3S Rev. B
Typical Performance Curves
FIGURE 1. NORMALIZED POWER DISSIPATION vs CASE
TEMPERATURE
FIGURE 2. MAXIMUM CONTINUOUS DRAIN CURRENT vs
CASE TEMPERATURE
FIGURE 3. NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE
FIGURE 4. PEAK CURRENT CAPABILITY
T
C
, CASE TEMPERATURE (
o
C)
POWER DISSIPATION MULTIPLIER
0
0 25 50 75 100 17
5
0.2
0.4
0.6
0.8
1.0
1.2
125
150
10
20
30
25 50 75 100 125 150 17
5
0
I
D
, DRAIN CURRENT (A)
T
C
, CASE TEMPERATURE (
o
C)
V
GS
= 10V
V
GS
= 4.5V
0.1
1
10
-5
10
-4
10
-3
10
-2
10
-1
10
0
10
1
0.01
2
t, RECTANGULAR PULSE DURATION (s)
Z
θJC
, NORMALIZED
SINGLE PULSE
NOTES:
DUTY FACTOR: D = t
1
/t
2
PEAK T
J
= P
DM
x Z
θJC
x R
θJC
+ T
C
P
DM
t
1
t
2
DUTY CYCLE - DESCENDING ORDER
0.5
0.2
0.1
0.05
0.01
0.02
THERMAL IMPEDANCE
100
500
10
-4
10
-3
10
-2
10
-1
10
0
10
1
10
-5
10
I
DM
, PEAK CURRENT (A)
t, PULSE WIDTH (s)
TRANSCONDUCTANCE
MAY LIMIT CURRENT
IN THIS REGION
T
C
= 25
o
C
I = I
25
175 - T
C
150
FOR TEMPERATURES
ABOVE 25
o
C DERATE PEAK
CURRENT AS FOLLOWS:
V
GS
= 5V
V
GS
= 10V
HUFA76419P3, HUFA76419S3S

HUFA76419S3ST

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET N-CH 60V 29A D2PAK
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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