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2010212254

P1-P3P4-P6P7-P9P10-P11
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID
®
SHROUDED HEADERS
SHEET No.
A
ECM:
109684
4 of 11
DATE:
2016/11/17
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
2009890001
SCHEONG
GMENARLY
KHLIM
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
5.3 ENVIRONMENTAL REQUIREMENTS
9
Vibration
Mate connectors and subject to the
following vibration conditions, for a period
of 2 hours in each 3 mutually
perpendicular axis.
Amplitude: 1.52mm (.060 inch) peak to
peak
Test pulse: half sine
Sweep: 10->55->10 Hz in 1 minute
Duration: 2 hours in each x-y-z axis.
(EIA-364-28, Test Condition I)
Appearance: No Damage
15milliohms
[MAXIMUM]
(change from initial)
Discontinuity: 1.0 µs
[maximum]
10
Mechanical shock
Mate connectors and subject to the
following shock conditions, 3 shocks shall
be applied along 3 mutually perpendicular
axis. (total of 18 shocks)
Peak value: 490 m/s sq. (50G)
Test pulse : half sine
Duration : 11 ms in each x-y-z axis
(EIA-364-27B Condition A)
Appearance: No Damage
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
Discontinuity: 1.0 µs
[maximum]
11
Thermal shock
Mate connectors, expose to 5 cycles of:-
Temperature °c
Duration
(minutes)
-55+0/-5
30
Transfer time from
cold to hot
5 maximum
+105+3/-0
30
Transfer time from
hot to cold
5 maximum
(EIA-364-32G Method A, Condition VII)
Appearance: No Damage
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
12
Temperature life
Mate connectors, expose to:-
Temperature: 105 ± 2 °c
Duration: 96 hours.
(EIA-364-17, Method A, Condition 4)
Appearance: No Damage
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID
®
SHROUDED HEADERS
SHEET No.
A
ECM:
109684
5 of 11
DATE:
2016/11/17
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
2009890001
SCHEONG
GMENARLY
KHLIM
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
13
Cyclic temperature
and humidity
ate connector and expose to:-
Temperature: 25 ± 3 °C @
Humidity: 80% ± 3%
And
Temperature: 65 ± 3 °C @
Humidity: 50% ± 3%
Ramp times should be 0.5 hour
and dwell times should be 1.0 hour.
Dwell times start when the
temperature and humidity have
stabilized within the specified levels.
Duration: 24 cycles (72 hours)
Appearance: No Damage
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
Dielectric withstanding
Voltage:
No breakdown
Insulation resistance:
1000 megaΩ minimum
14
Low temperature
test
Mate connectors and expose to:
Temperature: -40 ± 3°C
Duration: 96 +5/-0 hours
(EIA-364-59A)
Appearance: No Damage
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
15
SO
2
gas
Mate connectors and expose to:
SO
2
gas density: 50 ±5 ppm
Temperature: 40 ±2 °C
Duration: 24 hours
Humidity: 60-75%.
Appearance: No Damage
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
16
Salt spray
Expose the mated connectors to the
following salt mist condition:
Concentration : 5 ±1%
Temperature : 35 +1/-2°C
Test time : 48 hours
(Note: immediately after exposure, the
test specimens shall be dipped in running
tap (≤38°C) for 5 mins max and dried for
16 hour max in a circulating air oven at 38
± 3°C. Sample examination done in room
temperature.
(EIA-364-26C, Condition B)
Appearance: No Damage
Contact Resistance:
15milliΩ
[MAXIMUM]
[CHANGE FROM INITIAL]
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID
®
SHROUDED HEADERS
SHEET No.
A
ECM:
109684
6 of 11
DATE:
2016/11/17
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
2009890001
SCHEONG
GMENARLY
KHLIM
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
17
Solderability
Unmate connector.
Steam age for 8 hour ± 15 min.
(precondition: Condition C)
SMT
Surface mount process simulation test
Solder paste is deposited onto screen
(e.g.ceramic plate) via stencil.
The connectors are placed onto the
solder paste print.
Subject the substrate and component to
the reflow process through a convection
oven.
Refer to section10.0 for temperature
profile.
Flux type: ROL0
THRU-HOLES
Dip and look test
Dip solder tails into solder pot at a
temperature of 245 ± 5°c for 5 ± 0.5 sec.
Emersion rate: 25.4 +/-6.4 mm /sec
Flux type: rol1
(JESD22-B-102E; Method 1 and 2)
95% of the immersed area
must show no voids, pin holes
18
Resistance to solder
Heats
SMT
Convection reflow
Sample to be passed through reflow over
according to temperature profiles (shown
in section10.0)
(EIA-364-56C, Procedure 6)
Appearance: no damage
19
Resistance to Wave
Soldering
THRU-HOLES
WAVE solder terminations
Sample to be mounted on pcb and
passed through oven according to
temperature profiles (shown in section
10.0)
Appearance: no bridging
20
Optional Crushed
Pegs Insertion Force
(For 201021 Only)
Mount connectors onto the board at a rate
of 25.4 mm/min.
(EIA-364-13D, Method A)
Insertion Force:
20 N
[MAXIMUM]
P1-P3P4-P6P7-P9P10-P11

2010212254

Mfr. #:
Buy 2010212254
Manufacturer:
Molex
Description:
CONN HEADER R/A 4POS 1.27MM
Lifecycle:
New from this manufacturer.
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