PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID
®
SHROUDED HEADERS
SHEET No.
A
ECM:
109684
7 of 11
DATE:
2016/11/17
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
2009890001
SCHEONG
GMENARLY
KHLIM
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
6.0 APPLICATION
6.1 PLACEMENT FORCE - CONNECTOR 201021 SERIES
For series 201021 with peg option, it is recommended to apply a minimum force of 20N onto a
mounting gauge to ensure crushed pegs are properly inserted into PCB holes
6.2 MOUNTING WEIGHT - CONNECTOR 201021 SERIES
For series 201021 without peg option, it is recommended to place a weight (>2g) on connector to
minimize the lifting of light weight connector by surface tension of solder paste
6.3 PCBA ORIENTATION TO OVEN - CONNECTOR 201021/201022 THROUGH-HOLE SERIES
It is recommended to place the connector on board in the following orientation before send the PCBA
assembly to wave soldering oven.
7.0 PACKAGING
Parts shall be packaged to protect against damage during handling, transit and storage.
Parts are packaged in bulk, tape and reel or tube, refer to Appropriate Sales Drawing and Packaging
Specification for specific information.
8.0 OTHERS
8.1 Although some discolouration could be seen on the soldertail after reflow, it does not impact on the
product’s performance.
8.2 Mating should be performed as close as possible to the mating axis for the delicate ckt sizes.
201021
201022
To Oven
To Oven
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID
®
SHROUDED HEADERS
SHEET No.
A
ECM:
109684
8 of 11
DATE:
2016/11/17
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
2009890001
SCHEONG
GMENARLY
KHLIM
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
9.0 TEST SEQUENCE
Sequential Tests Group
1
2
3
4
5
6
7
8
9.1
9.2
10
11
12
13
Test or Examination
Sample size
5
5
5
5
5
5
5
5
5
5
5
5
5
5
Resistance to Solder Heat
1
1
1
1
1
1
1
1
1
Resistance to Wave Soldering
1
Low Level Contact Resistance
(LLCR)
2, 5,
7
2, 5,
7, 9
2, 5,
7, 9
2, 4
2, 4
2, 4
3, 6
Insulation Resistance
2, 6
Dielectric Withstanding Voltage
3, 7
Connector Mate
2, 7
Connector Unmate
4, 8
Durability
3(a)
3(a)
3(a)
5
Crushed Pegs Insertion Force
1
Reseating
6
8
Vibration
6
Mechanical Shock
8
Thermal Shock
4
4
Temperature Life
4
4(a)
Cyclic Temperature & Humidity
6
5
Low Temperature Test
3
SO
2
gas (Gold plated)
3
Salt Spray
3
Pin Retention (in housing)
1
2
Solderability
1
Temperature Rise
1
Notes:
(a) Preconditioning
- Durability: 20cycles for gold plated
- Temperature life: duration is 48 hours.
PRODUCT SPECIFICATION
REVISION:
ECR/ECN INFORMATION:
TITLE:
PRODUCT SPECIFICATION
1.27mm PITCH SLIM-GRID
®
SHROUDED HEADERS
SHEET No.
A
ECM:
109684
9 of 11
DATE:
2016/11/17
CREATED / REVISED BY:
CHECKED BY:
APPROVED BY:
2009890001
SCHEONG
GMENARLY
KHLIM
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A4](V.2).DOC
10.0 REFLOW PROFILE
Lead-free reflow profile requirement for soldering heat resistance testing
Description
Requirement
Average Ramp Rate
3°C/sec Max
Preheat Temperature
150°C Min to 200°C Max
Preheat Time
60 to 180 sec
Ramp to Peak
3°C/sec Max
Time over Liquidus (217°C)
60 to 150 sec Max
Peak Temperature
260 0/-5°C
Time within 5°C of Peak
20 to 40 sec
Ramp - Cool Down
6°C/sec Max
Time 25 °C to Peak
8 Min Max

2010212254

Mfr. #:
Manufacturer:
Molex
Description:
CONN HEADER R/A 4POS 1.27MM
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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