MAX1638
High-Speed Step-Down Controller with
Synchronous Rectification for CPU Power
______________________________________________________________________________________ 13
Specifying the Inductor
Three key inductor parameters must be specified:
inductance value (L), peak current (I
PEAK
), and DC
resistance (R
DC
). The following equation includes a
constant LIR, which is the ratio of inductor peak-to-
peak AC current to DC load current. Typically LIR can
be between 0.1 to 0.5. A higher LIR value allows for
smaller inductors and better transient response, but
results in higher losses and output ripple. A good com-
promise between size and loss is a 30% ripple current
to load current ratio (LIR = 0.30), which corresponds to
a peak inductor current 1.15 times higher than the DC
load current.
where f is the switching frequency, between 300kHz and
1MHz; I
OUT
is the maximum DC load current; and LIR is
the ratio of AC to DC inductor current (typically 0.3). The
exact inductor value is not critical and can be adjusted to
make trade-offs among size, transient response, cost,
and efficiency. Although lower inductor values minimize
size and cost, they also reduce efficiency due to higher
peak currents. In general, higher inductor values
increase efficiency, but at some point resistive losses
due to extra turns of wire exceed the benefit gained from
lower AC current levels. Load-transient response can be
adversely affected by high inductor values, especially at
low (V
IN
- V
OUT
) differentials.
The peak inductor current at full load is 1.15 x I
OUT
if the
previous equation is used; otherwise, the peak current
can be calculated using the following equation:
The inductor’s DC resistance is a key parameter for effi-
cient performance, and should be less than the current-
sense resistor value.
Calculating the Current-Sense
Resistor Value
Calculate the current-sense resistor value according to
the worst-case minimum current-limit threshold voltage
(from the Electrical Characteristics) and the peak
inductor current required to service the maximum load.
II
VV V
fxLxV
PEAK OUT
OUT IN MAX OUT
OSC IN MAX
()
()
=+
()
2
L
VV V
V x f x I x LIR
OUT IN MAX OUT
IN MAX OSC OUT
()
()
=
()
Table 2. Output Voltage Adjustment
Settings
D3
0
D1
0
D2
0
D0
0
OUTPUT
VOLTAGE
(V)
2.050
COMPATIBILITY
0 0
D4
0 1 2.0000
0 10 0 1.950
0 10 1 1.900
0
0
0
0 01 0 1.850
0 01 1 1.800
Intel-compatible
DAC codes
0
0 11 0 1.750
0 11 1 1.700
0
0
0
1 00 0 1.650
1 00 1 1.6000
1 10 0 1.550
1 10 1 1.500
0
0
0
1 01 0 1.450
1 01 1 1.4000
1 11 0 1.350
1 11 1 1.300
Continuation of
50mV increment
to 1.3V
0
0
0
0 00 0 3.500
0 00 1 3.4001
0 10 0 3.300
0 10 1 3.200
1
1
1
0 01 0 3.100
0 01 1 3.0001
0 11 0 2.900
0 11 1 2.800
1
1
1
1 00 0 2.700
1 00 1 2.6001
1 10 0 2.500
1 10 1 2.400
1
1
1
1 01 0 2.300
1 01 1 2.2001
1 11 0 2.100
Intel-compatible
DAC codes
1 11 1 N/A Shutdown
1
1
1
AC LOAD-
REGULATION
ERROR
(%)
1
LG
CONNECTED
TO:
DC LOAD-
REGULATION
ERROR
(%)
REF 0.1
GND 0.05
V
CC
0.2
0.5
2
TYPICAL
A
E
(V
GAIN
/
I
GAIN
)
8
2
4
Table 3. LG Pin Adjustment Settings
MAX1638
High-Speed Step-Down Controller with
Synchronous Rectification for CPU Power
14 ______________________________________________________________________________________
Use I
PEAK
from the equation in the section Specifying
the Inductor.
The high inductance of standard wire-wound resistors
can degrade performance. Low-inductance resistors,
such as surface-mount power metal-strip resistors, are
preferred. The current-sense resistor’s power rating
should be higher than the following:
In high-current applications, connect several resistors
in parallel as necessary to obtain the desired resis-
tance and power rating.
Selecting the Output Filter Capacitor
Output filter capacitor values are generally determined
by effective series resistance (ESR) and voltage-
rating requirements, rather than by the actual capaci-
tance value required for loop stability. Due to the high
switching currents and demanding regulation require-
ments in a typical MAX1638 application, use only spe-
cialized low-ESR capacitors intended for switching-
regulator applications, such as Kemet T510, AVX TPS,
Sprague 595D, Sanyo OS-CON, or Sanyo GX series. Do
not use standard aluminum-electrolytic capacitors,
which can cause high output ripple and instability due
to high ESR. The output voltage ripple is usually domi-
nated by the filter capacitor’s ESR, and can be
approximated as I
RIPPLE
x R
ESR
. To ensure stability, the
capacitor must meet both minimum capacitance and
maximum ESR values as given in the following equations:
Compensating the Feedback Loop
The feedback loop needs proper compensation to pre-
vent excessive output ripple and poor efficiency
caused by instability. Compensation cancels unwanted
poles and zeros in the DC-DC converter’s transfer func-
tion that are due to the power-switching and filter ele-
ments with corresponding zeros and poles in the
feedback network. These compensation zeros and
poles are set by the compensation components CC1,
CC2, and RC1. The objective of compensation is to
ensure stability by ensuring that the DC-DC converter’s
phase shift is less than 180° by a safe margin, at the
frequency where the loop gain falls below unity.
Canceling the Sampling Pole
and Output Filter ESR Zero
Compensate the fast-voltage feedback loop by con-
necting a resistor and a capacitor in series from the
CC1 pin to AGND. The pole from CC1 can be set to
cancel the zero from the filter-capacitor ESR. Thus the
capacitor at CC1 should be as follows:
Resistor RC1 sets a zero that can be used to compen-
sate for the sampling pole generated by the switching
frequency. Set RC1 to the following:
The CC1 pin’s output resistance is 10kΩ.
Setting the Dominant Pole
and Canceling the Load and Output Filter Pole
Compensate the slow-voltage feedback loop by adding
a ceramic capacitor from the CC2 pin to AGND. This is
an integrator loop used to cancel out the DC load-
regulation error. Selection of capacitor CC2 sets the
dominant pole and a compensation zero. The zero is
typically used to cancel the unwanted pole generated
by the load and output filter capacitor at the maximum
load current. Select CC2 to place the zero close to or
slightly lower than the frequency of the unwanted pole,
as follows:
The transconductance of the integrator amplifier at CC2
is 1mmho. The voltage swing at CC2 is internally
clamped around 2.4V to 3V minimum and 4V to V
CC
maximum to improve transient response times. CC2
can source and sink up to 100µA.
Choosing the MOSFET Switches
The two high-current N-channel MOSFETs must be
logic-level types with guaranteed on-resistance specifi-
cations at V
GS
= 4.5V. Lower gate-threshold specs are
better (i.e., 2V max rather than 3V max). Gate charge
CC
mmho x C
x
V
I
OUT OUT
OUT MAX
2
1
4
()
=
RC
V
V
fxCC
OUT
IN
OSC
1
1
21
=
+
CC
CxR
k
OUT ESR
1
10
=
Ω
C
V
V
V
VxR xf
RR
OUT
REF
OUT
IN MIN
OUT SENSE OSC
ESR SENSE
()
>
+
<
1
P
mV
R
SENSE
SENSE
()
115
2
R
mV
I
SENSE
PEAK
=
85
MAX1638
High-Speed Step-Down Controller with
Synchronous Rectification for CPU Power
______________________________________________________________________________________ 15
should be less than 200nC to minimize switching losses
and reduce power dissipation.
I
2
R losses are the greatest heat contributor to MOSFET
power dissipation and are distributed between the
high- and low-side MOSFETs according to duty factor,
as follows:
Gate-charge losses are dissipated in the IC, and do not
heat the MOSFETs. Ensure that both MOSFETs are at a
safe junction temperature by calculating the temperature
rise according to package thermal-resistance specifica-
tions. The high-side MOSFET’s worst-case dissipation
occurs at the maximum output voltage and minimum
input voltage. For the low-side MOSFET, the worst case is
at the maximum input voltage when the output is short-
circuited (consider the duty factor to be 100%).
Calculating IC Power Dissipation
Power dissipation in the IC is dominated by average
gate-charge current into both MOSFETs. Average cur-
rent is approximately:
I
DD
= (Q
G1
+ Q
G2
) x f
OSC
where I
DD
is the drive current, Q
G
is the total gate
charge for each MOSFET, and f
OSC
is the switching
frequency.
Power dissipation of the IC is:
P
D
= I
CC
x V
CC
+ I
DD
x V
DD
where I
CC
is the quiescent supply current of the IC.
Junction temperature for the IC is primarily a function of
the PC board layout, since most of the heat is removed
through the traces connected to the pins and the
ground and power planes. A 24-pin SSOP on a typical
four-layer board with ground and power planes show
equivalent thermal impedance of about 60°C/W.
Junction temperature of the die is approximately:
T
J
= P
D
x θ
JA
+ T
A
where T
A
is the ambient temperature and θ
JA
is the
equivalent junction-to-ambient thermal impedance.
Selecting the Rectifier Diode
The rectifier diode D1 is a clamp that catches the nega-
tive inductor swing during the 30ns typical dead time
between turning off the high-side MOSFET and turning on
the low-side MOSFET synchronous rectifier. D1 must be a
Schottky diode, to prevent the MOSFET body diode from
conducting. It is acceptable to omit D1 and let the body
diode clamp the negative inductor swing, but efficiency
will drop about 1%. Use a 1N5819 diode for loads up to
3A, or a 1N5822 for loads up to 10A.
Adding the BST Supply Diode
and Capacitor
A signal diode, such as a 1N4148, works well for D2 in
most applications, although a low-leakage Schottky diode
provides slightly improved efficiency. Do not use large
power diodes, such as the 1N4001 or 1N5817. Exercise
caution in the selection of Schottky diodes, since some
types exhibit high reverse leakage at high operating tem-
peratures. Bypass BST to LX using a 0.1µF capacitor.
Selecting the Input Capacitors
Place a 0.1µF ceramic capacitor and 10µF capacitor
between V
CC
and AGND, as well as between V
DD
and
PGND, within 0.2 in. (5mm) of the V
CC
and V
DD
pins.
Select low-ESR input filter capacitors with a ripple-
current rating exceeding the RMS input ripple current,
connecting several capacitors in parallel if necessary.
RMS input ripple current is determined by the input
voltage and load current, with the worst-possible case
occurring at V
IN
= 2 x V
OUT
:
Choosing the GlitchCatcher MOSFETs
P-channel and N-channel switches and a series resistor
are required for the current-boost circuit (Figure 6).
Current through the MOSFETs and current-limiting
resistors must be sufficient to supply the load current,
with enough extra for prompt output regulation without
excessive overshoot. Design for boost-current values
1.5 times the maximum load current, and choose
MOSFETs and current-limiting resistors such that:
Gate resistors may be required to slow the transition
edges.
RR
VV
I
and
RR
V
I
DSON P MAX LIMIT
IN OUT
OUT MAX
DSON N MAX LIMIT
OUT
OUT MAX
,( )
()
,( )
()
.
.
+≈
+≈
15
15
II
VVV
V
I I when V V
RMS LOAD MAX
OUT IN OUT
IN
RMS OUT IN OUT
( )
/
()
=
==22
P low side I x R x
V
V
D LOAD DS ON
OUT
IN
( )
()
=−
2
1
P high side I x R x
V
V
D LOAD DS ON
OUT
IN
( )
()
=
2

MAX1638EAG

Mfr. #:
Manufacturer:
Maxim Integrated
Description:
Switching Controllers High-Speed Step-Down Controller with Synchronous Rectification for CPU Power
Lifecycle:
New from this manufacturer.
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