L6743, L6743Q Package mechanical data
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6 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK
®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
Package mechanical data L6743, L6743Q
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Figure 9. Package dimensions
Table 6. SO-8 mechanical data
Dim.
mm mils
Min Typ Max Min Typ Max
A 1.35 1.75 53.1 68.9
A1 0.10 0.25 3.9 9.8
A2 1.10 1.65 43.3 65.0
B 0.33 0.51 13.0 20.1
C 0.19 0.25 7.5 9.8
D
(1)
1. Dimensions D does not include mold flash, protru-sions or gate burrs. Mold flash, potrusions or gate burrs
shall not exceed 0.15mm (.006inch) in total (both side).
4.80 5.00
189.0 196.9
E 3.80 4.00 149.6 157.5
e 1.27 50.0
H 5.80 6.20 228.3 244.1
h 0.25 0.50 9.8 19.7
L 0.40 1.27 15.7 50.0
k 0° (min.), 8° (max.)
ddd 0.10 3.9
L6743, L6743Q Package mechanical data
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Figure 10. Package dimensions
Table 7. DFN10 mechanical data
Dim.
mm mils
Min Typ Max Min Typ Max
A 0.80 0.90 1.00 31.5 35.4 39.4
A1 0.02 0.05 0.8 2.0
A2 0.70 27.6
A3 0.20 7.9
b 0.18 0.23 0.30 7.1 9.1 11.8
D 3.00 118.1
D2 2.21 2.26 2.31 87.0 89.0 90.9
E 3.00 118.1
E2 1.49 1.64 1.74 58.7 64.6 68.5
e 0.50 19.7
L 0.3 0.4 0.5 11.8 15.7 19.7
M 0.75 29.5
m 0.25 9.8
M
m

2EDN7524GXTMA1

Mfr. #:
Manufacturer:
Infineon Technologies
Description:
Gate Drivers
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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