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2EDN7524GXTMA1
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P17
L6743, L6743Q
Package mechanica
l data
13/17
6
P
acka
g
e mechanical data
In order to meet en
vironmental requirements
, ST off
ers these de
vices in ECOP
ACK
®
pac
kages. T
hese pac
kages ha
v
e a lead-fre
e second le
vel int
erconnect. The ca
tegory of
second le
v
el interconnect is ma
rked on the pac
kage and on the inner bo
x label, in
compliance with JEDEC Standard
JESD97. The maximum ratin
gs related to soldering
conditions are also mark
ed on the inner bo
x label. ECOP
A
CK is an ST trademark.
ECOP
A
CK specifications are
av
ailable at:
www
.st.com
Package mechanica
l data
L6743, L6743Q
14/17
Figure 9.
P
ack
age dimensions
T
able 6.
SO-8 mechanica
l data
Dim.
mm
mils
Min
T
yp
Max
Min
T
yp
Max
A 1.35
1.75
53.1
68.9
A1 0.10
0.25
3.9
9.8
A2 1.10
1.65
43.3
65.0
B 0.33
0.51
13.0
20.1
C 0.19
0
.25
7.5
9.8
D
(1)
1.
Dimensions D does not include mold fl
ash, protru-sions or gate burrs. Mo
ld flash, potrusions or gate burrs
shall not exceed 0.15mm (.006inc
h) in total (both side).
4.80 5.00
189.0
196.9
E 3.80
4.00
149.6
157.5
e 1.27
50.0
H 5.80
6
.20
228
.3
244.1
h 0.25
0.50
9.8
19.7
L 0.40
1.27
15.7
50.0
k
0° (min.), 8° (max.)
ddd 0.10
3.9
L6743, L6743Q
Package mechanica
l data
15/17
Figure 10.
P
ack
age dimensions
T
able 7.
DFN10 mec
hanical data
Dim.
mm mils
Min
T
yp
Max
Min
T
yp
Max
A
0.80 0.90 1.00 31.5
35.4
39.4
A1 0.02
0.05 0.8
2.0
A2 0.70
27.6
A3 0.20
7.9
b
0.18 0.23 0.30
7.1
9.1
11.8
D 3.00
118.1
D2
2.21 2.26 2.31 87.0
89.0
90.9
E 3.00
118.1
E2
1
.49 1.64 1.74 58.7
64.6
68.5
e 0.50
19.7
L 0.3
0.4
0.5
11.8
15.7
19.7
M 0.75
29.5
m 0.25
9.8
M
m
P1-P3
P4-P6
P7-P9
P10-P12
P13-P15
P16-P17
2EDN7524GXTMA1
Mfr. #:
Buy 2EDN7524GXTMA1
Manufacturer:
Infineon Technologies
Description:
Gate Drivers
Lifecycle:
New from this manufacturer.
Delivery:
DHL
FedEx
Ups
TNT
EMS
Payment:
T/T
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